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Tektronix AFG31000
 
Tektronix Redefines the Arbitrary/Functi
LinkSwitch™-XT2
 
Power Integrations Unveils High-Efficien
Ingenia Ambition X 1.5T MR
 
Philips launches Ingenia Ambition X 1.5T
VOMA617A
 
VOMA617A AEC-Q101 Qualified Optocouplers
ISOCELL Slim 3P9
 
Samsung Makes Image Sensor Integration E
Samsung PRO Endurance
 
Samsung Electronics Redefines High Endur
SSD NVMe 970 PRO
 
Samsung Electronics Sets New Performance
CFast 2.0
 
Sony completes Pro memory card line-up w
DC Micro Motor
 
DC Micro Motor Series
AQZ202
 
High-power PhotoMOS relays: new AQZ type
HOME PAGE
Toshiba Launches Compact Bluetooth® Low Energy Communication IC for Scatternet Devices
Toshiba Launches Compact Bluetooth® Low Energy Communication IC for Scatternet Devices
Device housed in very thin chip-scale package supports communication for low-profile Bluetooth Smart applications
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SMD components SETS
When we started selling sets of SMD components in 1995 the company did not anticipate the large success this product achieved. By the end of 2009 we sold a few thousands sets of these components in the Czech Republic and Slovakia. The sets are primarily used by the research personnel of large as well as smaller companies, repairmen, small manufacturing companies, small dealers of electronic products, electroamateurs, schools and so on.
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SMD components SETS
New zip cord patch cables with OM1 fiber
New zip cord patch cables with OM1 fiber
Phoenix Contact is launching new zip cord patch cables for FO-based data cabling onto the market.
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[In-Depth Look] What’s Inside the Galaxy S7 and S7 edge
It takes the most cutting-edge engineering to get all of the innovations and functionality of the Galaxy S7 and S7 edge into their streamlined, glass-and-metal bodies. While adding water and dust resistance, a microSD card slot and other enhancements to its features, the Galaxy S7 has maintained its harmonious and refined design, in a light and compact form.
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[In-Depth Look] What’s Inside the Galaxy S7 and S7 edge
Samsung Elevates Mobile Phone Picture Quality with Dual Pixel Technology in its Newest Image Sensor
Samsung Elevates Mobile Phone Picture Quality with Dual Pixel Technology in its Newest Image Sensor
Samsung Electronics, a world leader in advanced semiconductor technology, announced its newest 12 megapixel (Mp) image sensor for smartphones, which will elevate the quality of mobile phone pictures. Already in mass production, this 1.4μm-pixel-based image sensor is equipped with Dual Pixel technology that has been reserved for DSLR cameras. The technology enables rapid auto-focus for fast photo shooting while producing premium image quality on mobile devices, even in low light situations.
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Can you choose the right display? Here are some hints which way to go ...
Which display is suitable for a given type of environment? Which interface to use? Touch panel yes or no? Even these are questions put my many developers at designing their applications.
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Can you choose the right display? Here are some hints which way to go ...
3M's FRB series is made primarily of inorganic materials that are easily converted to produce quality die-cut parts
3M's FRB series is made primarily of inorganic materials that are easily converted to produce quality die-cut parts
3M introduces the Flame Barrier FRB series for OEM electrical flame barrier applications. It is a thin, flexible insulation made primarily of inorganic materials that is easily converted. The FRB barrier provides the very high flammability and ignitability resistance, excellent arc and track resistance, good dielectric strength, and good thermal performance to safely contain electrical hazards.
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Fox Embedded Single Board Computer
VersaLogic's Fox is an excellent solution for industrial and medical applications that need a lower-power solution
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Fox Embedded Single Board Computer
NXP PCAL6524 Ultra-Low Voltage I/O Expanders
NXP PCAL6524 Ultra-Low Voltage I/O Expanders
NXP PCAL6524 Ultra-Low Voltage I/O Expanders provide remote I/O expansion for most microcontrollers using a Fast-mode Plus (Fm+) I2C-bus interface. The PCAL6524 24-bit general purpose I/O expanders have an ultra-low-voltage interface for direct connection to microcontrollers.
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KWS-A Series PCB-Mount Power Supplies - Single output 5 W to 25 W AC-DC PCB-mount power supplies from TDK-Lambda
TDK Corporation announces the KWS-A series of ultra-compact onboard type power supplies to be marketed under the TDK-Lambda brand. The lineup comprises four models rated for 5 W, 10 W, 15 W, and 25 W to meet a wide range of customer needs.
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KWS-A Series PCB-Mount Power Supplies - Single output 5 W to 25 W AC-DC PCB-mount power supplies from TDK-Lambda
Vicor Modules Support the Data Center Infrastructure Highlighted by Google at Open Compute Summit
Vicor Modules Support the Data Center Infrastructure Highlighted by Google at Open Compute Summit
Factorized Power Architecture Modules Enable Efficient 48V Direct-to-PoL (CPU, GPU, ASIC and DDR Memory) Solutions
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Infineon XMC Digital Power Explorer Kit
An excellent entry point into digital power control, featuring synchronous buck power board, two different control card options, on board restive load and full software support.
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Infineon XMC Digital Power Explorer Kit
Raspberry Pi 3 now available to order from RS Components and Allied Electronics
Raspberry Pi 3 now available to order from RS Components and Allied Electronics
Available from RS and Allied, the latest generation Raspberry Pi delivers 50% higher performance than Raspberry Pi 2, and integrates Bluetooth and wireless LAN communications technologies
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Samsung Introduces World’s Largest Capacity (15.36TB) SSD for Enterprise Storage Systems
Samsung Electronics, the world leader in advanced memory technology, announced that it is now shipping the industry’s largest solid state drive (SSD) – the “PM1633a,” a 15.36 terabyte (TB) drive.
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Samsung Introduces World’s Largest Capacity (15.36TB) SSD for Enterprise Storage Systems
Bosch to hire 14,000 university graduates 
Bosch to hire 14,000 university graduates
To stay on its growth course, Bosch plans to recruit some 14,000 university graduates worldwide this year. In the future, increasing numbers of software specialists will find jobs at the global supplier of technology and services.
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Panasonic Commercializes the Industry's First*1 Sulfur-free Encapsulation Molding Compound for Copper Wires
Commercialized a sulfur-free EMC for copper wires and the mass production will start in October 2016. It helps to improve the reliability of the semiconductor packages at high temperatures.
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Panasonic Commercializes the Industry's First*1 Sulfur-free Encapsulation Molding Compound for Copper Wires
Panasonic Photovoltaic Module Achieves World's Highest Energy Conversion Efficiency*1 of 23.8%*2 at Research Level
Panasonic Photovoltaic Module Achieves World's Highest Energy Conversion Efficiency*1 of 23.8%*2 at Research Level
Panasonic Corporation announced that it has achieved a photovoltaic module conversion efficiency of 23.8% (aperture area*3 : 11,562 cm²)at research level, a major increase over the previous world record for crystalline silicon-based photovoltaic modules.
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Pickering to Show Latest Switching Modules at AMPER 2016 in Brno, Czech Republic
Pickering Interfaces, a leading provider of signal switching and instrumentation solutions used in electronic test and simulation, will showcase their broad catalog of PXI, Ethernet LXI and PCI switching solutions at Amper, in Hall V, Booth 2.22 on March 15-18.
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Pickering to Show Latest Switching Modules at AMPER 2016 in Brno, Czech Republic
Company of the week

