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AR236.B & AR232.B
 
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Power Integrations Unveils High-Efficien

Reduce Production Costs and Time to Market with Industry’s First NOR Flash Memory Devices Featuring Embedded MAC Addresses

Reduce Production Costs and Time to Market with Industry’s First  

With no minimum order requirement, Microchip’s new family of memory devices offers pre-programmed MAC addresses for companies of all sizes

With the rapid growth of the Internet of Things (IoT), embedded system designers must currently source, program and serialize Media Access Control (MAC) addresses from the IEEE-Registration Authority (RA) for all connected products. Only sold from the IEEE-RA in blocks ranging from 4,000 to 16 million, small-to medium-size businesses are left to pay higher costs for low-volume services. Helping eliminate the need to self-procure and manage these unique identifiers from the IEEE-RA, Microchip Technology Inc. (Nasdaq: MCHP) today introduced the SST26VF Serial Quad I/O™ (SQI™) 3V Flash family— the industry’s first NOR Flash devices to offer integrated MAC address options. Pre-programmed with EUI-48 and EUI-64 addresses, the devices do not have a minimum order requirement, providing cost-effective, plug-and-play storage solutions for connected applications that use Ethernet, Bluetooth®, Wi-Fi®, IEEE 802.15.4 and FireWire®.

Both the EUI-48 and EUI-64 node addresses consist of an Organizational Unique Identifier (OUI) and an Extension Identifier (EI). While the OUI is purchased from the IEEE by individual companies, the EI is assigned and managed through each company by building a unique EI into every product, thereby ensuring a globally unique Extended Unique Identifier (EUI) node address for every device used or shipped. Microchip’s pre-programmed SST26VF family of devices are flexible MAC address chips that come with uniquely pre-programmed EUI-48 addresses and compatible EUI-64 addresses — helping designers save time and costs while accelerating time to market for low-to mid-sized volume production. MAC address options are available at Flash densities of 16 megabit (Mb), 32Mb and 64Mb.

The SST26VF064BEUI, SST26VF032BEUI and SST26VF016BEUI devices feature a six-wire, 4-bit I/O interface, allowing for low-power and high-performance operation in a low pin-count package. Available in 8-pin SOIC and 8-contact WSON packages, the devices occupy less board space and lower overall system costs. They feature rich SQI flash, with flexible write-protected functionality to ensure code cannot be inadvertently over-written or erased. Integrated with Microchip’s proprietary SuperFlash® technology, the family offers high endurance, low operating currents and low power draw, making these devices ideally suited for industrial and consumer cloud-connected applications, such as smart hubs for homes, smart home appliances, building control equipment, factory automation, security and surveillance equipment.

 “Following the success of Microchip’s pre-programmed MAC address and unique ID EEPROMs, we are now expanding the embedded product option into our SuperFlash® memory product line,” said Randy Drwinga, vice president of Microchip’s memory products division. “Combined with our broad lineup of microcontrollers, wired and wireless offerings and pre-programming services, the SST26VF family offers a complete turnkey solution for today’s IoT designers.”

Development Tools

Microchip offers pre-programming services for customer firmware.

Pricing and Availability

The SST26VF064BEUI is available for $2.37, the SST26VF032BEUI is available for $1.46 and the SST26VF016BEUI is available for $1.13, each in 10,000-unit quantities.

For additional information, contact a Microchip sales representative, authorized worldwide distributor or visit Microchip’s website. To sample products mentioned here visit www.microchip.com/samples. To purchase products mentioned here visit our purchasing portal.

