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Texas Instruments is engineering industrial and automotive innovation at electronica 2016

Texas Instruments is engineering industrial and automotive innovation 

Visit TI at electronica 2016, November 08-11, hall A4, booth 219

FREISING, (Sept 08, 2016) – At electronica 2016 in Munich, Germany, Texas Instruments (TI) (NASDAQ: TXN) will showcase innovation focused on the future of industrial automation and automotive technologies, such as the following:

·Visit the industrial demo showcasing TI technology enabling Industry 4.0 and the smart factory of tomorrow leveraging TI solutions for real-time Ethernet with EtherCAT. Take a closer look at sensor communications with wired technologies like IO-Link and wireless technologies such as Bluetooth® low energy, and explore how TI’s gallium nitride (GaN) technology significantly increases the efficiency in variable speed motor drives.

·Discover innovation in automotive all in one car. The Evolution Car 2020 (EvoCar) showcases how TI’s automotive portfolio, including DLP® products, enables advanced driver assistance systems (ADAS), infotainment, haptic feedback and adaptive LED headlights. Come and take a ride.

For more information, visit ti.com/electronica.

TI will also be offering an engineer-to-engineer experience where attendees can visit any of four different technology workbenches to meet TI experts. Each workbench is dedicated to a different topic: power management, sensing, wireless connectivity, MCUs and processors.

Beyond the TI booth at electronica

On November 10, TI experts will deliver presentations at the Embedded Platforms Conference at the Press Center East on the fair ground.

·10:35- 11:15 a.m. - Nick Lethaby, IoT Ecosystem manager – Software Power Management Techniques for IoT Sensor Applications.

·12:35- 1:15 p.m. - Leo Hendrawan, EMEA application support engineer – RTOS Based Software Development Approach for IoT low power wireless applications.

·2:00- 2:40 p.m. - Ram Machness, marketing director, Low Power Connectivity – Sub-1 GHz and Bluetooth® low energy wireless communication for local and cloud-based control. 

On November 09, from 1:30- 2:00 pm, Ram Machness will speak about Leveraging the range of Sub-1 GHz technology to connect ultra-low power IoT sensors to the cloud at the Wireless Congress. This event takes place at the International Congress Center Munich on the fair ground.

Also on November 09, from 1.30- 2.00 pm, Florian Feckl, power management systems engineer, will speak on Low Power, High Efficiency and Small Size DC/DC Solutions from TI and Coilcraft. He will present with Flavio Sestagalli from Coilcraft, in cooperation with Mouser Electronics, a key distributor of TI products. The presentation is part of the Embedded Forum in hall A6.

