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conga-TR4
 
AMD Ryzen™ based congatec COM Express mo
BHI260AB
 
An All-in-One Programmable Smart Sensor
BAHCO
 
BAHCO set of insulated wrenches
s-Sense
 
s-Sense modules from R&D SOFTWARE SOLUTI
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TH381 series miniature, high IP rated co
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TDK announces world’s first MIPI standar
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Samsung Releases Portable SSD T7 Touch –
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G8V Micro 280 Automotive Relays - Omron offers its automotive micro 280 terminal type relays in a miniaturized package
G8V Micro 280 Automotive Relays - Omron offers its automotive micro 280 terminal type relays in a miniaturized package
Omron's G8V micro 280 relays are an ISO 280 footprint used in most modern automotive vehicles today. Featuring either SPST or STDT layouts, these low profile automotive relays are capable of switching 20 A resistive on the normally open contact with a 60 A inrush. These relays are designed for fuel pumps, windshield wipers, blowers and climate controls, and seating controls.
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50A or Dual 25A µModule Regulator
Linear Technology Corporation introduces the LTM4650, a dual 25A or single 50A output step-down µModule® regulator with onboard shielded inductors, MOSFETs and a dual DC/DC regulator IC housed in a small thermally enhanced plastic package. The device is offered in a 16mm x 16mm x 5.01mm BGA with a patented built-in heat sink. The heat sink, attached to the MOSFETs and inductors, rapidly moves heat from the interior of the package to the top, where the surface of the heat sink is exposed to air.
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50A or Dual 25A µModule Regulator 
Microchip Announces Four Low-Power Embedded Wi-Fi® Solutions for Growing IoT Market
Microchip Announces Four Low-Power Embedded Wi-Fi® Solutions for Growing IoT Market
New Devices Provide Complete Solutions for 802.11b/g/n Wi-Fi 2.4 GHz Band
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WR-MM Series MiniModule Connectors - Wurth Electronics offers its WR-MM series IDC connectors used on wire-to-board, board-to-board, and permanent applications
Wurth Electronics' WR-MM series connectors are compact and low profile IDCs for ribbon cables with 1.27 mm pitch. The WR-MM feature contact numbers from 4- to 26-pins and offer cable, through-hole, SMD, or PCB types. WR-MM can be used on multiple applications as well, such as wire-to-board, board-to-board, and permanent.
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WR-MM Series MiniModule Connectors - Wurth Electronics offers its WR-MM series IDC connectors used on wire-to-board, board-to-board, and permanent applications
Cable Entry System (CES) Multigates - Phoenix Contact's CES product line expands with the addition of their low-cost multigates
Cable Entry System (CES) Multigates - Phoenix Contact's CES product line expands with the addition of their low-cost multigates
Phoenix Contact continues the expansion of its CES product line with the addition of their low-cost CES Multigates. These space-saving, panel feed-through, metal-reinforced cable entry plates offer a high degree of protection (IP66/67) by way of double-membrane sealing. Capable of handling up to 37 cables with an OD from 5 mm up to 60 mm, the CES Multigate product has a UL 94 V-0 flame rating and is oil-resistant (black material).
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Mouser, Intel, and Analog Devices Sponsor Create the Future Global Design Contest for Engineers
Mouser Electronics, Inc. is continuing its sponsorship of the 14th annual “Create the Future” Design Contest, a challenge to engineers and students worldwide to create the next great thing. Mouser’s valued supplier partners Intel® and Analog Devices, Inc. are joining in this sponsorship once again. The contest is produced by Tech Briefs Media Group, an SAE International Company.
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Mouser, Intel, and Analog Devices Sponsor Create the Future
CoolMOS™ CE in SOT-223 package as cost-effective drop-in replacement for DPAK
CoolMOS™ CE in SOT-223 package as cost-effective drop-in replacement for DPAK
Infineon Technologies is growing the portfolio of CoolMOS™ CE with a SOT-223 package. For Infineon’s CoolMOS, this package offers a cost effective alternative to DPAK as well as space savings in some designs with low power dissipation. The SOT-223 package without middle pin is fully compatible with a typical DPAK footprint and can be used as a drop-in replacement for DPAK. This new package targets customer designs in LED lighting and mobile charger applications.
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National Electronics Week, 12th-14th April 2016, Birmingham,UK
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National Electronics Week, 12th-14th April 2016, Birmingham,UK
MOBILE WORLD CONGRESS SHANGHAI, 29.6.-1.7.2016
MOBILE WORLD CONGRESS SHANGHAI, 29.6.-1.7.2016
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Samsung Introduces Full Line-up of LED Components Based on Chip-Scale Packaging Technology Based on Chip-Scale Packaging Technology
Samsung Electronics, a world leader in advanced component solutions, introduced a full line-up of chip-scale LED packages* (CSP), including 0.6W-class and 3W-class packages, CSP arrays, and PoW (Phosphor on Wafer) packages.
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Samsung Introduces Full Line-up of LED Components Based on Chip-Scale Packaging Technology Based on Chip-Scale Packaging Technology
SOS webinar - Extend the life of the power supply to the max
SOS webinar - Extend the life of the power supply to the max
Have you ever searched in datasheets or at supplier web for power supplies lifetime data? Probably without success. This webinar will provide you with more information about power supplies lifetime.
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Panasonic Starts to Deliver Thermal Sensing Solutions Using the Infrared Array Sensor "Grid-EYE"
Delivering thermal sensing solutions using IR array sensors is started. Since it enable high-precision and contactless thermal sensing they can be used in air conditioning, nursing and monitoring.
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Panasonic Starts to Deliver Thermal Sensing Solutions Using the Infrared Array Sensor "Grid-EYE"
Toshiba Announces Availability of High Capacity Enterprise and Data Center SATA SSDs
Toshiba Announces Availability of High Capacity Enterprise and Data Center SATA SSDs
The HK4 Series is Toshiba’s first enterprise SSD to embed 15nm MLC NAND flash memory for enterprise and data center applications
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Infineon enables new high-performance FPGA development platform
Infineon Technologies announced that its Digital Point-of-Load (PoL) DC-DC regulators with full PMBus capabilities are featured in the Kintex® UltraScale™ development board. A key driver for the design flexibility of the board is the superior PMBus connectivity of the IR3806x family. Configurations can be stored in internal memory. In addition, PMBus commands allow run-time control, fault status and telemetry.
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Infineon enables new high-performance FPGA development platform
Toshiba Image Recognition Processor Delivers Advanced Functionality for Monocular Cameras in ADAS Applications
Toshiba Image Recognition Processor Delivers Advanced Functionality for Monocular Cameras in ADAS Applications
Fourth-generation processor integrates new hardware accelerators and media processing units
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Toshiba Extends Potential Applications for Wireless Power Charging with 15W Transmitter IC
Small, efficient Qi-compliant device enables mobile and industrial wireless charging
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Toshiba Extends Potential Applications for Wireless Power Charging with 15W Transmitter IC
High connection density in the smallest of spaces
High connection density in the smallest of spaces
With the new DFMC 0,5 PCB connector from Phoenix Contact, up to 32 conductors can be connected on an overall height of just 10.5 mm. The connectors on a 2.54 mm grid provide a connection density that is up to 40 percent higher than connectors on a 3.5 mm grid
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Microchip Launches New LoRa® Module Designed for North American Low-Power Wide-Area Networks (LPWAN)
New RN2903 Wireless Modem is FCC Certified for Use in the 915 MHz Band
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Microchip Launches New LoRa® Module Designed for North American Low-Power Wide-Area Networks (LPWAN)
Company of the week

