Address Book
 

NeoCortec
 

PULSIV
 

MikroElektronika d.o.o.
 

Panasonic Industry
 

Cambridge GaN Devices
 

Traco Power
 

BALLUFF
 

Seica
 

PEI-Genesis
 

KEYENCE
 

CML Microcircuits
 

SAMTEC
 

ams-OSRAM
 

INTEL
 

TDK Corporation

30.12.2024 0:07:25
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Interesting video
Various

Access Point WBE750
 
NETGEAR Unveils the Ultimate Tri-band Wi
Intel Core 14th Gen i9
 
Intel Core 14th Gen i9-14900KS Powers De
DDRH-15/30/45/60
 
Mean Well’s DDRH Series Isolated Ultra-W
TimeProvider® 4500 Series
 
TimeProvider® 4500 Series Is the Industr
IAM-20381HT
 
TDK announces new 3-axis accelerometer,
Microchip’s 5071B
 
New Cesium Atomic Clock Provides Autonom
POLOLU-4980
 
MINIATURE STEP-UP/STEP-DOWN CONVERTERS F
MANSON SDP-2210
 
MANSON SDP-2210 PROGRAMMABLE LABORATORY
DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo
Embedded


First Motion Controller GM1 launched by Panasonic Industry
With up to 32 axis synchronized torque control, the GM1 offers a compact solution for complex motion control applications.
Modular 5G cells for real-time communications
Real-time capable 5G cells with integrated edge servers are a key enabling technology for digital transformation, opening a plethora of new opportunities for IIoT, Industry 4.0 and critical infrastructure applications.
congatec simplifies Arm deployments with i.MX 8M Plus
Arm Project Cassini completed: congatec modules with NXP i.MX 8M Plus processor now Arm SystemReady IR certified
TSN synchronized real-time over 5G
congatec introduces Computer-on-Modules for collaborative 5G robots and material handling systems at Smart Factory & Automation World
congatec introduces vehicle computing technology for smart mobility at Intertraffic Amsterdam
Embedded computing engines that put smart vehicle developers into the fast lane
ASRock Industrial Releases the Next-level Powerhouse NUC 1200 BOX Series Mini PCs
ASRock Industrial launched NUC 1200 BOX Series Mini PCs and NUC 1200 Motherboard Series, the next-level Powerhouse taking evolutionary leaps with 12th Gen Intel® Core™ Processors (Alder Lake-P).
World premiere for x86 based COM-HPC Server
congatec introduces three new Server-on-Module families with Intel Xeon D processors
COM-HPC Carrier Design Guide compliant ecosystem
congatec welcomes the publication of the COM-HPC Carrier Board Design Guide by the PCI Industrial Computer Manufacturers Group (PICMG) with the launch of a fully specification compliant ecosystem for engineers of COM-HPC Client and Server module based designs.
PICMG releases brand new COM-HPC Carrier Board Design Guide
The design guide supplements the COM-HPC specification for high performance compute modules
A quantum leap in core count
congatec launches 10 new COM-HPC and COM Express Computer-on-Modules with 12th Gen Intel Core processors
congatec and SYSGO join forces
Computer-on-Modules meet functional safety and security
Real-Time Over the Air
congatec introduces new platforms and design strategies for 5G connected mobile and stationary devices
ARDUINO – COMMUNICATION USING THE ETHERNET NETWORK
For many years, the creation of extensive computer networks has ceased to serve only for connecting computers.
Brand new Qseven upgrade: NXP i.MX 8
New congatec module with i.MX 8M Plus gives Qseven designs a massive performance boost for the future
Wireless communication in IoT systems using Arduino MKR modules
One of the biggest problems currently facing the Internet of Things (IoT) devices market is its high fragmentation. The multitude of devices and communication protocols makes it very difficult to build a uniform and functional system if you decide to use components from different manufacturers.
Leading edge, in more than just bandwidth
congatec sets a new benchmark with the launch of 20 new Computer-on-Modules with 11th Gen Intel Core processors (formerly codenamed: Tiger Lake-H)
New ultra-rugged 11th Gen Intel® Core® congatec modules with soldered RAM
congatec ntroduces new 11th Gen Intel® Core® processor based Computer-on-Modules with soldered RAM for highest shock and vibration resistance. Designed to withstand even extreme temperature ranges of -40°C to +85°C, the new COM Express Type 6 Computer-on-Modules provide full compliance for shock and vibration resistant operation in challenging transportation and mobility applications.
congatec i.MX 8M Plus starter set for AI accelerated embedded vision applications
Fast track to NPU accelerated smart vision
Company of the week

NeoCortec

Interesting video


electronica—Leading the way to the All Electric Society


GAMING, COMPUTER ACCESSORIES AND OTHER RELATED PRODUCTS


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE


Video Report from AMPER 2022


Address Book


NeoCortec

PULSIV


MikroElektronika d.o.o.

Panasonic Industry


Cambridge GaN Devices

Traco Power


BALLUFF

Seica


PEI-Genesis

KEYENCE


CML Microcircuits

SAMTEC


ams-OSRAM

INTEL


TDK Corporation

Giada


RS group

NOKIA


ANRITSU

Digi-Key Electronics


AERS

Flex Power Modules


Danisense

BINDER


Parker Hannifin

MOXA


DANFOSS

Alliance Memory


Intelliconnect (Europe) Ltd.

KIOXIA Europe GmbH


Calendary
intersec Dubai 2025, 14.-16.1.2025
DistribuTECH, 11.2.-13.2.2025, Dallas, TX
asiamold select, Guangzhou, CHN, 25.-27.2.2025
embedded world 2025, Nuremberg, 11.–13.3.2025
AMPER 2025, Brno, CZ, 18.-20.3.2025
productronica China, Shanghai, 26.-28.3.2025
electronica China 2025, Shanghai, 15.-17.4.2025
electronica India 2025, Dehli, 17.-19.9.2025
SEMICON Europa, München, DE, 18.-21.11.2025
productronica 2025, München, DE, 18.-21.11.2025
electronica 2026, München, DE, 10.-13.11.2026

Interesting video
The ISS Design Challenge ...


Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


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