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WIHA-SB24670
 
Multifunctional WIHA LED Torch
G2RV-SR
 
G2RV-SR interface relays from OMRON
LUP-20-LED
 
LUP-20-LED-SMD desktop magnifier
LinkSwitch™-XT2
 
Power Integrations Unveils High-Efficien
Tektronix AFG31000
 
Tektronix Redefines the Arbitrary/Functi
Ingenia Ambition X 1.5T MR
 
Philips launches Ingenia Ambition X 1.5T
VOMA617A
 
VOMA617A AEC-Q101 Qualified Optocouplers
ISOCELL Slim 3P9
 
Samsung Makes Image Sensor Integration E
Samsung PRO Endurance
 
Samsung Electronics Redefines High Endur
SSD NVMe 970 PRO
 
Samsung Electronics Sets New Performance

THERMFLOW® T777 Phase Change Material

THERMFLOW® T777 Phase Change Material 

Parker Chomerics' T777 thermally enhanced and inherently tacky phase change material

Parker Chomerics' THERMFLOW T777 is a thermally enhanced and inherently tacky phase change material designed to completely fill interfacial air gaps and voids within electronics assemblies. It is classified as polymer solder hybrid material (PSH).

The ability to completely fill air gaps and voids typical of component packages and heat sinks allows THERMFLOW pads to achieve performance superior to any other thermal interface materials.

At room temperature, THERMFLOW materials are solid and easy to handle. This allows them to be consistently and cleanly applied as dry pads to a heat sink or component surface. THERMFLOW material softens as it reaches component operating temperatures. With light clamping pressure, it will readily conform to both mating surfaces. Upon reaching the required melt temperature, the pad will fully change phase and attain minimum bond-line thickness (MBLT) of less than 0.001 inch or 0.0254 mm and maximum surface wetting. This results in practically no thermal contact resistance due to a very small thermal resistance path.

Features
  • Low thermal impedance
  • Can be pre-applied to heat sinks
  • Demonstrated reliability through thermal cycling and accelerated age testing
  • RoHS compliant
  • Protective release liners prevent contamination
  • Available in custom die-cut shapes and kiss-cut on rolls
Applications
  • Chipsets
  • Microprocessors
  • Graphics processors
  • Power modules
  • Memory modules
  • Power semiconductors
  • Superior thermal performance
  • Ideal solution for mobile microprocessors
  • Resin system designed for higher temperature reliability
  • Dispersed solder filler offers added thermal performance
  • UL 94 V-0 flammability rated
  • Tabs available for easy removal
  • Inherently tacky, no adhesive required


THERMFLOW® T777 Phase Change Material

Image Manufacturer Part Number Description Outline Thickness   View Details
THERMAFLOW 14X14MM 1=16 69-11-42336-T777 THERMAFLOW 14X14MM 1=16 14.00mm x 14.00mm 0.0045" (0.115mm)   View Details
THERMAFLOW 28X28MM 1=8 69-11-42339-T777 THERMAFLOW 28X28MM 1=8 28.00mm x 28.00mm 0.0045" (0.115mm)   View Details
THERMAFLOW 6X6 69-11-42342-T777 THERMAFLOW 6X6" SOLDER HYBRID 152.40mm x 152.40mm 0.0045" (0.115mm)   View Details

