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Various
AR236.B & AR232.B
 
APAR AR236.B & AR232.B radio loggers
JZ-500 and JZ-500-C black
 
JZ-500 and JZ-500-C black cables manufac
HF41F
 
HF41F subminiature power relays from HON
GT-900B
 
GOLDTOOL toolsets in cases
Intel® Neural Compute Stick 2
 
RS Components announces availability of
MC4
 
MC4 solar connector sets
WIHA-SB24670
 
Multifunctional WIHA LED Torch
G2RV-SR
 
G2RV-SR interface relays from OMRON
LUP-20-LED
 
LUP-20-LED-SMD desktop magnifier
LinkSwitch™-XT2
 
Power Integrations Unveils High-Efficien
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50A or Dual 25A µModule Regulator 
50A or Dual 25A µModule Regulator
Linear Technology Corporation introduces the LTM4650, a dual 25A or single 50A output step-down µModule® regulator with onboard shielded inductors, MOSFETs and a dual DC/DC regulator IC housed in a small thermally enhanced plastic package. The device is offered in a 16mm x 16mm x 5.01mm BGA with a patented built-in heat sink. The heat sink, attached to the MOSFETs and inductors, rapidly moves heat from the interior of the package to the top, where the surface of the heat sink is exposed to air.
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WR-MM Series MiniModule Connectors - Wurth Electronics offers its WR-MM series IDC connectors used on wire-to-board, board-to-board, and permanent applications
Wurth Electronics' WR-MM series connectors are compact and low profile IDCs for ribbon cables with 1.27 mm pitch. The WR-MM feature contact numbers from 4- to 26-pins and offer cable, through-hole, SMD, or PCB types. WR-MM can be used on multiple applications as well, such as wire-to-board, board-to-board, and permanent.
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WR-MM Series MiniModule Connectors - Wurth Electronics offers its WR-MM series IDC connectors used on wire-to-board, board-to-board, and permanent applications
Microchip Announces Four Low-Power Embedded Wi-Fi® Solutions for Growing IoT Market
Microchip Announces Four Low-Power Embedded Wi-Fi® Solutions for Growing IoT Market
New Devices Provide Complete Solutions for 802.11b/g/n Wi-Fi 2.4 GHz Band
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Cable Entry System (CES) Multigates - Phoenix Contact's CES product line expands with the addition of their low-cost multigates
Phoenix Contact continues the expansion of its CES product line with the addition of their low-cost CES Multigates. These space-saving, panel feed-through, metal-reinforced cable entry plates offer a high degree of protection (IP66/67) by way of double-membrane sealing. Capable of handling up to 37 cables with an OD from 5 mm up to 60 mm, the CES Multigate product has a UL 94 V-0 flame rating and is oil-resistant (black material).
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Cable Entry System (CES) Multigates - Phoenix Contact's CES product line expands with the addition of their low-cost multigates
Mouser, Intel, and Analog Devices Sponsor Create the Future
Mouser, Intel, and Analog Devices Sponsor Create the Future Global Design Contest for Engineers
Mouser Electronics, Inc. is continuing its sponsorship of the 14th annual “Create the Future” Design Contest, a challenge to engineers and students worldwide to create the next great thing. Mouser’s valued supplier partners Intel® and Analog Devices, Inc. are joining in this sponsorship once again. The contest is produced by Tech Briefs Media Group, an SAE International Company.
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CoolMOS™ CE in SOT-223 package as cost-effective drop-in replacement for DPAK
Infineon Technologies is growing the portfolio of CoolMOS™ CE with a SOT-223 package. For Infineon’s CoolMOS, this package offers a cost effective alternative to DPAK as well as space savings in some designs with low power dissipation. The SOT-223 package without middle pin is fully compatible with a typical DPAK footprint and can be used as a drop-in replacement for DPAK. This new package targets customer designs in LED lighting and mobile charger applications.
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CoolMOS™ CE in SOT-223 package as cost-effective drop-in replacement for DPAK
National Electronics Week, 12th-14th April 2016, Birmingham,UK
National Electronics Week, 12th-14th April 2016, Birmingham,UK
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MOBILE WORLD CONGRESS SHANGHAI, 29.6.-1.7.2016
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MOBILE WORLD CONGRESS SHANGHAI, 29.6.-1.7.2016
Samsung Introduces Full Line-up of LED Components Based on Chip-Scale Packaging Technology Based on Chip-Scale Packaging Technology
Samsung Introduces Full Line-up of LED Components Based on Chip-Scale Packaging Technology Based on Chip-Scale Packaging Technology
Samsung Electronics, a world leader in advanced component solutions, introduced a full line-up of chip-scale LED packages* (CSP), including 0.6W-class and 3W-class packages, CSP arrays, and PoW (Phosphor on Wafer) packages.
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SOS webinar - Extend the life of the power supply to the max
Have you ever searched in datasheets or at supplier web for power supplies lifetime data? Probably without success. This webinar will provide you with more information about power supplies lifetime.
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SOS webinar - Extend the life of the power supply to the max
Panasonic Starts to Deliver Thermal Sensing Solutions Using the Infrared Array Sensor "Grid-EYE"
Panasonic Starts to Deliver Thermal Sensing Solutions Using the Infrared Array Sensor "Grid-EYE"
Delivering thermal sensing solutions using IR array sensors is started. Since it enable high-precision and contactless thermal sensing they can be used in air conditioning, nursing and monitoring.
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Toshiba Announces Availability of High Capacity Enterprise and Data Center SATA SSDs
The HK4 Series is Toshiba’s first enterprise SSD to embed 15nm MLC NAND flash memory for enterprise and data center applications
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Toshiba Announces Availability of High Capacity Enterprise and Data Center SATA SSDs
Infineon enables new high-performance FPGA development platform
Infineon enables new high-performance FPGA development platform
Infineon Technologies announced that its Digital Point-of-Load (PoL) DC-DC regulators with full PMBus capabilities are featured in the Kintex® UltraScale™ development board. A key driver for the design flexibility of the board is the superior PMBus connectivity of the IR3806x family. Configurations can be stored in internal memory. In addition, PMBus commands allow run-time control, fault status and telemetry.
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Toshiba Image Recognition Processor Delivers Advanced Functionality for Monocular Cameras in ADAS Applications
Fourth-generation processor integrates new hardware accelerators and media processing units
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Toshiba Image Recognition Processor Delivers Advanced Functionality for Monocular Cameras in ADAS Applications
Toshiba Extends Potential Applications for Wireless Power Charging with 15W Transmitter IC
Toshiba Extends Potential Applications for Wireless Power Charging with 15W Transmitter IC
Small, efficient Qi-compliant device enables mobile and industrial wireless charging
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High connection density in the smallest of spaces
With the new DFMC 0,5 PCB connector from Phoenix Contact, up to 32 conductors can be connected on an overall height of just 10.5 mm. The connectors on a 2.54 mm grid provide a connection density that is up to 40 percent higher than connectors on a 3.5 mm grid
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High connection density in the smallest of spaces
Microchip Launches New LoRa® Module Designed for North American Low-Power Wide-Area Networks (LPWAN)
Microchip Launches New LoRa® Module Designed for North American Low-Power Wide-Area Networks (LPWAN)
New RN2903 Wireless Modem is FCC Certified for Use in the 915 MHz Band
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Toshiba Launches Compact Bluetooth® Low Energy Communication IC for Scatternet Devices
Device housed in very thin chip-scale package supports communication for low-profile Bluetooth Smart applications
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Toshiba Launches Compact Bluetooth® Low Energy Communication IC for Scatternet Devices
Company of the week

