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NEXPERIA


Nexperia announces lowest RDS(on) MOSFETs in LFPAK56 and LFPAK33 without compromising other vital parameters
Nexperia announced its lowest-ever RDS(on) NextPower S3 MOSFETs in Trench 11 technology that have been achieved without compromising other important parameters such as drain current (ID(max)), Safe Operating Area (SOA) or gate charge QG.
Nexperia announces industry’s smallest logic parts approved for automotive
Nexperia announced that over twenty logic types in the company’s space-saving leadless MicroPak packages are now AEC-Q100 qualified. These logic solutions are the smallest devices of their type suitable for automotive applications and Nexperia’s Q100 portfolio exceeds the Automotive Electronics Council’s requirements.
Independence pays off; Nexperia achieves outstanding results
Nexperia, the global leader in discretes, logic and MOSFET devices, today announced that in just two years as a standalone company, it is significantly out-performing the market, achieving growth figures of over 35%, introducing more new products and expanding its annual manufacturing capacity to more than 100 billion parts. Increased investment has led to an increase in market share as the company has been able to fulfill customer demand.
Nexperia launches 40 V low RDS(on) automotive MOSFETs in a 3x3 mm footprint for demanding powertrain applications
Nexperia introduced a portfolio of low RDS(on) 40 V AEC-Q101 MOSFETs targeting space-constricted, increased-power modules in demanding powertrain applications. Housed in the miniature, LFPAK33 package which has a footprint of only 10.9 mm² and a pitch of just 0.65 mm, devices use Nexperia’s Trench 9 technology.
Nexperia and Avnet Celebrate 50 Years of Success
Two industry leaders deliver performance and quality Nexperia, the global leader in discretes, logic and MOSFET devices, and global technology solutions provider Avnet, which supports customers from idea to design and from prototype to production, today announce celebrating a half century of successfully working together with strong results.
Nexperia MOSFETs deliver Best-In-Class Safe Operating Area and improved RDS(on) for Hot Swap designs
Ensures no compromise between protection and operating efficiency
New 175°C AEC-Q101 MOSFETs in miniature leadless packages from Nexperia enable automated inspection
Nexperia announced the industry’s first AEC-Q101-qualified MOSFETs that are both rated for use at up to 175 °C and are available in the AOI-compatible DFN2020 package (DFN = Discrete Flat No leads). More, the new devices measure just 2 mm x 2 mm, much smaller and lighter than SOT223 and SO8-packages yet with comparable electrical and thermal performance.
Nexperia announces smallest logic package that can be used without a step-down mask
Nexperia announced the four pin X2SON4 package which is the smallest logic package that can be used without requiring an expensive and fragile step-down mask. Therefore, PCB assembly is quicker, easier, more reliable and more cost-effective.
Nexperia’s new ESD protection series for USB Type-C deliver industry’s highest surge robustness and lowest trigger voltage
Nexperia announced that it has optimised its TrEOS ESD protection diode series for use with USB Type-C interfaces. The new USB3.2 standard introduces an optional capacitor at the Rx inputs, so Nexperia is now launching two groups of devices, one that delivers extremely high surge robustness for positioning between the connector and capacitor, and a second that has an extremely low trigger voltage for placement between capacitor and the system chip.
New LFPAK56 MOSFETs from Nexperia feature improved creepage and clearance, meeting UL2595
Nexperia announced that two of its LFPAK56-packaged portfolio of MOSFETs are now available with improved creepage and clearance to meet UL2595 requirements for battery-powered equipment rated between 15 and 32 V.
Nexperia launches lowest RDS(on) automotive MOSFETs down to 0.9 mΩ
Nexperia announced the release of the company’s lowest RDS(on) automotive-qualified MOSFETs. The AEC-Q101 Trench 9, 40 V automotive superjunction MOSFETs in the rugged, electrically- and thermally-efficient LFPAK56E deliver a footprint reduction of up to 81% when compared to traditional solutions such as bare die modules, D2PAK or D2PAK-7 devices.
Nexperia opens significant expansion at Guangdong Assembly and Test facility
Nexperia today formerly opened a significant expansion to its ATGD discrete semiconductor assembly and test plant in Guangdong, China. The total production and warehouse site now covers an area of around 72,000 square meters, adding an extra 16,000 square meters of production space.


Company of the week

BALLUFF

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GAMING, COMPUTER ACCESSORIES AND OTHER RELATED PRODUCTS


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE


Video Report from AMPER 2022


INDUSTRIAL PRESSURE TRANSDUCERS FROM CYNERGY3


Address Book


BALLUFF

Seica


PEI-Genesis

KEYENCE


CML Microcircuits

SAMTEC


ams-OSRAM

INTEL


TDK Corporation

Giada


RS group

NOKIA


ANRITSU

Digi-Key Electronics


AERS

Flex Power Modules


Danisense

BINDER


Parker Hannifin

MOXA


DANFOSS

Alliance Memory


Intelliconnect (Europe) Ltd.

KIOXIA Europe GmbH


Antenova Ltd

Friedrich Lütze GmbH


Analog Devices

ASRock Industrial


NVIDIA

Yamaichi Electronics USA Inc.


Calendary
SENSOR+TEST 2024, 11.-13.6.2024, Nuremberg, DE
electronica 2024, 12.11.-15.11.2024, Munich, DE
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara

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