Digi-Key Electronics
Interesting video


Arduino LED filament clock


How Intel Makes Chips: Concept to Customer


How Do You Minimize Bubbles in a Two Part Epoxy System?


Adafruit Partners with Panasonic


Computer-On-Modules are world-leading platforms for embedded system designs
Address Book


Digi-Key Electronics


Durakool


KEMET


CODICO


Future Electronics


Foremost Electronics


Littelfuse


Mouser Electronics


RUTRONIK


Infineon Technologies AG


TTI, Inc.


ANRITSU


Power Integrations


AXIOMTEK


TDK Corporation


VISHAY


STMicroelectronics


Texas Instruments


Advantech


ON Semiconductor


Molex, LLC


NeoPhotonics


Murata Manufacturing Co.,


ICP Deutschland GmbH


SEMTECH


Yamaichi Electronics USA Inc.


Microchip Technology Inc.


EM Microelectronic


Murata Power Solutions Inc


Keysight Technologies
Calendary
NEPCON Nagoya, Japan, 21.10.-23.10.2020
Prolight + Sound Shanghai, 28.10.-30.10.2020
SPS 2020, Nuremberg, 24.11.-26.11.2020
NEPCON Japan, Tokio, 20.1.-22.1.2021
ISE 2021, Barcelona, Spain, 2.2.-5.2.2021
DistribuTECH, 9.2.-11.2.2021, San Diego, CA
BATTERY JAPAN, Tokyo, 3.3.-5.3.2021
BATTERY JAPAN, Osaka, 29.9.-1.10.2021
DistribuTECH, 25.1.-27.1.2022, Dallas, TX
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX
Interesting video
The ISS Design Challenge ...
Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara
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