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Interesting video
Various
AR236.B & AR232.B
 
APAR AR236.B & AR232.B radio loggers
JZ-500 and JZ-500-C black
 
JZ-500 and JZ-500-C black cables manufac
HF41F
 
HF41F subminiature power relays from HON
GT-900B
 
GOLDTOOL toolsets in cases
Intel® Neural Compute Stick 2
 
RS Components announces availability of
MC4
 
MC4 solar connector sets
WIHA-SB24670
 
Multifunctional WIHA LED Torch
G2RV-SR
 
G2RV-SR interface relays from OMRON
LUP-20-LED
 
LUP-20-LED-SMD desktop magnifier
LinkSwitch™-XT2
 
Power Integrations Unveils High-Efficien
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Panasonic Starts to Deliver Thermal Sensing Solutions Using the Infrared Array Sensor "Grid-EYE"
Panasonic Starts to Deliver Thermal Sensing Solutions Using the Infrared Array Sensor "Grid-EYE"
Delivering thermal sensing solutions using IR array sensors is started. Since it enable high-precision and contactless thermal sensing they can be used in air conditioning, nursing and monitoring.
.....
Toshiba Announces Availability of High Capacity Enterprise and Data Center SATA SSDs
The HK4 Series is Toshiba’s first enterprise SSD to embed 15nm MLC NAND flash memory for enterprise and data center applications
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Toshiba Announces Availability of High Capacity Enterprise and Data Center SATA SSDs
Infineon enables new high-performance FPGA development platform
Infineon enables new high-performance FPGA development platform
Infineon Technologies announced that its Digital Point-of-Load (PoL) DC-DC regulators with full PMBus capabilities are featured in the Kintex® UltraScale™ development board. A key driver for the design flexibility of the board is the superior PMBus connectivity of the IR3806x family. Configurations can be stored in internal memory. In addition, PMBus commands allow run-time control, fault status and telemetry.
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Toshiba Image Recognition Processor Delivers Advanced Functionality for Monocular Cameras in ADAS Applications
Fourth-generation processor integrates new hardware accelerators and media processing units
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Toshiba Image Recognition Processor Delivers Advanced Functionality for Monocular Cameras in ADAS Applications
Toshiba Extends Potential Applications for Wireless Power Charging with 15W Transmitter IC
Toshiba Extends Potential Applications for Wireless Power Charging with 15W Transmitter IC
Small, efficient Qi-compliant device enables mobile and industrial wireless charging
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High connection density in the smallest of spaces
With the new DFMC 0,5 PCB connector from Phoenix Contact, up to 32 conductors can be connected on an overall height of just 10.5 mm. The connectors on a 2.54 mm grid provide a connection density that is up to 40 percent higher than connectors on a 3.5 mm grid
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High connection density in the smallest of spaces
Microchip Launches New LoRa® Module Designed for North American Low-Power Wide-Area Networks (LPWAN)
Microchip Launches New LoRa® Module Designed for North American Low-Power Wide-Area Networks (LPWAN)
New RN2903 Wireless Modem is FCC Certified for Use in the 915 MHz Band
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Toshiba Launches Compact Bluetooth® Low Energy Communication IC for Scatternet Devices
Device housed in very thin chip-scale package supports communication for low-profile Bluetooth Smart applications
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Toshiba Launches Compact Bluetooth® Low Energy Communication IC for Scatternet Devices
SMD components SETS
SMD components SETS
When we started selling sets of SMD components in 1995 the company did not anticipate the large success this product achieved. By the end of 2009 we sold a few thousands sets of these components in the Czech Republic and Slovakia. The sets are primarily used by the research personnel of large as well as smaller companies, repairmen, small manufacturing companies, small dealers of electronic products, electroamateurs, schools and so on.
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New zip cord patch cables with OM1 fiber
Phoenix Contact is launching new zip cord patch cables for FO-based data cabling onto the market.
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New zip cord patch cables with OM1 fiber
[In-Depth Look] What’s Inside the Galaxy S7 and S7 edge
[In-Depth Look] What’s Inside the Galaxy S7 and S7 edge
It takes the most cutting-edge engineering to get all of the innovations and functionality of the Galaxy S7 and S7 edge into their streamlined, glass-and-metal bodies. While adding water and dust resistance, a microSD card slot and other enhancements to its features, the Galaxy S7 has maintained its harmonious and refined design, in a light and compact form.
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Samsung Elevates Mobile Phone Picture Quality with Dual Pixel Technology in its Newest Image Sensor
Samsung Electronics, a world leader in advanced semiconductor technology, announced its newest 12 megapixel (Mp) image sensor for smartphones, which will elevate the quality of mobile phone pictures. Already in mass production, this 1.4μm-pixel-based image sensor is equipped with Dual Pixel technology that has been reserved for DSLR cameras. The technology enables rapid auto-focus for fast photo shooting while producing premium image quality on mobile devices, even in low light situations.
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Samsung Elevates Mobile Phone Picture Quality with Dual Pixel Technology in its Newest Image Sensor
Can you choose the right display? Here are some hints which way to go ...
Can you choose the right display? Here are some hints which way to go ...
Which display is suitable for a given type of environment? Which interface to use? Touch panel yes or no? Even these are questions put my many developers at designing their applications.
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3M's FRB series is made primarily of inorganic materials that are easily converted to produce quality die-cut parts
3M introduces the Flame Barrier FRB series for OEM electrical flame barrier applications. It is a thin, flexible insulation made primarily of inorganic materials that is easily converted. The FRB barrier provides the very high flammability and ignitability resistance, excellent arc and track resistance, good dielectric strength, and good thermal performance to safely contain electrical hazards.
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3M's FRB series is made primarily of inorganic materials that are easily converted to produce quality die-cut parts
Fox Embedded Single Board Computer
Fox Embedded Single Board Computer
VersaLogic's Fox is an excellent solution for industrial and medical applications that need a lower-power solution
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NXP PCAL6524 Ultra-Low Voltage I/O Expanders
NXP PCAL6524 Ultra-Low Voltage I/O Expanders provide remote I/O expansion for most microcontrollers using a Fast-mode Plus (Fm+) I2C-bus interface. The PCAL6524 24-bit general purpose I/O expanders have an ultra-low-voltage interface for direct connection to microcontrollers.
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NXP PCAL6524 Ultra-Low Voltage I/O Expanders
KWS-A Series PCB-Mount Power Supplies - Single output 5 W to 25 W AC-DC PCB-mount power supplies from TDK-Lambda
KWS-A Series PCB-Mount Power Supplies - Single output 5 W to 25 W AC-DC PCB-mount power supplies from TDK-Lambda
TDK Corporation announces the KWS-A series of ultra-compact onboard type power supplies to be marketed under the TDK-Lambda brand. The lineup comprises four models rated for 5 W, 10 W, 15 W, and 25 W to meet a wide range of customer needs.
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Vicor Modules Support the Data Center Infrastructure Highlighted by Google at Open Compute Summit
Factorized Power Architecture Modules Enable Efficient 48V Direct-to-PoL (CPU, GPU, ASIC and DDR Memory) Solutions
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Vicor Modules Support the Data Center Infrastructure Highlighted by Google at Open Compute Summit
Company of the week

