Address Book
 

Microchip Technology Inc.
 

EM Microelectronic
 

Murata Power Solutions Inc
 

Advantech
 

Keysight Technologies
 

XP Power Limited
 

Yamaichi Electronics USA Inc.
 

Fischer Connectors SA
 

Nicomatic
 

TE Connectivity
 

akYtec GmbH
 

SOS electronic s.r.o.
 

MARVELL
 

Taiwan Semiconductor
 

ROHM Semiconductor
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T5808
 
TDK announces world’s first MIPI standar
Portable SSD T7 Touch
 
Samsung Releases Portable SSD T7 Touch –
AR236.B & AR232.B
 
APAR AR236.B & AR232.B radio loggers
JZ-500 and JZ-500-C black
 
JZ-500 and JZ-500-C black cables manufac
HF41F
 
HF41F subminiature power relays from HON
GT-900B
 
GOLDTOOL toolsets in cases
Intel® Neural Compute Stick 2
 
RS Components announces availability of
MC4
 
MC4 solar connector sets
WIHA-SB24670
 
Multifunctional WIHA LED Torch
G2RV-SR
 
G2RV-SR interface relays from OMRON
HOME PAGE
Airflow Monitor Kit - Orion Fans' airflow monitor kit comes completely assembled for easy installation
Airflow Monitor Kit - Orion Fans' airflow monitor kit comes completely assembled for easy installation
Orion Fans’ airflow monitor kit is a complete, cost-effective airflow monitoring system that is easy to install. The AFM-KIT includes an AFM-01NC airflow module, mounting clip, three plastic guards (80 mm, 92 mm, and 120 mm), buzzer, LED, and holder, switch, and wall-mounted power supply. The kit comes completely assembled in a 10’ cable assembly for easy installation. The AFM module operates an optical LED and/or audible alarm when airflow falls below 8.2 ft./s due to fan filter clogs, foreign objects coming in contact with the fan blade, or fan failure. Field retrofittable for AC or DC fan/blower applications, the AFM-KIT protects components like power supplies, PoE midspans, and displays in sensitive equipment including servers, telecom switches, medical equipment, and kiosks.
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Samsung Adds Advanced Color Quality Features to its Small LES, Chip-on-Board LED Solutions for Premium Commercial LED Lighting
Samsung Electronics, a world leader in advanced component solutions, introduced new color quality improvements for its small LES* (light-emitting surface) chip-on-board (COB**) package LC series: LC010, LC020 and LC040. The improvements are based on “Vivid” color technology that has been optimized for high color quality LED lighting especially for use in premium commercial lighting applications.
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Samsung Adds Advanced Color Quality Features to its Small LES, Chip-on-Board LED Solutions for Premium Commercial LED Lighting
IFL Series Flexield Magnetic Sheets - TDK offers its flexible IFL series magnetic noise suppression sheets for thin and compact devices
IFL Series Flexield Magnetic Sheets - TDK offers its flexible IFL series magnetic noise suppression sheets for thin and compact devices
TDK’s IFL series Flexield products are highly flexible, shock-resistant noise suppression sheets made of soft magnetic material and resin. Electromagnetic waves are converted to thermal energy by natural resonance in the soft magnetic materials contained in the sheet. This prevents the electromagnetic waves from being transmitted through the shield, or reflects the waves internally. With an extensive lineup of products that deliver excellent permeability, Flexield allows designers to match impedance with ease and delivers excellent magnetic convergence.
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Measurements of Lower-Temperature, Outdoor and Industrial Applications Achieve - Greater Accuracy With Microchip’s MCP990X Multi-Channel Temp Sensor Family
Remote Diode Measurement With Resistance Error Correction Enables Accurate Readings of Up to 20 Inches Away From the IC
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Measurements of Lower-Temperature, Outdoor and Industrial Applications Achieve - Greater Accuracy With Microchip’s MCP990X Multi-Channel Temp Sensor Family 
RF Digital RFD77101 Simblee BLE Module
RF Digital RFD77101 Simblee BLE Module
RF Digital RFD77101 Simblee™ Bluetooth® Low Energy (BLE) Module is offered as a 10x7x2mm professional-grade radio transceiver with a built-in ARM Cortex M0 microcontroller (MCU) and Bluetooth Smart engine. Simblee is designed as an IoT for connecting Everyone and Everything (IoT4EE) development environment.
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NCP81074 High-Speed Low-Side MOSFET Driver - ON Semiconductor's NCP81074 high-speed, low-side MOSFET driver is capable of sinking and sourcing up to 10 A
ON Semiconductor's NCP81074 is a single-channel, low-side MOSFET driver capable of sinking and sourcing up to 10 A. This driver can deliver 7 A peak current at the Miller plateau region to overcome the Miller effect with MOSFETs during switching. Split output configurations allow the ability to adjust the on and off slew rates. The parts are offered in a SOIC8 and 2 mm x 2 mm DFN package.
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NCP81074 High-Speed Low-Side MOSFET Driver - ON Semiconductor's NCP81074 high-speed, low-side MOSFET driver is capable of sinking and sourcing up to 10 A
G8V Micro 280 Automotive Relays - Omron offers its automotive micro 280 terminal type relays in a miniaturized package
G8V Micro 280 Automotive Relays - Omron offers its automotive micro 280 terminal type relays in a miniaturized package
