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Tektronix AFG31000
 
Tektronix Redefines the Arbitrary/Functi
LinkSwitch™-XT2
 
Power Integrations Unveils High-Efficien
Ingenia Ambition X 1.5T MR
 
Philips launches Ingenia Ambition X 1.5T
VOMA617A
 
VOMA617A AEC-Q101 Qualified Optocouplers
ISOCELL Slim 3P9
 
Samsung Makes Image Sensor Integration E
Samsung PRO Endurance
 
Samsung Electronics Redefines High Endur
SSD NVMe 970 PRO
 
Samsung Electronics Sets New Performance
CFast 2.0
 
Sony completes Pro memory card line-up w
DC Micro Motor
 
DC Micro Motor Series
AQZ202
 
High-power PhotoMOS relays: new AQZ type
HOME PAGE
50A or Dual 25A µModule Regulator 
50A or Dual 25A µModule Regulator
Linear Technology Corporation introduces the LTM4650, a dual 25A or single 50A output step-down µModule® regulator with onboard shielded inductors, MOSFETs and a dual DC/DC regulator IC housed in a small thermally enhanced plastic package. The device is offered in a 16mm x 16mm x 5.01mm BGA with a patented built-in heat sink. The heat sink, attached to the MOSFETs and inductors, rapidly moves heat from the interior of the package to the top, where the surface of the heat sink is exposed to air.
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Microchip Announces Four Low-Power Embedded Wi-Fi® Solutions for Growing IoT Market
New Devices Provide Complete Solutions for 802.11b/g/n Wi-Fi 2.4 GHz Band
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Microchip Announces Four Low-Power Embedded Wi-Fi® Solutions for Growing IoT Market
D1U54P-W-650-12-HBxC : Murata front end D1U54 series power supplies expand with high-density 650W model
D1U54P-W-650-12-HBxC : Murata front end D1U54 series power supplies expand with high-density 650W model
Murata has announced the D1U54P-W-650-12-HBxC series of 650 Watt power supplies manufactured by Murata Power Solutions. Packaged in an industry standard 1U format measuring 54.5 x 40 mm (2.15 x 1.57 inches), it has a length of only 228.6 mm (9 inches) compared to the 12-inch length of other power supplies in this family.
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WR-MM Series MiniModule Connectors - Wurth Electronics offers its WR-MM series IDC connectors used on wire-to-board, board-to-board, and permanent applications
Wurth Electronics' WR-MM series connectors are compact and low profile IDCs for ribbon cables with 1.27 mm pitch. The WR-MM feature contact numbers from 4- to 26-pins and offer cable, through-hole, SMD, or PCB types. WR-MM can be used on multiple applications as well, such as wire-to-board, board-to-board, and permanent.
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WR-MM Series MiniModule Connectors - Wurth Electronics offers its WR-MM series IDC connectors used on wire-to-board, board-to-board, and permanent applications
Cable Entry System (CES) Multigates - Phoenix Contact's CES product line expands with the addition of their low-cost multigates
Cable Entry System (CES) Multigates - Phoenix Contact's CES product line expands with the addition of their low-cost multigates
Phoenix Contact continues the expansion of its CES product line with the addition of their low-cost CES Multigates. These space-saving, panel feed-through, metal-reinforced cable entry plates offer a high degree of protection (IP66/67) by way of double-membrane sealing. Capable of handling up to 37 cables with an OD from 5 mm up to 60 mm, the CES Multigate product has a UL 94 V-0 flame rating and is oil-resistant (black material).
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Mouser, Intel, and Analog Devices Sponsor Create the Future Global Design Contest for Engineers
Mouser Electronics, Inc. is continuing its sponsorship of the 14th annual “Create the Future” Design Contest, a challenge to engineers and students worldwide to create the next great thing. Mouser’s valued supplier partners Intel® and Analog Devices, Inc. are joining in this sponsorship once again. The contest is produced by Tech Briefs Media Group, an SAE International Company.
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Mouser, Intel, and Analog Devices Sponsor Create the Future
CoolMOS™ CE in SOT-223 package as cost-effective drop-in replacement for DPAK
CoolMOS™ CE in SOT-223 package as cost-effective drop-in replacement for DPAK
Infineon Technologies is growing the portfolio of CoolMOS™ CE with a SOT-223 package. For Infineon’s CoolMOS, this package offers a cost effective alternative to DPAK as well as space savings in some designs with low power dissipation. The SOT-223 package without middle pin is fully compatible with a typical DPAK footprint and can be used as a drop-in replacement for DPAK. This new package targets customer designs in LED lighting and mobile charger applications.
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National Electronics Week, 12th-14th April 2016, Birmingham,UK
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National Electronics Week, 12th-14th April 2016, Birmingham,UK
Samsung Introduces Full Line-up of LED Components Based on Chip-Scale Packaging Technology Based on Chip-Scale Packaging Technology
Samsung Introduces Full Line-up of LED Components Based on Chip-Scale Packaging Technology Based on Chip-Scale Packaging Technology
Samsung Electronics, a world leader in advanced component solutions, introduced a full line-up of chip-scale LED packages* (CSP), including 0.6W-class and 3W-class packages, CSP arrays, and PoW (Phosphor on Wafer) packages.
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MOBILE WORLD CONGRESS SHANGHAI, 29.6.-1.7.2016
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MOBILE WORLD CONGRESS SHANGHAI, 29.6.-1.7.2016
SOS webinar - Extend the life of the power supply to the max
SOS webinar - Extend the life of the power supply to the max
Have you ever searched in datasheets or at supplier web for power supplies lifetime data? Probably without success. This webinar will provide you with more information about power supplies lifetime.
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Panasonic Starts to Deliver Thermal Sensing Solutions Using the Infrared Array Sensor "Grid-EYE"
Delivering thermal sensing solutions using IR array sensors is started. Since it enable high-precision and contactless thermal sensing they can be used in air conditioning, nursing and monitoring.
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Panasonic Starts to Deliver Thermal Sensing Solutions Using the Infrared Array Sensor "Grid-EYE"
Toshiba Announces Availability of High Capacity Enterprise and Data Center SATA SSDs
Toshiba Announces Availability of High Capacity Enterprise and Data Center SATA SSDs
The HK4 Series is Toshiba’s first enterprise SSD to embed 15nm MLC NAND flash memory for enterprise and data center applications
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Infineon enables new high-performance FPGA development platform
Infineon Technologies announced that its Digital Point-of-Load (PoL) DC-DC regulators with full PMBus capabilities are featured in the Kintex® UltraScale™ development board. A key driver for the design flexibility of the board is the superior PMBus connectivity of the IR3806x family. Configurations can be stored in internal memory. In addition, PMBus commands allow run-time control, fault status and telemetry.
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Infineon enables new high-performance FPGA development platform
Toshiba Image Recognition Processor Delivers Advanced Functionality for Monocular Cameras in ADAS Applications
Toshiba Image Recognition Processor Delivers Advanced Functionality for Monocular Cameras in ADAS Applications
Fourth-generation processor integrates new hardware accelerators and media processing units
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Toshiba Extends Potential Applications for Wireless Power Charging with 15W Transmitter IC
Small, efficient Qi-compliant device enables mobile and industrial wireless charging
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Toshiba Extends Potential Applications for Wireless Power Charging with 15W Transmitter IC
High connection density in the smallest of spaces
High connection density in the smallest of spaces
With the new DFMC 0,5 PCB connector from Phoenix Contact, up to 32 conductors can be connected on an overall height of just 10.5 mm. The connectors on a 2.54 mm grid provide a connection density that is up to 40 percent higher than connectors on a 3.5 mm grid
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Microchip Launches New LoRa® Module Designed for North American Low-Power Wide-Area Networks (LPWAN)
New RN2903 Wireless Modem is FCC Certified for Use in the 915 MHz Band
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Microchip Launches New LoRa® Module Designed for North American Low-Power Wide-Area Networks (LPWAN)
Company of the week

