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Tektronix AFG31000
 
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Samsung Makes Image Sensor Integration E
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Samsung Makes Image Sensor Integration Easier with New 16Mp ISOCELL Slim 3P9 and Plug & Play Solution

Samsung Makes Image Sensor Integration Easier with New 16Mp ISOCELL Slim 3P9 and Plug & Play Solution

Samsung Electronics introduced a new 16-megapixel (Mp) ISOCELL Slim 3P9 image sensor along with a Plug and Play solution, a pre-optimized turnkey camera module made up of an ISOCELL image sensor and preferred partner components to help expedite time-to-market.

“Samsung’s ISOCELL image sensors take advantage of various technologies to deliver innovative imaging experiences in mobile devices,” said Ben K. Hur, vice president of System LSI marketing at Samsung Electronics. “The ISOCELL Plug and Play solution will help reduce time-to-market for set makers and offer a quality-assured camera solution to end-users.”

The Samsung ISOCELL Slim 3P9 is a 1.0μm 16Mp image sensor with Tetracell technology that allows bright and vivid pictures in today’s sleekly designed smartphones. With Tetracell, a technology that merges four neighboring pixels, the 3P9 can function as a 2.0μm image sensor for front-facing cameras that can take brighter pictures in low-lit environments.

For faster auto-focusing, the 3P9 adopted an advanced phase detection auto-focus (PDAF) with doubled auto-focus agent density than that of conventional PDAF sensors. In addition, the sensor significantly stabilizes pictures and videos taken while in motion with a gyro-synchronizer that syncs frame exposure time from the sensor with movement data from the device’s gyroscope. Once the data is synced, the mobile processor can simply adjust the frames based on movement rather than rigorously analyzing each frame to detect and compensate for angular movement.

For easier camera optimization while accelerating time-to-market, Samsung also offers an ISOCELL Plug and Play solution for the 3P9 in a rear camera module. Optimizing a camera module, made up of parts from different providers, with the mobile processor can be an arduous and lengthy task for smartphone makers. Samsung’s ISOCELL Plug and Play solution simplifies this process by offering a turnkey ISOCELL sensor module tuned for Valued Camera eXperience (VCX)-grade image quality, along with other components, including lenses and actuators from preferred partners.

Since the optimization and reliability tests are done beforehand at the module-level rather than on the sensor alone, manufacturers can simply plug the camera module onto their device, saving up to four months of development time.

The Samsung ISOCELL Slim 3P9 with Plug and Play solution is currently available.