2019071203 / 12.07.2019 / Electronic-components / Microchip Technology Inc. /

Reduce Production Costs and Time to Market with Industry’s First  
Reduce Production Costs and Time to Market with Industry’s First NOR Flash Memory Devices Featuring Embedded MAC Addresses
With no minimum order requirement, Microchip’s new family of memory devices offers pre-programmed MAC addresses for companies of all sizes
.....
Microchip Introduces First Clock Buffers to Meet DB2000Q/QL Standards Plus PCIe Gen 4 and Gen 5 Low Jitter Specifications
20-output PCIe clock buffer is ideal for next-generation servers, data centers, storage devices and other PCIe applications
.....
Microchip Introduces First Clock Buffers to Meet DB2000Q/QL Standards  
Accelerate EMI Qualification of Automotive Touchscreens with New Capacitive Touch Controllers 
Accelerate EMI Qualification of Automotive Touchscreens with New Capacitive Touch Controllers
maXTouch® TD family of touchscreen controllers significantly increases signal-to-noise ratio in nine- to 20-inch touchscreens
.....
Fast Data Rates Meet High Accuracy in Microchip’s New Analog-to-Digital Converter Families
With data rates of up to 153.6 kSPS and a compact package size, the 24-bit and 16-bit ADCs improve system performance in high precision applications
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Fast Data Rates Meet High Accuracy in Microchip’s 
Single-Port USB Smart Hub ICs Optimize System Costs for Automotive Manufacturers 
Single-Port USB Smart Hub ICs Optimize System Costs for Automotive Manufacturers
As demand for in-vehicle entertainment and smartphone applications continues to grow, automotive manufacturers must provide dependable and convenient connectivity in designs — all while optimizing system costs.
.....
Preserve Legacy Low Pin Count (LPC) Investments with the Industry’s First Commercial eSPI to LPC Bridge
Device allows industrial computing developers to integrate the eSPI standard in existing equipment, minimizing development costs and extending product lifecycles
.....
Preserve Legacy Low Pin Count (LPC) Investments 
Industry’s first terabit-scale Ethernet PHY
Industry’s first terabit-scale Ethernet PHY enables highest-density 400 GbE and FlexE connectivity
Microchip, via its Microsemi subsidiary, is the first to enable a unique set of capabilities with its META-DX1 family of Ethernet Physical-Layer (PHY) devices. The family enables telecom service providers to build out networks using routing and switching platforms that reduce costs, optimize bandwidth and increase capacity, security and flexibility.
.....
Eight-port switch supports new IEEE 802.3bt Power over Ethernet (PoE) standard to create cost-effective smart lighting systems
Microchip Technology Inc., via its Microsemi subsidiary, announces a cost-effective eight-port Power over Ethernet (PoE) switch which provides guaranteed power of 60 Watts (W) per port for all eight ports simultaneously. Ideal for digital ceiling installations, the IEEE 802.3bt-compliant PDS-408G PoE switch runs noise-free with a fanless design.
.....
Eight-port switch supports new IEEE 802.3bt Power over Ethernet (PoE) standard
Microchip expands carrier-grade time and synchronisation portfolio to solve network deployment, reliability and scalability challenges
Microchip expands carrier-grade time and synchronisation portfolio to solve network deployment, reliability and scalability challenges
Microchip announces, via its Microsemi subsidiary, additions to its Precision Time Protocol (PTP) PackeTime® portfolio, including the TimeProvider 4100 Release 2.0. The additions provide solutions to one of the biggest 5G network deployment challenges of synchronising higher volumes of more densely packed base stations.
.....
Microchip announces production release of Silicon Carbide (SiC) products for high-voltage, reliable power electronics
Microchip announces, via its Microsemi subsidiary, the production release of a family of SiC power devices that offer proven ruggedness and the performance benefits of wide-bandgap technology. Complemented by Microchip’s broad range of microcontrollers (MCUs) and analogue solutions, the SiC devices join a growing family of reliable SiC products.
.....
Microchip announces production release of Silicon Carbide (SiC) 
Scale Space Applications with COTS-to-Radiation-Tolerant and Radiation-Hardened Arm® Core MCUs 
Scale Space Applications with COTS-to-Radiation-Tolerant and Radiation-Hardened Arm® Core MCUs
Devices enable designers to begin development with a commercial device before moving to different levels of radiation-qualified versions, reducing development time and costs
.....
Build Larger, More Robust Applications with Microchip’s Expanded Dual- and Single-core dsPIC Digital Signal Controller (DSC) Family
New dsPIC33C devices meet market demand for more memory and functional safety features in automotive and wireless charging applications
.....
Build Larger, More Robust Applications with Microchip’s Expanded Dual- and Single-core dsPIC Digital Signal Controller (DSC) Family 
Industry’s First Automotive USB 3.1 SmartHub with Type-C™ Support  
Industry’s First Automotive USB 3.1 SmartHub with Type-C™ Support Enables 10x Faster Data Rates in Infotainment Systems
5 Gbps SmartHub IC meets the increasing connectivity needs of today’s smartphone market
.....
Develop Low-power Wireless Sensor Nodes with the Industry’s Smallest Regulatory-certified Sub-GHz Module
Microchip’s SAM R30 module provides multiple years of battery life for robust proprietary networks while reducing time to market
.....
Develop Low-power Wireless Sensor Nodes with the Industry’s Smallest  
MPLAB® Harmony Version 3.0 Unifies Software Development Framework  
MPLAB® Harmony Version 3.0 Unifies Software Development Framework for PIC® and SAM Microcontrollers
Enhanced tool chain accelerates development with modular software downloads and simplified drivers
.....
New SAR ADC Family Enables High-Speed, High-Resolution Analog-to-Digital Conversion in Harsh Environments
As the industry’s only 1 Msps fully AEC-Q100-qualified 16-bit SAR, the 12 new devices are designed to operate in high temperatures and electromagnetic environments
.....
New SAR ADC Family Enables High-Speed, High-Resolution  
Connect PIC® MCU Applications to Google Cloud in Minutes with  
Connect PIC® MCU Applications to Google Cloud in Minutes with Microchip’s New Development Board for Cloud IoT Core
Solution enables large ecosystem of PIC MCU applications to easily add secure cloud connectivity to next-generation designs
.....
PCIe 3.1 Ethernet Bridges Using Low-Power Sub-States Enable Power Savings for Embedded and Automotive Platforms
New devices give customers established supply, worldwide support, design review services and fully released drivers
.....
PCIe 3.1 Ethernet Bridges Using Low-Power Sub-States Enable Power Savings for Embedded and Automotive Platforms 
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Calendary
NEPCON Japan, Nagoya, 18.9.-20.9.2019
SEMICON TAIWAN, Taipei, 18.9.-20.9.2019
BATTERY JAPAN, Osaka, 25.9.-27.9.2019
electronicAsia 2019, Hong Kong, 13.10.-16.10.2019
Hong Kong Electronics Fair, 13.10.-16.10.2019
TAITRONICS 2019, Taipei, Taiwan, 16.10.-18.10.2019
productronica 2019, Munich, DE, 12.-15.11.2019
NEPCON Japan, Tokio, 15.1.-17.1.2020
DistribuTECH, 28.1.-30.1.2020, San Antonio, TX
BATTERY JAPAN, Tokyo, 26.2.-28.2.2020
BATTERY JAPAN, Osaka, 9.9.-11.9.2020
IMTS2020, 14.9.-19.9.2020, Chicago, IL
ISE 2021, Barcelona, Spain, 2.2.-5.2.2021
DistribuTECH, 9.2.-11.2.2021, San Diego, CA
BATTERY JAPAN, Tokyo, 3.3.-5.3.2021
BATTERY JAPAN, Osaka, 29.9.-1.10.2021
DistribuTECH, 25.1.-27.1.2022, Dallas, TX
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX
Interesting video
The ISS Design Challenge ...
Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara
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