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conga-TR4
 
AMD Ryzen™ based congatec COM Express mo
BHI260AB
 
An All-in-One Programmable Smart Sensor
BAHCO
 
BAHCO set of insulated wrenches
s-Sense
 
s-Sense modules from R&D SOFTWARE SOLUTI
TH381
 
TH381 series miniature, high IP rated co
TP-1303
 
Twintex TP-1000 series dual channel powe
T5808
 
TDK announces world’s first MIPI standar
Portable SSD T7 Touch
 
Samsung Releases Portable SSD T7 Touch –
AR236.B & AR232.B
 
APAR AR236.B & AR232.B radio loggers
JZ-500 and JZ-500-C black
 
JZ-500 and JZ-500-C black cables manufac
HOME PAGE
Samsung Introduces Full Line-up of LED Components Based on Chip-Scale Packaging Technology Based on Chip-Scale Packaging Technology
Samsung Introduces Full Line-up of LED Components Based on Chip-Scale Packaging Technology Based on Chip-Scale Packaging Technology
Samsung Electronics, a world leader in advanced component solutions, introduced a full line-up of chip-scale LED packages* (CSP), including 0.6W-class and 3W-class packages, CSP arrays, and PoW (Phosphor on Wafer) packages.
.....
SOS webinar - Extend the life of the power supply to the max
Have you ever searched in datasheets or at supplier web for power supplies lifetime data? Probably without success. This webinar will provide you with more information about power supplies lifetime.
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SOS webinar - Extend the life of the power supply to the max
Panasonic Starts to Deliver Thermal Sensing Solutions Using the Infrared Array Sensor "Grid-EYE"
Panasonic Starts to Deliver Thermal Sensing Solutions Using the Infrared Array Sensor "Grid-EYE"
Delivering thermal sensing solutions using IR array sensors is started. Since it enable high-precision and contactless thermal sensing they can be used in air conditioning, nursing and monitoring.
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Toshiba Announces Availability of High Capacity Enterprise and Data Center SATA SSDs
The HK4 Series is Toshiba’s first enterprise SSD to embed 15nm MLC NAND flash memory for enterprise and data center applications
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Toshiba Announces Availability of High Capacity Enterprise and Data Center SATA SSDs
Infineon enables new high-performance FPGA development platform
Infineon enables new high-performance FPGA development platform
Infineon Technologies announced that its Digital Point-of-Load (PoL) DC-DC regulators with full PMBus capabilities are featured in the Kintex® UltraScale™ development board. A key driver for the design flexibility of the board is the superior PMBus connectivity of the IR3806x family. Configurations can be stored in internal memory. In addition, PMBus commands allow run-time control, fault status and telemetry.
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Toshiba Image Recognition Processor Delivers Advanced Functionality for Monocular Cameras in ADAS Applications
Fourth-generation processor integrates new hardware accelerators and media processing units
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Toshiba Image Recognition Processor Delivers Advanced Functionality for Monocular Cameras in ADAS Applications
Toshiba Extends Potential Applications for Wireless Power Charging with 15W Transmitter IC
Toshiba Extends Potential Applications for Wireless Power Charging with 15W Transmitter IC
Small, efficient Qi-compliant device enables mobile and industrial wireless charging
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High connection density in the smallest of spaces
With the new DFMC 0,5 PCB connector from Phoenix Contact, up to 32 conductors can be connected on an overall height of just 10.5 mm. The connectors on a 2.54 mm grid provide a connection density that is up to 40 percent higher than connectors on a 3.5 mm grid
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High connection density in the smallest of spaces
Microchip Launches New LoRa® Module Designed for North American Low-Power Wide-Area Networks (LPWAN)
Microchip Launches New LoRa® Module Designed for North American Low-Power Wide-Area Networks (LPWAN)
New RN2903 Wireless Modem is FCC Certified for Use in the 915 MHz Band
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Toshiba Launches Compact Bluetooth® Low Energy Communication IC for Scatternet Devices
Device housed in very thin chip-scale package supports communication for low-profile Bluetooth Smart applications
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Toshiba Launches Compact Bluetooth® Low Energy Communication IC for Scatternet Devices
New zip cord patch cables with OM1 fiber
New zip cord patch cables with OM1 fiber
Phoenix Contact is launching new zip cord patch cables for FO-based data cabling onto the market.
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Samsung Elevates Mobile Phone Picture Quality with Dual Pixel Technology in its Newest Image Sensor
Samsung Electronics, a world leader in advanced semiconductor technology, announced its newest 12 megapixel (Mp) image sensor for smartphones, which will elevate the quality of mobile phone pictures. Already in mass production, this 1.4μm-pixel-based image sensor is equipped with Dual Pixel technology that has been reserved for DSLR cameras. The technology enables rapid auto-focus for fast photo shooting while producing premium image quality on mobile devices, even in low light situations.
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Samsung Elevates Mobile Phone Picture Quality with Dual Pixel Technology in its Newest Image Sensor
Can you choose the right display? Here are some hints which way to go ...
Can you choose the right display? Here are some hints which way to go ...
Which display is suitable for a given type of environment? Which interface to use? Touch panel yes or no? Even these are questions put my many developers at designing their applications.
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[In-Depth Look] What’s Inside the Galaxy S7 and S7 edge
It takes the most cutting-edge engineering to get all of the innovations and functionality of the Galaxy S7 and S7 edge into their streamlined, glass-and-metal bodies. While adding water and dust resistance, a microSD card slot and other enhancements to its features, the Galaxy S7 has maintained its harmonious and refined design, in a light and compact form.
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[In-Depth Look] What’s Inside the Galaxy S7 and S7 edge
3M's FRB series is made primarily of inorganic materials that are easily converted to produce quality die-cut parts
3M's FRB series is made primarily of inorganic materials that are easily converted to produce quality die-cut parts
3M introduces the Flame Barrier FRB series for OEM electrical flame barrier applications. It is a thin, flexible insulation made primarily of inorganic materials that is easily converted. The FRB barrier provides the very high flammability and ignitability resistance, excellent arc and track resistance, good dielectric strength, and good thermal performance to safely contain electrical hazards.
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Fox Embedded Single Board Computer
VersaLogic's Fox is an excellent solution for industrial and medical applications that need a lower-power solution
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Fox Embedded Single Board Computer
NXP PCAL6524 Ultra-Low Voltage I/O Expanders
NXP PCAL6524 Ultra-Low Voltage I/O Expanders
NXP PCAL6524 Ultra-Low Voltage I/O Expanders provide remote I/O expansion for most microcontrollers using a Fast-mode Plus (Fm+) I2C-bus interface. The PCAL6524 24-bit general purpose I/O expanders have an ultra-low-voltage interface for direct connection to microcontrollers.
.....
Vicor Modules Support the Data Center Infrastructure Highlighted by Google at Open Compute Summit
Factorized Power Architecture Modules Enable Efficient 48V Direct-to-PoL (CPU, GPU, ASIC and DDR Memory) Solutions
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Vicor Modules Support the Data Center Infrastructure Highlighted by Google at Open Compute Summit
Company of the week

