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AR236.B & AR232.B
 
APAR AR236.B & AR232.B radio loggers
JZ-500 and JZ-500-C black
 
JZ-500 and JZ-500-C black cables manufac
HF41F
 
HF41F subminiature power relays from HON
GT-900B
 
GOLDTOOL toolsets in cases
Intel® Neural Compute Stick 2
 
RS Components announces availability of
MC4
 
MC4 solar connector sets
WIHA-SB24670
 
Multifunctional WIHA LED Torch
G2RV-SR
 
G2RV-SR interface relays from OMRON
LUP-20-LED
 
LUP-20-LED-SMD desktop magnifier
LinkSwitch™-XT2
 
Power Integrations Unveils High-Efficien

THERMFLOW® T777 Phase Change Material

THERMFLOW® T777 Phase Change Material 

Parker Chomerics' T777 thermally enhanced and inherently tacky phase change material

Parker Chomerics' THERMFLOW T777 is a thermally enhanced and inherently tacky phase change material designed to completely fill interfacial air gaps and voids within electronics assemblies. It is classified as polymer solder hybrid material (PSH).

The ability to completely fill air gaps and voids typical of component packages and heat sinks allows THERMFLOW pads to achieve performance superior to any other thermal interface materials.

At room temperature, THERMFLOW materials are solid and easy to handle. This allows them to be consistently and cleanly applied as dry pads to a heat sink or component surface. THERMFLOW material softens as it reaches component operating temperatures. With light clamping pressure, it will readily conform to both mating surfaces. Upon reaching the required melt temperature, the pad will fully change phase and attain minimum bond-line thickness (MBLT) of less than 0.001 inch or 0.0254 mm and maximum surface wetting. This results in practically no thermal contact resistance due to a very small thermal resistance path.

Features
  • Low thermal impedance
  • Can be pre-applied to heat sinks
  • Demonstrated reliability through thermal cycling and accelerated age testing
  • RoHS compliant
  • Protective release liners prevent contamination
  • Available in custom die-cut shapes and kiss-cut on rolls
Applications
  • Chipsets
  • Microprocessors
  • Graphics processors
  • Power modules
  • Memory modules
  • Power semiconductors
  • Superior thermal performance
  • Ideal solution for mobile microprocessors
  • Resin system designed for higher temperature reliability
  • Dispersed solder filler offers added thermal performance
  • UL 94 V-0 flammability rated
  • Tabs available for easy removal
  • Inherently tacky, no adhesive required


THERMFLOW® T777 Phase Change Material

Image Manufacturer Part Number Description Outline Thickness   View Details
THERMAFLOW 14X14MM 1=16 69-11-42336-T777 THERMAFLOW 14X14MM 1=16 14.00mm x 14.00mm 0.0045" (0.115mm)   View Details
THERMAFLOW 28X28MM 1=8 69-11-42339-T777 THERMAFLOW 28X28MM 1=8 28.00mm x 28.00mm 0.0045" (0.115mm)   View Details
THERMAFLOW 6X6 69-11-42342-T777 THERMAFLOW 6X6" SOLDER HYBRID 152.40mm x 152.40mm 0.0045" (0.115mm)   View Details

