Address Book
 

ICP Deutschland GmbH
 

Yamaichi Electronics USA Inc.
 

SEMTECH
 

Microchip Technology Inc.
 

EM Microelectronic
 

Murata Power Solutions Inc
 

Advantech
 

Keysight Technologies
 

XP Power Limited
 

Fischer Connectors SA
 

Nicomatic
 

TE Connectivity
 

akYtec GmbH
 

SOS electronic s.r.o.
 

MARVELL
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Interesting video
Various
T5808
 
TDK announces world’s first MIPI standar
Portable SSD T7 Touch
 
Samsung Releases Portable SSD T7 Touch –
AR236.B & AR232.B
 
APAR AR236.B & AR232.B radio loggers
JZ-500 and JZ-500-C black
 
JZ-500 and JZ-500-C black cables manufac
HF41F
 
HF41F subminiature power relays from HON
GT-900B
 
GOLDTOOL toolsets in cases
Intel® Neural Compute Stick 2
 
RS Components announces availability of
MC4
 
MC4 solar connector sets
WIHA-SB24670
 
Multifunctional WIHA LED Torch
G2RV-SR
 
G2RV-SR interface relays from OMRON
HOME PAGE
CoolMOS™ CE in SOT-223 package as cost-effective drop-in replacement for DPAK
CoolMOS™ CE in SOT-223 package as cost-effective drop-in replacement for DPAK
Infineon Technologies is growing the portfolio of CoolMOS™ CE with a SOT-223 package. For Infineon’s CoolMOS, this package offers a cost effective alternative to DPAK as well as space savings in some designs with low power dissipation. The SOT-223 package without middle pin is fully compatible with a typical DPAK footprint and can be used as a drop-in replacement for DPAK. This new package targets customer designs in LED lighting and mobile charger applications.
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National Electronics Week, 12th-14th April 2016, Birmingham,UK
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National Electronics Week, 12th-14th April 2016, Birmingham,UK
MOBILE WORLD CONGRESS SHANGHAI, 29.6.-1.7.2016
MOBILE WORLD CONGRESS SHANGHAI, 29.6.-1.7.2016
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Samsung Introduces Full Line-up of LED Components Based on Chip-Scale Packaging Technology Based on Chip-Scale Packaging Technology
Samsung Electronics, a world leader in advanced component solutions, introduced a full line-up of chip-scale LED packages* (CSP), including 0.6W-class and 3W-class packages, CSP arrays, and PoW (Phosphor on Wafer) packages.
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Samsung Introduces Full Line-up of LED Components Based on Chip-Scale Packaging Technology Based on Chip-Scale Packaging Technology
SOS webinar - Extend the life of the power supply to the max
SOS webinar - Extend the life of the power supply to the max
Have you ever searched in datasheets or at supplier web for power supplies lifetime data? Probably without success. This webinar will provide you with more information about power supplies lifetime.
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Panasonic Starts to Deliver Thermal Sensing Solutions Using the Infrared Array Sensor "Grid-EYE"
Delivering thermal sensing solutions using IR array sensors is started. Since it enable high-precision and contactless thermal sensing they can be used in air conditioning, nursing and monitoring.
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Panasonic Starts to Deliver Thermal Sensing Solutions Using the Infrared Array Sensor "Grid-EYE"
Toshiba Announces Availability of High Capacity Enterprise and Data Center SATA SSDs
Toshiba Announces Availability of High Capacity Enterprise and Data Center SATA SSDs
The HK4 Series is Toshiba’s first enterprise SSD to embed 15nm MLC NAND flash memory for enterprise and data center applications
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Infineon enables new high-performance FPGA development platform
Infineon Technologies announced that its Digital Point-of-Load (PoL) DC-DC regulators with full PMBus capabilities are featured in the Kintex® UltraScale™ development board. A key driver for the design flexibility of the board is the superior PMBus connectivity of the IR3806x family. Configurations can be stored in internal memory. In addition, PMBus commands allow run-time control, fault status and telemetry.
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Infineon enables new high-performance FPGA development platform
Toshiba Image Recognition Processor Delivers Advanced Functionality for Monocular Cameras in ADAS Applications
Toshiba Image Recognition Processor Delivers Advanced Functionality for Monocular Cameras in ADAS Applications
Fourth-generation processor integrates new hardware accelerators and media processing units
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Toshiba Extends Potential Applications for Wireless Power Charging with 15W Transmitter IC
Small, efficient Qi-compliant device enables mobile and industrial wireless charging
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Toshiba Extends Potential Applications for Wireless Power Charging with 15W Transmitter IC
High connection density in the smallest of spaces
High connection density in the smallest of spaces
With the new DFMC 0,5 PCB connector from Phoenix Contact, up to 32 conductors can be connected on an overall height of just 10.5 mm. The connectors on a 2.54 mm grid provide a connection density that is up to 40 percent higher than connectors on a 3.5 mm grid
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Microchip Launches New LoRa® Module Designed for North American Low-Power Wide-Area Networks (LPWAN)
New RN2903 Wireless Modem is FCC Certified for Use in the 915 MHz Band
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Microchip Launches New LoRa® Module Designed for North American Low-Power Wide-Area Networks (LPWAN)
Toshiba Launches Compact Bluetooth® Low Energy Communication IC for Scatternet Devices
Toshiba Launches Compact Bluetooth® Low Energy Communication IC for Scatternet Devices
Device housed in very thin chip-scale package supports communication for low-profile Bluetooth Smart applications
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New zip cord patch cables with OM1 fiber
Phoenix Contact is launching new zip cord patch cables for FO-based data cabling onto the market.
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New zip cord patch cables with OM1 fiber
Samsung Elevates Mobile Phone Picture Quality with Dual Pixel Technology in its Newest Image Sensor
Samsung Elevates Mobile Phone Picture Quality with Dual Pixel Technology in its Newest Image Sensor
Samsung Electronics, a world leader in advanced semiconductor technology, announced its newest 12 megapixel (Mp) image sensor for smartphones, which will elevate the quality of mobile phone pictures. Already in mass production, this 1.4μm-pixel-based image sensor is equipped with Dual Pixel technology that has been reserved for DSLR cameras. The technology enables rapid auto-focus for fast photo shooting while producing premium image quality on mobile devices, even in low light situations.
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Can you choose the right display? Here are some hints which way to go ...
Which display is suitable for a given type of environment? Which interface to use? Touch panel yes or no? Even these are questions put my many developers at designing their applications.
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Can you choose the right display? Here are some hints which way to go ...
[In-Depth Look] What’s Inside the Galaxy S7 and S7 edge
[In-Depth Look] What’s Inside the Galaxy S7 and S7 edge
It takes the most cutting-edge engineering to get all of the innovations and functionality of the Galaxy S7 and S7 edge into their streamlined, glass-and-metal bodies. While adding water and dust resistance, a microSD card slot and other enhancements to its features, the Galaxy S7 has maintained its harmonious and refined design, in a light and compact form.
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3M's FRB series is made primarily of inorganic materials that are easily converted to produce quality die-cut parts
3M introduces the Flame Barrier FRB series for OEM electrical flame barrier applications. It is a thin, flexible insulation made primarily of inorganic materials that is easily converted. The FRB barrier provides the very high flammability and ignitability resistance, excellent arc and track resistance, good dielectric strength, and good thermal performance to safely contain electrical hazards.
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3M's FRB series is made primarily of inorganic materials that are easily converted to produce quality die-cut parts
Company of the week