2018051111 / 14.05.2018 / Electronic-components / SAMSUNG /
Samsung Begins Mass Production of 10nm-class 16Gb LPDDR4X DRAM for Automobiles
Samsung Begins Mass Production of 10nm-class 16Gb LPDDR4X DRAM for Automobiles
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.....
Samsung Makes Image Sensor Integration Easier with New 16Mp ISOCELL Slim 3P9 and Plug & Play Solution
Samsung Electronics introduced a new 16-megapixel (Mp) ISOCELL Slim 3P9 image sensor along with a Plug and Play solution, a pre-optimized turnkey camera module made up of an ISOCELL image sensor and preferred partner components to help expedite time-to-market.
.....
Samsung Makes Image Sensor Integration Easier with New 16Mp ISOCELL Slim 3P9 and Plug & Play Solution
Samsung Electronics Begins Offering LED Component Solutions for Horticulture Lighting
Samsung Electronics Begins Offering LED Component Solutions for Horticulture Lighting
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Samsung Electronics Redefines High Endurance Memory Card Market with New PRO Endurance Card
Built for intensive video monitoring applications, PRO Endurance delivers industry-best 43,800 hours of continuous video recording in 128GB capacity
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Samsung Electronics Redefines High Endurance Memory Card Market with New PRO Endurance Card
Samsung Electronics Sets New Performance Standards for NVMe SSDs with 970 PRO and EVO
Samsung Electronics Sets New Performance Standards for NVMe SSDs with 970 PRO and EVO
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Samsung Accelerates the Next Generation of IoT with New and Advanced SAMSUNG ARTIK™ Platform Products for Interoperability, Enhanced Security, and Connected Services
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Samsung Accelerates the Next Generation of IoT with New and Advanced SAMSUNG ARTIK™ Platform Products for Interoperability, Enhanced Security, and Connected Services
Samsung Introduces Second Generation Chip-on-Board LED Packages for Spotlights and Other Directional Lighting
Samsung Introduces Second Generation Chip-on-Board LED Packages for Spotlights and Other Directional Lighting
Samsung Electronics, a world leader in advanced component solutions, today announced its second generation of D-series chip-on-board (COB) LED packages.
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Samsung Electronics Introduces the EVO Plus 256GB MicroSD Card, with the Highest Capacity in its Class
Samsung Electronics, an expert provider of advanced memory solutions, today unveiled its newest memory card globally – the EVO Plus 256GB microSD card. The EVO Plus 256GB offers the highest capacity for a microSD card in its class, delivering fast speeds and an expanded memory storage for use in premium smartphones and tablets, 360-degree video recorders, action cameras, and drones.
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Samsung Electronics Introduces the EVO Plus 256GB MicroSD Card, with the Highest Capacity in its Class
Samsung Starts Mass Producing Industry’s First 10-Nanometer Class DRAM
Samsung Starts Mass Producing Industry’s First 10-Nanometer Class DRAM
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Samsung Introduces Smart Lighting Module to Simplify and Improve Connectivity in IoT Lighting Applications
Samsung Electronics introduced a multi-purpose Smart Lighting Module (SLM) – the most fundamental IoT building block – for the fast-growing, smart building and smart city markets. By providing the core building block for a wide variety of potential smart lighting systems, Samsung’s SLM will play a key role in speeding up system development, lowering risk, improving system quality and reducing time to market for smart lighting manufacturers. The module will be sampled with Samsung smart lighting partners and will be shipped to OEMs in April.
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Samsung Introduces Smart Lighting Module to Simplify and Improve Connectivity in IoT Lighting Applications
Samsung Adds Advanced Color Quality Features to its Small LES, Chip-on-Board LED Solutions for Premium Commercial LED Lighting
Samsung Adds Advanced Color Quality Features to its Small LES, Chip-on-Board LED Solutions for Premium Commercial LED Lighting
Samsung Electronics, a world leader in advanced component solutions, introduced new color quality improvements for its small LES* (light-emitting surface) chip-on-board (COB**) package LC series: LC010, LC020 and LC040. The improvements are based on “Vivid” color technology that has been optimized for high color quality LED lighting especially for use in premium commercial lighting applications.
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Samsung Introduces Full Line-up of LED Components Based on Chip-Scale Packaging Technology Based on Chip-Scale Packaging Technology
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Samsung Introduces Full Line-up of LED Components Based on Chip-Scale Packaging Technology Based on Chip-Scale Packaging Technology
Samsung Elevates Mobile Phone Picture Quality with Dual Pixel Technology in its Newest Image Sensor
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Samsung Electronics, a world leader in advanced semiconductor technology, announced its newest 12 megapixel (Mp) image sensor for smartphones, which will elevate the quality of mobile phone pictures. Already in mass production, this 1.4μm-pixel-based image sensor is equipped with Dual Pixel technology that has been reserved for DSLR cameras. The technology enables rapid auto-focus for fast photo shooting while producing premium image quality on mobile devices, even in low light situations.
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[In-Depth Look] What’s Inside the Galaxy S7 and S7 edge
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[In-Depth Look] What’s Inside the Galaxy S7 and S7 edge
Samsung Introduces World’s Largest Capacity (15.36TB) SSD for Enterprise Storage Systems
Samsung Introduces World’s Largest Capacity (15.36TB) SSD for Enterprise Storage Systems
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Samsung Introduces Industry’s First 256-Gigabyte Universal Flash Storage, for High-end Mobile Devices
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Samsung Introduces Industry’s First 256-Gigabyte Universal Flash Storage, for High-end Mobile Devices
Verizon and Samsung launch 4G LTE small cell solution for enhanced in-building coverage for enterprise customers
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Samsung Presents First “Samsung Safety Truck” Prototype
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Samsung Presents First “Samsung Safety Truck” Prototype
Company of the week

Taiwan Semiconductor
Address Book


SMA Solar Technology AG


Taiwan Semiconductor


ROHM Semiconductor


Pickering Interfaces Ltd


ANRITSU


Mouser Electronics


NEXPERIA


RS Components GmbH


Transfer Multisort Elektronik Sp. z o.o.


SECTRON


FAULHABER


Willow Technologies


ABB


ACS Motion Control


Visual Communications Company, LLC


Sonderhoff Holding GmbH


LASER COMPONENTS


LEM


Hradil Spezialkabel GmbH


Radio Frequency Systems


Apacer Technology Inc.


Pico Technology


AERCO


MENCOM


Analog Devices


HIROSE ELECTRIC CO., LTD


AVNET


LG Innotek


PANDUIT


GaN Systems
Calendary
NEPCON Japan, Tokyo, 16.-18.1.2019
SEMICON Korea, 23.-25.1.2019, Korea
30th Manufacturing World Tokio, JPN, 6.-8.2.2019
embedded world 2019, 26.-28.2019, Nuremberg, Germany
Middle East Electricity, Dubai, UAE, 5.-7.3.2019
PITTCON 2019, Philadelphia, USA, 17.-21.3.2019
AMPER 2019, Brno, CZ, 19.-22.3.2019
AUTOMATICON 2019, Warsaw, PL, 26.-29.3.2019
HANNOVER MESSE 2019, 1.-5.4.2019, DE
Hong Kong International Lighting Fair, 6.-9.4.2019
4th Manufacturing World Nagoya, JPN, 17.-19.4.2019
SENSOR+TEST 2018, 26.-29.6.2019, Nuremberg, DE
productronica 2019, Munich, DE, 12.-15.11.2019
Interesting video
The ISS Design Challenge ...
Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara
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