TE Connectivity
Address Book


SMA Solar Technology AG


TE Connectivity


akYtec GmbH


SOS electronic s.r.o.


MARVELL


Taiwan Semiconductor


ROHM Semiconductor


ČEZ a.s.


Pickering Interfaces Ltd


ANRITSU


Mouser Electronics


NEXPERIA


RS Components GmbH


Transfer Multisort Elektronik Sp. z o.o.


SECTRON


FAULHABER


Willow Technologies


ABB


ACS Motion Control


Visual Communications Company, LLC


Sonderhoff Holding GmbH


LASER COMPONENTS


LEM


Hradil Spezialkabel GmbH


Radio Frequency Systems


Apacer Technology Inc.


Pico Technology


AERCO


MENCOM


Analog Devices
Calendary
NEPCON Japan, Nagoya, 18.9.-20.9.2019
SEMICON TAIWAN, Taipei, 18.9.-20.9.2019
BATTERY JAPAN, Osaka, 25.9.-27.9.2019
electronicAsia 2019, Hong Kong, 13.10.-16.10.2019
Hong Kong Electronics Fair, 13.10.-16.10.2019
TAITRONICS 2019, Taipei, Taiwan, 16.10.-18.10.2019
productronica 2019, Munich, DE, 12.-15.11.2019
NEPCON Japan, Tokio, 15.1.-17.1.2020
DistribuTECH, 28.1.-30.1.2020, San Antonio, TX
BATTERY JAPAN, Tokyo, 26.2.-28.2.2020
BATTERY JAPAN, Osaka, 9.9.-11.9.2020
IMTS2020, 14.9.-19.9.2020, Chicago, IL
ISE 2021, Barcelona, Spain, 2.2.-5.2.2021
DistribuTECH, 9.2.-11.2.2021, San Diego, CA
BATTERY JAPAN, Tokyo, 3.3.-5.3.2021
BATTERY JAPAN, Osaka, 29.9.-1.10.2021
DistribuTECH, 25.1.-27.1.2022, Dallas, TX
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX
Interesting video
The ISS Design Challenge ...
Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara
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