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AMD Ryzen™ based congatec COM Express mo

congatec doubles RAM support for Server-on-Modules
congatec – a leading vendor of standardized and customized embedded computer boards and modules – announces that its Intel Atom® C3000 processor based conga-B7AC Server-on-Modules now support up to 96 GB DDR4 SO-DIMM memory on 3 sockets. This is twice the previously supported capacity and sets a major new milestone for COM Express Type 7 based designs, as memory is one of the most important performance levers for embedded edge server technologies.

This performance leap was possible because the Intel Atom C3000 family supports the newly available 32 GB SO-DIMMs. The new Server-on-Modules with a high-speed memory bandwidth of 2400 MT/s are available now and can be ordered with and without ECC support.

“Further development of Server-on-Module technology is essential for embedded edge computing. Continuous RAM expansion is required to be able to offer the best possible server performance and capacity on an extremely compact footprint of only 125 x 95 mm. We are therefore very pleased to be the first Server-on-Module provider to offer such high storage capacity off the shelf. This performance leap underlines our passion for advancing the new Server-on-Modules standards, which incidentally has also made us the technology and market leader in this area,” explains Martin Danzer, Director of Product Management at congatec.

High memory capacity is essential for server applications, because the fastest way to read and write values from a database is to fully load them into memory. The larger the databases, the more memory capacity is needed. There are many database applications in the field of embedded edge computing, such as network appliances for content delivery in video surveillance applications, IoT gateways or OPC UA servers in automation. A large RAM is also a good intermediate buffer for Big Data analytics on the fly so that only smaller results need to be stored. Servers that host many virtual machines also benefit immensely from the doubled memory capacity: With 96 GB RAM, 12 virtual machines now have 8 GB RAM available on each partition – an ideal value for standard Linux or Windows installations.

The conga-B7AC Server-on-Modules with up to 96 GB RAM can be ordered in the following configurations and include personal integration support for OEMs off the shelf:

Processor Cores Intel® Smart Cache [MB] Clock [GHz] TDP [W]  Temperature range
Intel Atom® C3958 16 16 2.0 31 0 to +60 °C
Intel Atom® C3858 12 12 2.0 25 0 to +60 °C
Intel Atom® C3758 8 16 2.2 25 0 to +60 °C
Intel Atom® C3558 4 8 2.2 16 0 to +60 °C
Intel Atom® C3538 4 8 2.1 15 0 to +60 °C
Intel Atom® C3808 12 12 2.0 25 -40 to +85 °C
Intel Atom® C3708 8 16 1.7 17 0 to +60 °C
Intel Atom® C3508 4 8 1.6 11.5 -40 to +85 °C
Intel Atom® C3308 2 4 1.6 2.1 0 to +60 °C

More information about the conga-B7AC COM Express Type 7 Server-on-Modules is available at https://www.congatec.com/en/products/com-express-type-7/conga-b7ac.html 

2019010101 / 01.01.2019 / Embedded / congatec AG /

congatec COM-HPC Client modules with latest socketed Intel Core processors set performance record
Bringing a refreshing performance boost to the edge

congatec launches COM Express Compact module with brand new Intel® Core™ Ultra processors
Next-generation AI computing for the edge

congatec launches new ultra-rugged 13th Gen Intel Core Computer-on-Modules with soldered RAM
Shock and vibration resistant for harsh environments

congatec takes over sales of Real-Time Systems’ products
The target: holistic consolidation and digitization offerings

congatec welcomes ratification of COM-HPC 1.2 specification, introducing COM-HPC Mini
Maximum performance for mini footprints

congatec introduces new SMARC modules with TI Jacinto™ 7 TDA4x or DRA8x processors
High-end edge AI and vision processing in ultra-low power envelop

congatec COM Express modules receive IEC-60068 railway certification
Proven shock and vibration resistant for harsh environments

congatec adds TI processors to its strategic solutions portfolio
Building a high-performance ecosystem for Arm based SMARC modules

congatec and Kontron conclude joint COM-HPC evaluation carrier board standardization agreement
The goals: Reduce NRE costs, accelerate time-to-market, and improve product & supply security

Solution platforms for high-performance engineering
congatec will be presenting its enhanced high-performance landscape for edge computing at Automation World Korea (hall C, booth 534).

congatec introduces a new carrier board design training program
Accelerating knowledge transfer

congatec introduces first COM-HPC Mini modules at embedded world 2023
Small form factor to complete high-performance ecosystem

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Calendary
SENSOR+TEST 2024, 11.-13.6.2024, Nuremberg, DE
electronica 2024, 12.11.-15.11.2024, Munich, DE
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