ICP Deutschland GmbH
Interesting video


How Do You Minimize Bubbles in a Two Part Epoxy System?


Adafruit Partners with Panasonic


Computer-On-Modules are world-leading platforms for embedded system designs


Ghostbuster's Theme on eight floppy drives


Darude - Sandstorm on Eight Floppy Drives
Address Book


ICP Deutschland GmbH


Yamaichi Electronics USA Inc.


SEMTECH


Microchip Technology Inc.


EM Microelectronic


Murata Power Solutions Inc


Advantech


Keysight Technologies


XP Power Limited


Fischer Connectors SA


Nicomatic


TE Connectivity


akYtec GmbH


SOS electronic s.r.o.


MARVELL


Taiwan Semiconductor


ROHM Semiconductor


Pickering Interfaces Ltd


ANRITSU


Mouser Electronics


NEXPERIA


RS Components GmbH


Transfer Multisort Elektronik Sp. z o.o.


SECTRON


FAULHABER


Willow Technologies


ABB


ACS Motion Control


Visual Communications Company, LLC


Sonderhoff Holding GmbH
Calendary
DistribuTECH, 28.1.-30.1.2020, San Antonio, TX
APEX EXPO 2020, San Diego, 4.2.-6.2.2020
embedded world 2020, Nuremberg, 25.2.-27.2.2020
BATTERY JAPAN, Tokyo, 26.2.-28.2.2020
Light + Building, Frankfurt am Main, 8.3.-13.3.2020
AMPER 2020, Brno, CZ, 17.3.-20.3.2020
SECUTECH 2020, Taipei, 22.4.-24.4.2020
PCIM Europe, Nuremberg, 5.5.-7.5.2020
SMTconnect 2020, Nuremberg, 5.5.-7.5.2020
LED Expo Mumbai 2020, 7.5.-9.5.2020
SPS Italia, Fiere di Parma, 26.5.-28.5.2020
Wire & Cable Guangzhou, China, 27.5.-29.5.2020
Automechanika Dubai, 7.6.-9.7.2020
hardware+tools, Dubai, UAE, 7.6.-9.6.2020
ELEKTRO 2020, MOSCOW, Russia, 8.6.-11.6.2020
PCIM Asia, Shanghai, 1.7.-3.7.2020
SPS Automation Middle East, Dubai, 20.8.-21.8.2020
Intersec Buenos Aires, 26.8.-28.8.2020
Automechanika Frankfurt, DE, 8.9.-12.9.2020
BATTERY JAPAN, Osaka, 9.9.-11.9.2020
IMTS2020, 14.9.-19.9.2020, Chicago, IL
Interlight Russia, Moscow, 14.9.-17.9.2020
Prolight + Sound NAMM, Moscow, 17.9.-19.9.2020
Prolight + Sound Shanghai, 28.10.-30.10.2020
SPS 2020, Nuremberg, 24.11.-26.11.2020
ISE 2021, Barcelona, Spain, 2.2.-5.2.2021
DistribuTECH, 9.2.-11.2.2021, San Diego, CA
BATTERY JAPAN, Tokyo, 3.3.-5.3.2021
BATTERY JAPAN, Osaka, 29.9.-1.10.2021
DistribuTECH, 25.1.-27.1.2022, Dallas, TX
Interesting video
The ISS Design Challenge ...
Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara
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