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CES 2020: Infineon presents the world’s smallest 3D image sensor for face authentication and photo effects on smartphones and the like

CES 2020: Infineon presents the world’s smallest 3D image sensor for face authentication and photo effects on smartphones and the like

Munich/Las Vegas, Germany/USA, 6 January 2020 – Reliable face authentication, improved photo functions and authentic augmented reality experiences: 3D depth sensors assume a key role in smartphones and for applications that rely on accurate 3D image data.

Infineon Technologies AG has collaborated with software and 3D Time of Flight system specialist pmdtechnologies ag to develop the world’s smallest and at the same time most powerful 3D image sensor, and is presenting it at CES in Las Vegas. The new REAL3™ single-chip solution measures just 4.4 x 5.1 mm and is the fifth generation of successful time-of-flight deep sensors from Infineon. In addition to its small dimensions, which allow it to be incorporated into even the smallest devices with just a few elements, the chip provides the highest resolution data with low power consumption.

“With the fifth generation of our REAL3™ chip we are once again demonstrating our leading position in the field of 3D sensors,” says Andreas Urschitz, President of the Power Management and Multimarket Division at Infineon, which also includes sensor business. “It’s robust, reliable, powerful, energy efficient and at the same time decisively small. We see great growth potential for 3D sensors, since the range of applications in the areas of security, image use and context-based interaction with the devices will steadily increase.” The 3D sensor also allows the device to be controlled via gestures, so that human-machine interaction is context-based and without touch.

Deep sensor technology from Infineon

The depth sensor time-of-flight technology enables an accurate 3D image of faces, hand details or objects which is relevant when it must be ensured that the image matches the original. This is already applied in payment transactions using mobile phones or devices that need no bank details, bank cards or cashiers and the payment is carried out instead via facial recognition. This requires an extremely reliable and secure image and return transmission of the high-resolution 3D image data. The same applies to securely unlocking devices with a 3D image. The Infineon 3D image sensor also implements this in particular in extreme lighting conditions such as strong sunlight or in the dark.

Furthermore, the chip provides additional options for ambitious photos with cameras, for example, with enhanced autofocus, bokeh effect for photo and video, and improved resolution in poor lighting conditions. Real-time full-3D mapping also allows authentic augmented reality experiences to be presented.

Development and availability

The new 3D image sensor chip (IRS2877C) was developed in Graz, Dresden and Siegen and combines the expertise of Infineon’s and pmdtechnologies’ German and Austrian locations. Series production will begin in the middle of 2020. In addition, Infineon Technologies offers an optimized illumination driver (IRS9100C) that further improves performance, size and cost as a complete solution. More information on Infineon’s 3D image sensor family can be found at www.infineon.com/real3.

About pmdtechnologies ag

pmdtechnologies ag, a fabless IC company headquartered in Siegen, Dresden and Ulm/Germany with subsidiaries in the USA, China and Korea, is the worldwide leading 3D Time-of-Flight CMOS-based digital imaging technology supplier. Started up in 2002, the company owns over 350 worldwide patents concerning pmd-based applications, the pmd measurement principle and its realization. Addressed markets for pmd's 3D sensors are industrial automation, automotive and the wide field of consumer applications like smartphones. Further information is available at pmdtec.com.