Omron's G8V micro 280 relays are an ISO 280 footprint used in most modern automotive vehicles today. Featuring either SPST or STDT layouts, these low profile automotive relays are capable of switching 20 A resistive on the normally open contact with a 60 A inrush. These relays are designed for fuel pumps, windshield wipers, blowers and climate controls, and seating controls.
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50A or Dual 25A µModule Regulator
Linear Technology Corporation introduces the LTM4650, a dual 25A or single 50A output step-down µModule® regulator with onboard shielded inductors, MOSFETs and a dual DC/DC regulator IC housed in a small thermally enhanced plastic package. The device is offered in a 16mm x 16mm x 5.01mm BGA with a patented built-in heat sink. The heat sink, attached to the MOSFETs and inductors, rapidly moves heat from the interior of the package to the top, where the surface of the heat sink is exposed to air.
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50A or Dual 25A µModule Regulator 
Microchip Announces Four Low-Power Embedded Wi-Fi® Solutions for Growing IoT Market
Microchip Announces Four Low-Power Embedded Wi-Fi® Solutions for Growing IoT Market
New Devices Provide Complete Solutions for 802.11b/g/n Wi-Fi 2.4 GHz Band
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WR-MM Series MiniModule Connectors - Wurth Electronics offers its WR-MM series IDC connectors used on wire-to-board, board-to-board, and permanent applications
Wurth Electronics' WR-MM series connectors are compact and low profile IDCs for ribbon cables with 1.27 mm pitch. The WR-MM feature contact numbers from 4- to 26-pins and offer cable, through-hole, SMD, or PCB types. WR-MM can be used on multiple applications as well, such as wire-to-board, board-to-board, and permanent.
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WR-MM Series MiniModule Connectors - Wurth Electronics offers its WR-MM series IDC connectors used on wire-to-board, board-to-board, and permanent applications
Cable Entry System (CES) Multigates - Phoenix Contact's CES product line expands with the addition of their low-cost multigates
Cable Entry System (CES) Multigates - Phoenix Contact's CES product line expands with the addition of their low-cost multigates
Phoenix Contact continues the expansion of its CES product line with the addition of their low-cost CES Multigates. These space-saving, panel feed-through, metal-reinforced cable entry plates offer a high degree of protection (IP66/67) by way of double-membrane sealing. Capable of handling up to 37 cables with an OD from 5 mm up to 60 mm, the CES Multigate product has a UL 94 V-0 flame rating and is oil-resistant (black material).
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Mouser, Intel, and Analog Devices Sponsor Create the Future Global Design Contest for Engineers
Mouser Electronics, Inc. is continuing its sponsorship of the 14th annual “Create the Future” Design Contest, a challenge to engineers and students worldwide to create the next great thing. Mouser’s valued supplier partners Intel® and Analog Devices, Inc. are joining in this sponsorship once again. The contest is produced by Tech Briefs Media Group, an SAE International Company.
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Mouser, Intel, and Analog Devices Sponsor Create the Future
CoolMOS™ CE in SOT-223 package as cost-effective drop-in replacement for DPAK
CoolMOS™ CE in SOT-223 package as cost-effective drop-in replacement for DPAK
Infineon Technologies is growing the portfolio of CoolMOS™ CE with a SOT-223 package. For Infineon’s CoolMOS, this package offers a cost effective alternative to DPAK as well as space savings in some designs with low power dissipation. The SOT-223 package without middle pin is fully compatible with a typical DPAK footprint and can be used as a drop-in replacement for DPAK. This new package targets customer designs in LED lighting and mobile charger applications.
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National Electronics Week, 12th-14th April 2016, Birmingham,UK
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National Electronics Week, 12th-14th April 2016, Birmingham,UK
MOBILE WORLD CONGRESS SHANGHAI, 29.6.-1.7.2016
MOBILE WORLD CONGRESS SHANGHAI, 29.6.-1.7.2016
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Samsung Introduces Full Line-up of LED Components Based on Chip-Scale Packaging Technology Based on Chip-Scale Packaging Technology
Samsung Electronics, a world leader in advanced component solutions, introduced a full line-up of chip-scale LED packages* (CSP), including 0.6W-class and 3W-class packages, CSP arrays, and PoW (Phosphor on Wafer) packages.
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Samsung Introduces Full Line-up of LED Components Based on Chip-Scale Packaging Technology Based on Chip-Scale Packaging Technology
SOS webinar - Extend the life of the power supply to the max
SOS webinar - Extend the life of the power supply to the max
Have you ever searched in datasheets or at supplier web for power supplies lifetime data? Probably without success. This webinar will provide you with more information about power supplies lifetime.
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Panasonic Starts to Deliver Thermal Sensing Solutions Using the Infrared Array Sensor "Grid-EYE"
Delivering thermal sensing solutions using IR array sensors is started. Since it enable high-precision and contactless thermal sensing they can be used in air conditioning, nursing and monitoring.
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Panasonic Starts to Deliver Thermal Sensing Solutions Using the Infrared Array Sensor "Grid-EYE"
Company of the week