KEMET
Interesting video


Arduino LED filament clock


How Intel Makes Chips: Concept to Customer


How Do You Minimize Bubbles in a Two Part Epoxy System?


Adafruit Partners with Panasonic


Computer-On-Modules are world-leading platforms for embedded system designs
Address Book


KEMET


CODICO


Future Electronics


Foremost Electronics


Littelfuse


Mouser Electronics


RUTRONIK


Infineon Technologies AG


TTI, Inc.


ANRITSU


Power Integrations


AXIOMTEK


TDK Corporation


VISHAY


STMicroelectronics


Texas Instruments


Advantech


Molex, LLC


ON Semiconductor


NeoPhotonics


Murata Manufacturing Co.,


ICP Deutschland GmbH


SEMTECH


Yamaichi Electronics USA Inc.


Microchip Technology Inc.


EM Microelectronic


Murata Power Solutions Inc


Keysight Technologies


XP Power Limited


Fischer Connectors SA
Calendary
CWIEME Berlin, 26.5.-28.5.2020
SPS Italia, Fiere di Parma, 26.5.-28.5.2020
Wire & Cable Guangzhou, China, 27.5.-29.5.2020
Automechanika Dubai, 7.6.-9.7.2020
hardware+tools, Dubai, UAE, 7.6.-9.6.2020
ELEKTRO 2020, MOSCOW, Russia, 8.6.-11.6.2020
PCIM Asia, Shanghai, 1.7.-3.7.2020
PCIM Europe, Nuremberg, 28.7.-30.7.2020
SMTconnect 2020, Nuremberg, 28.7.-30.7..2020
SPS Automation Middle East, Dubai, 20.8.-21.8.2020
Intersec Buenos Aires, 26.8.-28.8.2020
Automechanika Frankfurt, DE, 8.9.-12.9.2020
BATTERY JAPAN, Osaka, 9.9.-11.9.2020
IMTS2020, 14.9.-19.9.2020, Chicago, IL
Interlight Russia, Moscow, 14.9.-17.9.2020
Prolight + Sound NAMM, Moscow, 17.9.-19.9.2020
NEPCON Nagoya, Japan, 21.10.-23.10.2020
Prolight + Sound Shanghai, 28.10.-30.10.2020
SPS 2020, Nuremberg, 24.11.-26.11.2020
NEPCON Japan, Tokio, 20.1.-22.1.2021
ISE 2021, Barcelona, Spain, 2.2.-5.2.2021
DistribuTECH, 9.2.-11.2.2021, San Diego, CA
BATTERY JAPAN, Tokyo, 3.3.-5.3.2021
BATTERY JAPAN, Osaka, 29.9.-1.10.2021
DistribuTECH, 25.1.-27.1.2022, Dallas, TX
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX
Interesting video
The ISS Design Challenge ...
Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara
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