Address Book
 

AERS
 

Flex Power Modules
 

Danisense
 

BINDER
 

Parker Hannifin
 

MOXA
 

DANFOSS
 

Alliance Memory
 

Intelliconnect (Europe) Ltd.
 

KIOXIA Europe GmbH
 

Antenova Ltd
 

Friedrich Lütze GmbH
 

Analog Devices
 

ASRock Industrial
 

NVIDIA

28.05.2023 0:07:11
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Interesting video
Various

MANSON SDP-2210
 
MANSON SDP-2210 PROGRAMMABLE LABORATORY
DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo
BHI260AB
 
An All-in-One Programmable Smart Sensor
BAHCO
 
BAHCO set of insulated wrenches
s-Sense
 
s-Sense modules from R&D SOFTWARE SOLUTI
TH381
 
TH381 series miniature, high IP rated co
TP-1303
 
Twintex TP-1000 series dual channel powe
T5808
 
TDK announces world’s first MIPI standar
Portable SSD T7 Touch
 
Samsung Releases Portable SSD T7 Touch –
Embedded


congatec adds TI processors to its strategic solutions portfolio
Building a high-performance ecosystem for Arm based SMARC modules
Renesas Cellular-to-Cloud Development Kits Now Connect Seamlessly to Microsoft Azure Cloud Services
Azure-Certified Kits Featuring both RA and RX Families of 32-bit MCUs Enable Reliable and Secure End-to-End Cloud Solutions
congatec and Kontron conclude joint COM-HPC evaluation carrier board standardization agreement
The goals: Reduce NRE costs, accelerate time-to-market, and improve product & supply security
Solution platforms for high-performance engineering
congatec will be presenting its enhanced high-performance landscape for edge computing at Automation World Korea (hall C, booth 534).
congatec introduces first COM-HPC Mini modules at embedded world 2023
Small form factor to complete high-performance ecosystem
congatec expands its portfolio of COM-HPC Computer-on-Modules with 13th Gen Intel Core processor to include high-end variants with LGA socket
The ultimate performance boost consolidated edge applications have been waiting for
congatec introduces new Computer-on-Modules with 13th Gen Intel Core processors
Happy new year for high-end embedded computers: The world’s fastest Client Computer-on-Modules generation is here
PICMG COM-HPC committee approves COM-HPC Mini pinout
Mini form factor for maximum performance
Fanless embedded IPC for the DIN rail01.12.2022
Weight-reduced DIN rail PC with power-saving processors
congatec welcomes COM Express 3.1 specification with compliant Computer-on-Modules
Performance boost now standard-compliant
Accelerating the real-time digitization
congatec introduces its ecosystem for TSN networked real-time factories and critical infrastructures
ATX mainboard with fast expansion slots
The IMBA-Q471 completes the portfolio of ATX mainboards from ICP Germany. In addition to the well-known IMBA-Q470, the new IMBA-Q471 is a variant that is exclusively equipped with PCI Express slots of the third generation. The third generation offers transfer rates of nearly 16GByte per second. This makes the interface almost twice as fast as its predecessor version.
congatec introduces high-performance COM-HPC carrier board in Micro-ATX form factor
Modular high-end Micro-ATX carrier for more sustainable and ultra-scalable COM-HPC based system designs
congatec launches five new COM-HPC Server Size D modules with Intel Xeon D-2700 processors following the “less is more” approach
An advance into the world of mixed-critical real-time servers
First Motion Controller GM1 launched by Panasonic Industry
With up to 32 axis synchronized torque control, the GM1 offers a compact solution for complex motion control applications.
Modular 5G cells for real-time communications
Real-time capable 5G cells with integrated edge servers are a key enabling technology for digital transformation, opening a plethora of new opportunities for IIoT, Industry 4.0 and critical infrastructure applications.
congatec simplifies Arm deployments with i.MX 8M Plus
Arm Project Cassini completed: congatec modules with NXP i.MX 8M Plus processor now Arm SystemReady IR certified
TSN synchronized real-time over 5G
congatec introduces Computer-on-Modules for collaborative 5G robots and material handling systems at Smart Factory & Automation World
Company of the week

AERS

Interesting video


Video Report from AMPER 2022


INDUSTRIAL PRESSURE TRANSDUCERS FROM CYNERGY3


"Electronics is Magic" Adam Kuczyński Talks About Innovations - TME on Electronica 2022 [INTERVIEW]


Introducing NVIDIA DGX A100


Webinar | Realtime and AI integration with COM-HPC


Address Book


AERS

Flex Power Modules


Danisense

BINDER


Parker Hannifin

MOXA


DANFOSS

Alliance Memory


Intelliconnect (Europe) Ltd.

KIOXIA Europe GmbH


Antenova Ltd

Friedrich Lütze GmbH


Analog Devices

ASRock Industrial


NVIDIA

Yamaichi Electronics USA Inc.


PICMG

Laird Thermal Systems


HARTING

Jenoptik


MACH SYSTEMS s.r.o.

A.P.O. - ELMOS v.o.s.


Pico Technology

Lynred


Advantech

EBV


SECO S.p.A.

Crowd Supply


Digi-Key Electronics

Durakool


Calendary
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara

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