2020011003 / 10.01.2020 / Electronic-components / Infineon Technologies AG /

CES 2020: Infineon presents the world’s smallest 3D image sensor for face authentication and photo effects on smartphones and the like
CES 2020: Infineon presents the world’s smallest 3D image sensor for face authentication and photo effects on smartphones and the like
Munich/Las Vegas, Germany/USA, 6 January 2020 – Reliable face authentication, improved photo functions and authentic augmented reality experiences: 3D depth sensors assume a key role in smartphones and for applications that rely on accurate 3D image data.
.....
3D image sensor: Infineon enables easy smartphone unlock by face recognition
One megatrend feature in mobile communications is to unlock smartphones by 3D face recognition instead of fingerprint or PIN. Making authentication more convenient and more secure, it may soon become indispensable for mobile payment applications and mobile ID. With the 3D image sensor chip from Infineon Technologies AG the unlock-with-your-face feature becomes smarter, faster and more reliable.
.....
3D image sensor: Infineon enables easy smartphone unlock by face recognition
New high voltage MOSFET for highly efficient low and high power applications
New high voltage MOSFET for highly efficient low and high power applications
Infineon Technologies AG extends its existing portfolio of CoolMOS™ technologies with the 600 V CoolMOS™ P7 and 600 V CoolMOS™ C7 Gold (G7) series. The product families are designed to operate at 600 V breakdown voltage and deliver improved superjunction MOSFET performance. They achieve unmatched power density in the respective target applications.
.....
AURIX™ microcontroller TC3xx family of Infineon fuels automated driving and electromobility
Serving the requirements of automated cars and electric vehicles Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today launched the next generation of its AURIX™ microcontroller family. The TC3xx microcontrollers offer the highest level of integration on the market and real-time performance that is three times higher than that available today.
.....
AURIX™ microcontroller TC3xx family of Infineon fuels automated driving and electromobility
CoolMOS™ CE in SOT-223 package as cost-effective drop-in replacement for DPAK
CoolMOS™ CE in SOT-223 package as cost-effective drop-in replacement for DPAK
Infineon Technologies is growing the portfolio of CoolMOS™ CE with a SOT-223 package. For Infineon’s CoolMOS, this package offers a cost effective alternative to DPAK as well as space savings in some designs with low power dissipation. The SOT-223 package without middle pin is fully compatible with a typical DPAK footprint and can be used as a drop-in replacement for DPAK. This new package targets customer designs in LED lighting and mobile charger applications.
.....
Infineon enables new high-performance FPGA development platform
Infineon Technologies announced that its Digital Point-of-Load (PoL) DC-DC regulators with full PMBus capabilities are featured in the Kintex® UltraScale™ development board. A key driver for the design flexibility of the board is the superior PMBus connectivity of the IR3806x family. Configurations can be stored in internal memory. In addition, PMBus commands allow run-time control, fault status and telemetry.
.....
Infineon enables new high-performance FPGA development platform
EtherCAT® implementation made easy and cost-efficient with XMC4300 microcontrollers 
EtherCAT® implementation made easy and cost-efficient with XMC4300 microcontrollers
EtherCAT® implementation complexity and cost can be reduced with the XMC4300 microcontroller series of Infineon Technologies AG. Without compromise to EtherCAT communication features, the XMC4300 has been specifically developed for cost-sensitive industrial applications that also make high demands on design flexibility, connectivity and real-time performance.
.....
Company of the week

ICP Deutschland GmbH
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Address Book


ICP Deutschland GmbH


Yamaichi Electronics USA Inc.


SEMTECH


Microchip Technology Inc.


EM Microelectronic


Murata Power Solutions Inc


Advantech


Keysight Technologies


XP Power Limited


Fischer Connectors SA


Nicomatic


TE Connectivity


akYtec GmbH


SOS electronic s.r.o.


MARVELL


Taiwan Semiconductor


ROHM Semiconductor


Pickering Interfaces Ltd


ANRITSU


Mouser Electronics


NEXPERIA


RS Components GmbH


Transfer Multisort Elektronik Sp. z o.o.


SECTRON


FAULHABER


Willow Technologies


ABB


ACS Motion Control


Visual Communications Company, LLC


Sonderhoff Holding GmbH
Calendary
DistribuTECH, 28.1.-30.1.2020, San Antonio, TX
APEX EXPO 2020, San Diego, 4.2.-6.2.2020
embedded world 2020, Nuremberg, 25.2.-27.2.2020
BATTERY JAPAN, Tokyo, 26.2.-28.2.2020
Light + Building, Frankfurt am Main, 8.3.-13.3.2020
AMPER 2020, Brno, CZ, 17.3.-20.3.2020
SECUTECH 2020, Taipei, 22.4.-24.4.2020
PCIM Europe, Nuremberg, 5.5.-7.5.2020
SMTconnect 2020, Nuremberg, 5.5.-7.5.2020
LED Expo Mumbai 2020, 7.5.-9.5.2020
SPS Italia, Fiere di Parma, 26.5.-28.5.2020
Wire & Cable Guangzhou, China, 27.5.-29.5.2020
Automechanika Dubai, 7.6.-9.7.2020
hardware+tools, Dubai, UAE, 7.6.-9.6.2020
ELEKTRO 2020, MOSCOW, Russia, 8.6.-11.6.2020
PCIM Asia, Shanghai, 1.7.-3.7.2020
SPS Automation Middle East, Dubai, 20.8.-21.8.2020
Intersec Buenos Aires, 26.8.-28.8.2020
Automechanika Frankfurt, DE, 8.9.-12.9.2020
BATTERY JAPAN, Osaka, 9.9.-11.9.2020
IMTS2020, 14.9.-19.9.2020, Chicago, IL
Interlight Russia, Moscow, 14.9.-17.9.2020
Prolight + Sound NAMM, Moscow, 17.9.-19.9.2020
Prolight + Sound Shanghai, 28.10.-30.10.2020
SPS 2020, Nuremberg, 24.11.-26.11.2020
ISE 2021, Barcelona, Spain, 2.2.-5.2.2021
DistribuTECH, 9.2.-11.2.2021, San Diego, CA
BATTERY JAPAN, Tokyo, 3.3.-5.3.2021
BATTERY JAPAN, Osaka, 29.9.-1.10.2021
DistribuTECH, 25.1.-27.1.2022, Dallas, TX
Interesting video
The ISS Design Challenge ...
Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara
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