Taiwan Semiconductor
Address Book


SMA Solar Technology AG


Taiwan Semiconductor


ROHM Semiconductor


Pickering Interfaces Ltd


ANRITSU


Mouser Electronics


NEXPERIA


RS Components GmbH


Transfer Multisort Elektronik Sp. z o.o.


SECTRON


FAULHABER


Willow Technologies


ABB


ACS Motion Control


Visual Communications Company, LLC


Sonderhoff Holding GmbH


LASER COMPONENTS


LEM


Hradil Spezialkabel GmbH


Radio Frequency Systems


Apacer Technology Inc.


Pico Technology


AERCO


MENCOM


Analog Devices


HIROSE ELECTRIC CO., LTD


AVNET


LG Innotek


PANDUIT


GaN Systems
Calendary
SPS IPC Drives 2018, 26.-29.11.2018, Nuremberg, DE
NEPCON Japan, Tokyo, 16.-18.1.2019
SEMICON Korea, 23.-25.1.2019, Korea
30th Manufacturing World Tokio, JPN, 6.-8.2.2019
embedded world 2019, 26.-28.2019, Nuremberg, Germany
Middle East Electricity, Dubai, UAE, 5.-7.3.2019
PITTCON 2019, Philadelphia, USA, 17.-21.3.2019
AMPER 2019, Brno, CZ, 19.-22.3.2019
AUTOMATICON 2019, Warsaw, PL, 26.-29.3.2019
HANNOVER MESSE 2019, 1.-5.4.2019, DE
Hong Kong International Lighting Fair, 6.-9.4.2019
4th Manufacturing World Nagoya, JPN, 17.-19.4.2019
SENSOR+TEST 2018, 26.-29.6.2019, Nuremberg, DE
productronica 2019, Munich, DE, 12.-15.11.2019
Interesting video
The ISS Design Challenge ...
Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara
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