2016091002 / 10.09.2016 / Trade fairs, Events / Texas Instruments /

TI's EMI-optimized integrated transformer technology miniaturizes isolated power transfer into IC-sized packaging
TI's EMI-optimized integrated transformer technology miniaturizes isolated power transfer into IC-sized packaging
Engineers can shrink their power solution by as much as 80% and maximize efficiency in high-voltage industrial applications with a new high-density, isolated DC/DC bias power supply
.....
Texas Instruments will show what’s next for automotive electronics and industrial automation at electronica 2018
Visit TI at electronica 2018, November 13-16, hall C4, booth 131
.....
Texas Instruments will show what’s next for automotive electronics 
New robust, noise-immune capacitive-sensing MCUs from TI bring touch control to cost-sensitive industrial applications
New robust, noise-immune capacitive-sensing MCUs from TI bring touch control to cost-sensitive industrial applications
MSP430™ microcontrollers with CapTIvate™ technology offer value and performance to applications exposed to electromagnetic disturbances, oil, water and grease
.....
Industry's smallest 36-V, 1-A DC/DC step-down power module shrinks board space by up to 58 percent
Modules from Texas Instruments feature tiny MicroSiP packaging and achieve up to 92 percent efficiency
.....
Industry's smallest 36-V, 1-A DC/DC step-down power module shrinks board space by up to 58 percent
Tiny but mighty: smallest amplifiers deliver high performance for challenging system designs
Tiny but mighty: smallest amplifiers deliver high performance for challenging system designs
TI's new operational amplifier and comparators reduce overall system footprint in IoT, personal electronics and industrial applications
.....
TI introduces single-chip buck-boost battery charge controllers enabling USB Type-C™ and USB Power Delivery support
Texas Instruments today introduced a pair of highly flexible, single-chip buck-boost battery charge controllers for one- to four-cell (1S to 4S) designs. The bq25703A and bq25700A synchronous charge controllers support efficient charging through USB Type-C and other USB ports in end equipment ranging from notebooks and tablets to power banks, drones and smart home applications.
.....
TI introduces single-chip buck-boost battery charge controllers enabling USB Type-C™ and USB Power Delivery support
New family of Texas Instruments SoCs drives down cost of multi-protocol industrial Ethernet communication
New family of Texas Instruments SoCs drives down cost of multi-protocol industrial Ethernet communication
Sitara™ AMIC110 system on chip (SoC) simplifies industrial Ethernet communication and provides design versatility by supporting more than 10 standards
.....
TI technology extends flight time and battery life of quadcopters and industrial drones
New reference designs feature latest innovation in battery management and motor control efficiency
.....
TI technology extends flight time and battery life of quadcopters and industrial drones
Texas Instruments is engineering industrial and automotive innovation 
Texas Instruments is engineering industrial and automotive innovation at electronica 2016
Visit TI at electronica 2016, November 08-11, hall A4, booth 219
.....
TI unveils industry's highest power density 12-V, 10-A, 10-MHz DC/DC converter
Ultra-small SWIFT™ step-down converter features unique topology to achieve four times higher current density
.....
TI unveils industry's highest power density 12-V, 10-A, 10-MHz DC/DC converter
TI delivers the industry's first RF sampling 14-bit, 3-GSPS analog-to-digital converter
TI delivers the industry's first RF sampling 14-bit, 3-GSPS analog-to-digital converter
TI simplifies direct RF sampling system architecture with the highest dynamic range, widest bandwidth and fastest 14-bit ADC
.....
TI introduces the first differential inductive switch
Newest inductive-sensing device provides high reliability and simplifies mechanical design in switching applications
.....
TI introduces the first differential inductive switch
Go for gold with a new limited-edition, metallic graphing calculator
Go for gold with a new limited-edition, metallic graphing calculator
Texas Instruments adds two new colors to the TI-84 Plus CE line-up
.....
TI's 65-V micro-power buck converters feature industry's lowest quiescent current
150-mA synchronous DC/DC regulators optimize light-load efficiency for factory automation and automotive applications
.....
TI's 65-V micro-power buck converters feature industry's lowest quiescent current
Revolutionize high-performance power conversion with TI's 600-V GaN FET power stage
Revolutionize high-performance power conversion with TI's 600-V GaN FET power stage
The first publicly sampled, TI-manufactured integrated high-voltage GaN FET and driver solution enables twice the power density and half the power loss
.....
TI introduces chokeless high-speed CAN transceiver families with industry-leading EMC performance
New industrial and automotive interface devices provide leading combination of protection and compliance
.....
TI introduces chokeless high-speed CAN transceiver families with industry-leading EMC performance
Innovative wide Vin DC/DC controller features industry's highest 65-V operation
Innovative wide Vin DC/DC controller features industry's highest 65-V operation
2.2-MHz, low-quiescent-current buck converter significantly reduces system noise and saves space in sensitive automotive power-supply systems
.....
TI introduces industry’s highest-performance wideband RF phase-locked loops with integrated voltage-controlled oscillators
Wide frequency range of up to 9.8 GHz and best phase noise performance reduce system complexity
.....
TI introduces industry’s highest-performance wideband RF phase-locked loops 
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Address Book


RUTRONIK


Infineon Technologies AG


TTI, Inc.


ANRITSU


Power Integrations


AXIOMTEK


TDK Corporation


VISHAY


STMicroelectronics


Texas Instruments


Advantech


Molex, LLC


ON Semiconductor


NeoPhotonics


Murata Manufacturing Co.,


ICP Deutschland GmbH


Yamaichi Electronics USA Inc.


SEMTECH


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EM Microelectronic


Murata Power Solutions Inc


Keysight Technologies


XP Power Limited


Fischer Connectors SA


Nicomatic


TE Connectivity


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SOS electronic s.r.o.


MARVELL


Taiwan Semiconductor
Calendary
SECUTECH 2020, Taipei, 22.4.-24.4.2020
PCIM Europe, Nuremberg, 5.5.-7.5.2020
LED Expo Mumbai 2020, 7.5.-9.5.2020
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Wire & Cable Guangzhou, China, 27.5.-29.5.2020
Automechanika Dubai, 7.6.-9.7.2020
hardware+tools, Dubai, UAE, 7.6.-9.6.2020
ELEKTRO 2020, MOSCOW, Russia, 8.6.-11.6.2020
PCIM Asia, Shanghai, 1.7.-3.7.2020
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IMTS2020, 14.9.-19.9.2020, Chicago, IL
Interlight Russia, Moscow, 14.9.-17.9.2020
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Prolight + Sound Shanghai, 28.10.-30.10.2020
SPS 2020, Nuremberg, 24.11.-26.11.2020
NEPCON Japan, Tokio, 20.1.-22.1.2021
ISE 2021, Barcelona, Spain, 2.2.-5.2.2021
DistribuTECH, 9.2.-11.2.2021, San Diego, CA
BATTERY JAPAN, Tokyo, 3.3.-5.3.2021
BATTERY JAPAN, Osaka, 29.9.-1.10.2021
DistribuTECH, 25.1.-27.1.2022, Dallas, TX
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX
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