TE Connectivity
Address Book


SMA Solar Technology AG


TE Connectivity


akYtec GmbH


SOS electronic s.r.o.


MARVELL


Taiwan Semiconductor


ROHM Semiconductor


Pickering Interfaces Ltd


ANRITSU


Mouser Electronics


NEXPERIA


RS Components GmbH


Transfer Multisort Elektronik Sp. z o.o.


SECTRON


FAULHABER


Willow Technologies


ABB


ACS Motion Control


Visual Communications Company, LLC


Sonderhoff Holding GmbH


LASER COMPONENTS


LEM


Hradil Spezialkabel GmbH


Radio Frequency Systems


Apacer Technology Inc.


Pico Technology


AERCO


MENCOM


Analog Devices


HIROSE ELECTRIC CO., LTD
Calendary
MWC Shanghai 2019, 26.6.-28.6.2019
SENSOR+TEST 2018, 26.-29.6.2019, Nuremberg, DE
NEPCON Japan, Nagoya, 18.9.-20.9.2019
SEMICON TAIWAN, Taipei, 18.9.-20.9.2019
BATTERY JAPAN, Osaka, 25.9.-27.9.2019
electronicAsia 2019, Hong Kong, 13.10.-16.10.2019
Hong Kong Electronics Fair, 13.10.-16.10.2019
productronica 2019, Munich, DE, 12.-15.11.2019
NEPCON Japan, Tokio, 15.1.-17.1.2020
DistribuTECH, 28.1.-30.1.2020, San Antonio, TX
BATTERY JAPAN, Tokyo, 26.2.-28.2.2020
BATTERY JAPAN, Osaka, 9.9.-11.9.2020
IMTS2020, 14.9.-19.9.2020, Chicago, IL
ISE 2021, Barcelona, Spain, 2.2.-5.2.2021
DistribuTECH, 9.2.-11.2.2021, San Diego, CA
BATTERY JAPAN, Tokyo, 3.3.-5.3.2021
BATTERY JAPAN, Osaka, 29.9.-1.10.2021
DistribuTECH, 25.1.-27.1.2022, Dallas, TX
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX
Interesting video
The ISS Design Challenge ...
Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara
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