2018121504 / 29.12.2018 / Electronic-components / Digi-Key Electronics /
Mini Cool Edge 0.60 mm Connectors
Mini Cool Edge 0.60 mm Connectors
Amphenol ICC’s Mini Cool Edge connectors for right angle, mezzanine/coplanar, and support cable interconnect board-to-board applications
.....
STR-USBC-4PORT-200W-EVK Source Evaluation Platform
ON Semi's board allows evaluation of USB AC-DC 4-port 200 W source platform
.....
STR-USBC-4PORT-200W-EVK Source Evaluation Platform
Ultraviolet A (UVA) Series
Ultraviolet A (UVA) Series
SunLED’s UVA emitters offer 365 nm to 415 nm wavelengths in two different package types
.....
3K and 3J CANbus Keypads and Joysticks
Grayhill's 3J vehicle display controller and 3K CANbus keypad offer two options for CANbus applications
.....
3K and 3J CANbus Keypads and Joysticks
Wire-Marking Solutions
Wire-Marking Solutions
Phoenix Contact's marking systems help to easily identify and assign wires and cables
.....
GEM60I and GSM60E/U Series Medical Grade Wall-Mount Adapters
MEAN WELL’s GEM60I and GSM60E/U series can be plugged directly into AC outlets without pairing with an external AC cable
.....
GEM60I and GSM60E/U Series Medical Grade Wall-Mount Adapters
HBGC-300 Series Constant Power Mode LED Drivers
HBGC-300 Series Constant Power Mode LED Drivers
MEAN WELL’s HBGC-300 metal housing design and IP67 ingress protection level allow this series to fit both indoor and outdoor applications
.....
S32K116/K118 Automotive-Qualified MCUs
NXP's AEC Q100 MCUs feature CAN-FD and security in small CAN nodes
.....
S32K116/K118 Automotive-Qualified MCUs
XM112 Pulsed Coherent Radar Module
XM112 Pulsed Coherent Radar Module
Acconeer’s XM112 pulsed coherent radar module offers high precision distance measurement with mm accuracy and high update frequency
.....
DBR-3200 and DBU-3200 Series Fully Digital Intelligent Chargers
MEAN WELL’s 3200 W digitalized 1U slim size rack-mount and standalone high-performance charger
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DBR-3200 and DBU-3200 Series Fully Digital Intelligent Chargers
SMD-PEN Film Capacitors
SMD-PEN Film Capacitors
WIMA's SMD-PEN metallized polyethylene naphthalate (PEN) SMD film capacitors with box encapsulation
.....
THERMFLOW® T777 Phase Change Material
Parker Chomerics' T777 thermally enhanced and inherently tacky phase change material
.....
THERMFLOW® T777 Phase Change Material 
nRF9160 System-In-Package (SiP)
nRF9160 System-In-Package (SiP)
Nordic's SiP is a low power MCU with an integrated LTE-M and narrowband (NB)-IoT modem, as well as GPS
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DRP-3200/DPU-3200 Series Power Supplies
MEAN WELL presents 3200 W digitalized 1 U slim size rack mount and standalone high-performance power supplies
.....
DRP-3200/DPU-3200 Series Power Supplies
CHO-TOUCH™ Displays - Parker Chomerics' fully integrated, durable systems of optically bonded touchscreens and LCD units
CHO-TOUCH™ Displays - Parker Chomerics' fully integrated, durable systems of optically bonded touchscreens and LCD units
Parker Chomerics' CHO-TOUCH displays are fully integrated, durable systems of optically bonded touchscreens and LCD units designed to save assembly time and supply chain logistics. These assemblies are proven to work in applications where sunlight readability, vibration resistance, scratch resistance, and mechanical strength are needed.
.....
CHO-THERM® 1671 High Power Electrical Insulator Pads
Parker Chomerics' CHO-THERM 1671 2.6 W/m-K thermal conductivity is ideal for aerospace or defense cooling applications
.....
CHO-THERM® 1671 High Power Electrical Insulator Pads
MR1000 Series Detector Switches
MR1000 Series Detector Switches
E-Switch's MR1000 series switches are for use where position detection or sensing is required
.....
Smart Box Adds Plug-and-Play Control for Industrial Environments
EAO's innovative snap-on design provides easy integration without the need for special tools
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Smart Box Adds Plug-and-Play Control for Industrial Environments
Company of the week

MARVELL
Address Book


SMA Solar Technology AG


MARVELL


Taiwan Semiconductor


ROHM Semiconductor


Pickering Interfaces Ltd


ANRITSU


Mouser Electronics


NEXPERIA


RS Components GmbH


Transfer Multisort Elektronik Sp. z o.o.


SECTRON


FAULHABER


Willow Technologies


ABB


ACS Motion Control


Visual Communications Company, LLC


Sonderhoff Holding GmbH


LASER COMPONENTS


LEM


Hradil Spezialkabel GmbH


Radio Frequency Systems


Apacer Technology Inc.


Pico Technology


AERCO


MENCOM


Analog Devices


HIROSE ELECTRIC CO., LTD


AVNET


LG Innotek


PANDUIT
Calendary
AUTOMATICON 2019, Warsaw, PL, 26.-29.3.2019
HANNOVER MESSE 2019, 1.-5.4.2019, DE
Hong Kong International Lighting Fair, 6.-9.4.2019
4th Manufacturing World Nagoya, JPN, 17.-19.4.2019
LIGHTFAIR 2019, Philadelphia, PA USA, 21.5.-23.5.2019
SENSOR+TEST 2018, 26.-29.6.2019, Nuremberg, DE
SEMICON TAIWAN, Taipei, 18.9.-20.9.2019
NEPCON Japan, Nagoya, 18.9.-20.9.2019
BATTERY JAPAN, Osaka, 25.9.-27.9.2019
productronica 2019, Munich, DE, 12.-15.11.2019
NEPCON Japan, Tokio, 15.1.-17.1.2020
DistribuTECH, 28.1.-30.1.2020, San Antonio, TX
BATTERY JAPAN, Tokyo, 26.2.-28.2.2020
BATTERY JAPAN, Osaka, 9.9.-11.9.2020
IMTS2020, 14.9.-19.9.2020, Chicago, IL
ISE 2021, Barcelona, Spain, 2.2.-5.2.2021
DistribuTECH, 9.2.-11.2.2021, San Diego, CA
BATTERY JAPAN, Tokyo, 3.3.-5.3.2021
BATTERY JAPAN, Osaka, 29.9.-1.10.2021
DistribuTECH, 25.1.-27.1.2022, Dallas, TX
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX
Interesting video
The ISS Design Challenge ...
Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara
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