2018121504 / 29.12.2018 / Electronic-components / Digi-Key Electronics /

Proteus-II 5.0 Bluetooth® Smart Module (AMB2623)
Proteus-II 5.0 Bluetooth® Smart Module (AMB2623)
Wurth Electronics' Proteus-II includes all the features of the Proteus-I and combines them perfectly with an optimized data throughput
.....
Metis-I – 868 MHz Wireless wM-Bus Radio Module
Wurth Electronics' low cost wireless wM-Bus radio module suitable for automated meter reading applications
.....
Metis-I – 868 MHz Wireless wM-Bus Radio Module
G7L Power Relay
G7L Power Relay
Omron’s high-capacity, high-dielectric-strength relay is compatible with momentary voltage drops
.....
PAN4620 Series IEEE® 802.15.4 and Bluetooth® Low Energy Module
Panasonic’s IoT, dual-mode mesh networking RF module can be operated in standalone and hosted modes
.....
PAN4620 Series IEEE® 802.15.4 and Bluetooth® Low Energy Module
CNS650-M Series AC/DC Power Supplies
CNS650-M Series AC/DC Power Supplies
Artesyn Embedded Technologies' CNS650-M series 650 W AC/DC power supplies feature a wide input range and single output
.....
Multi-Purpose High-Efficiency International Transformers – MPI Series
Signal Transformer's MPI transformers meet international safety standards making them ideal for worldwide applications
.....
Multi-Purpose High-Efficiency International Transformers – MPI Series
CA Series Heatsinks
CA Series Heatsinks
Ohmite's CA series ceramic heatsinks for TO-247 and TO-264 packaging
.....
DRF960-24-1 DIN Rail Power Supply
TDK-Lambda's 960 W DIN rail power supply has a 1440 W peak capability
.....
DRF960-24-1 DIN Rail Power Supply
PA and PV Series Heatsinks
PA and PV Series Heatsinks
Ohmite's forged pin fin heatsink for TO-220, TO-247, and TO-264 devices
.....
FINEPITCH Series Board-to-Board Connectors
Phoenix Contact’s 0.8 mm and 1.27 mm connectors allow connections with speeds up to 16 Gbps
.....
FINEPITCH Series Board-to-Board Connectors
CFB600W-110S Series DC/DC Converters
CFB600W-110S Series DC/DC Converters
Cincon’s DC/DC converters have wide input voltage range and provide up to 600 W
.....
GB Series of AC/DC Power Supplies
SL Power's next-generation internal power supplies that are dual certified and available in pin-mount or PCB-mount configurations
.....
GB Series of AC/DC Power Supplies
Grove Expansion Boards with Sensirion Air Quality, Temperature, and Humidity Sensors
Grove Expansion Boards with Sensirion Air Quality, Temperature, and Humidity Sensors
Seeed’s three Grove boards for evaluating Sensirion air quality or temperature and humidity sensors
.....
Mini Cool Edge 0.60 mm Connectors
Amphenol ICC’s Mini Cool Edge connectors for right angle, mezzanine/coplanar, and support cable interconnect board-to-board applications
.....
Mini Cool Edge 0.60 mm Connectors
STR-USBC-4PORT-200W-EVK Source Evaluation Platform
STR-USBC-4PORT-200W-EVK Source Evaluation Platform
ON Semi's board allows evaluation of USB AC-DC 4-port 200 W source platform
.....
Ultraviolet A (UVA) Series
SunLED’s UVA emitters offer 365 nm to 415 nm wavelengths in two different package types
.....
Ultraviolet A (UVA) Series
3K and 3J CANbus Keypads and Joysticks
3K and 3J CANbus Keypads and Joysticks
Grayhill's 3J vehicle display controller and 3K CANbus keypad offer two options for CANbus applications
.....
Wire-Marking Solutions
Phoenix Contact's marking systems help to easily identify and assign wires and cables
.....
Wire-Marking Solutions
Company of the week

TE Connectivity
Address Book


SMA Solar Technology AG


TE Connectivity


akYtec GmbH


SOS electronic s.r.o.


MARVELL


Taiwan Semiconductor


ROHM Semiconductor


ČEZ a.s.


Pickering Interfaces Ltd


ANRITSU


Mouser Electronics


NEXPERIA


RS Components GmbH


Transfer Multisort Elektronik Sp. z o.o.


SECTRON


FAULHABER


Willow Technologies


ABB


ACS Motion Control


Visual Communications Company, LLC


Sonderhoff Holding GmbH


LASER COMPONENTS


LEM


Hradil Spezialkabel GmbH


Radio Frequency Systems


Apacer Technology Inc.


Pico Technology


AERCO


MENCOM


Analog Devices
Calendary
MWC Shanghai 2019, 26.6.-28.6.2019
SENSOR+TEST 2018, 26.-29.6.2019, Nuremberg, DE
NEPCON Japan, Nagoya, 18.9.-20.9.2019
SEMICON TAIWAN, Taipei, 18.9.-20.9.2019
BATTERY JAPAN, Osaka, 25.9.-27.9.2019
electronicAsia 2019, Hong Kong, 13.10.-16.10.2019
Hong Kong Electronics Fair, 13.10.-16.10.2019
TAITRONICS 2019, Taipei, Taiwan, 16.10.-18.10.2019
productronica 2019, Munich, DE, 12.-15.11.2019
NEPCON Japan, Tokio, 15.1.-17.1.2020
DistribuTECH, 28.1.-30.1.2020, San Antonio, TX
BATTERY JAPAN, Tokyo, 26.2.-28.2.2020
BATTERY JAPAN, Osaka, 9.9.-11.9.2020
IMTS2020, 14.9.-19.9.2020, Chicago, IL
ISE 2021, Barcelona, Spain, 2.2.-5.2.2021
DistribuTECH, 9.2.-11.2.2021, San Diego, CA
BATTERY JAPAN, Tokyo, 3.3.-5.3.2021
BATTERY JAPAN, Osaka, 29.9.-1.10.2021
DistribuTECH, 25.1.-27.1.2022, Dallas, TX
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX
Interesting video
The ISS Design Challenge ...
Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara
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