Taiwan Semiconductor
Address Book


SMA Solar Technology AG


Taiwan Semiconductor


ROHM Semiconductor


Pickering Interfaces Ltd


ANRITSU


Mouser Electronics


NEXPERIA


RS Components GmbH


Transfer Multisort Elektronik Sp. z o.o.


SECTRON


FAULHABER


Willow Technologies


ABB


ACS Motion Control


Visual Communications Company, LLC


Sonderhoff Holding GmbH


LASER COMPONENTS


LEM


Hradil Spezialkabel GmbH


Radio Frequency Systems


Apacer Technology Inc.


Pico Technology


AERCO


MENCOM


Analog Devices


HIROSE ELECTRIC CO., LTD


AVNET


LG Innotek


PANDUIT


GaN Systems
Calendary
SPS IPC Drives 2018, 26.-29.11.2018, Nuremberg, DE
NEPCON Japan, Tokyo, 16.-18.1.2019
SEMICON Korea, 23.-25.1.2019, Korea
30th Manufacturing World Tokio, JPN, 6.-8.2.2019
embedded world 2019, 26.-28.2019, Nuremberg, Germany
Middle East Electricity, Dubai, UAE, 5.-7.3.2019
PITTCON 2019, Philadelphia, USA, 17.-21.3.2019
AMPER 2019, Brno, CZ, 19.-22.3.2019
AUTOMATICON 2019, Warsaw, PL, 26.-29.3.2019
HANNOVER MESSE 2019, 1.-5.4.2019, DE
Hong Kong International Lighting Fair, 6.-9.4.2019
4th Manufacturing World Nagoya, JPN, 17.-19.4.2019
SENSOR+TEST 2018, 26.-29.6.2019, Nuremberg, DE
productronica 2019, Munich, DE, 12.-15.11.2019
Interesting video
The ISS Design Challenge ...
Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara
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