Microchip Technology Inc.
Interesting video


How Do You Minimize Bubbles in a Two Part Epoxy System?


Adafruit Partners with Panasonic


Computer-On-Modules are world-leading platforms for embedded system designs


Ghostbuster's Theme on eight floppy drives


Darude - Sandstorm on Eight Floppy Drives
Address Book


Microchip Technology Inc.


EM Microelectronic


Murata Power Solutions Inc


Advantech


Keysight Technologies


XP Power Limited


Yamaichi Electronics USA Inc.


Fischer Connectors SA


Nicomatic


TE Connectivity


akYtec GmbH


SOS electronic s.r.o.


MARVELL


Taiwan Semiconductor


ROHM Semiconductor


ČEZ a.s.


Pickering Interfaces Ltd


ANRITSU


Mouser Electronics


NEXPERIA


RS Components GmbH


Transfer Multisort Elektronik Sp. z o.o.


SECTRON


FAULHABER


Willow Technologies


ABB


ACS Motion Control


Visual Communications Company, LLC


Sonderhoff Holding GmbH


LASER COMPONENTS
Calendary
Intersec 2020, Dubai, UAE, 19.1.-21.1.2020
DistribuTECH, 28.1.-30.1.2020, San Antonio, TX
APEX EXPO 2020, San Diego, 4.2.-6.2.2020
embedded world 2020, Nuremberg, 25.2.-27.2.2020
BATTERY JAPAN, Tokyo, 26.2.-28.2.2020
Light + Building, Frankfurt am Main, 8.3.-13.3.2020
AMPER 2020, Brno, CZ, 17.3.-20.3.2020
SECUTECH 2020, Taipei, 22.4.-24.4.2020
SMTconnect 2020, Nuremberg, 5.5.-7.5.2020
PCIM Europe, Nuremberg, 5.5.-7.5.2020
LED Expo Mumbai 2020, 7.5.-9.5.2020
SPS Italia, Fiere di Parma, 26.5.-28.5.2020
Wire & Cable Guangzhou, China, 27.5.-29.5.2020
Automechanika Dubai, 7.6.-9.7.2020
hardware+tools, Dubai, UAE, 7.6.-9.6.2020
ELEKTRO 2020, MOSCOW, Russia, 8.6.-11.6.2020
PCIM Asia, Shanghai, 1.7.-3.7.2020
SPS Automation Middle East, Dubai, 20.8.-21.8.2020
Intersec Buenos Aires, 26.8.-28.8.2020
Automechanika Frankfurt, DE, 8.9.-12.9.2020
BATTERY JAPAN, Osaka, 9.9.-11.9.2020
IMTS2020, 14.9.-19.9.2020, Chicago, IL
Interlight Russia, Moscow, 14.9.-17.9.2020
Prolight + Sound NAMM, Moscow, 17.9.-19.9.2020
Prolight + Sound Shanghai, 28.10.-30.10.2020
SPS 2020, Nuremberg, 24.11.-26.11.2020
ISE 2021, Barcelona, Spain, 2.2.-5.2.2021
DistribuTECH, 9.2.-11.2.2021, San Diego, CA
BATTERY JAPAN, Tokyo, 3.3.-5.3.2021
BATTERY JAPAN, Osaka, 29.9.-1.10.2021
Interesting video
The ISS Design Challenge ...
Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara
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