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Access Point WBE750
 
NETGEAR Unveils the Ultimate Tri-band Wi
Intel Core 14th Gen i9
 
Intel Core 14th Gen i9-14900KS Powers De
DDRH-15/30/45/60
 
Mean Well’s DDRH Series Isolated Ultra-W
TimeProvider® 4500 Series
 
TimeProvider® 4500 Series Is the Industr
IAM-20381HT
 
TDK announces new 3-axis accelerometer,
Microchip’s 5071B
 
New Cesium Atomic Clock Provides Autonom
POLOLU-4980
 
MINIATURE STEP-UP/STEP-DOWN CONVERTERS F
MANSON SDP-2210
 
MANSON SDP-2210 PROGRAMMABLE LABORATORY
DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo
Embedded


COM-HPC Carrier Design Guide compliant ecosystem
congatec welcomes the publication of the COM-HPC Carrier Board Design Guide by the PCI Industrial Computer Manufacturers Group (PICMG) with the launch of a fully specification compliant ecosystem for engineers of COM-HPC Client and Server module based designs.
PICMG releases brand new COM-HPC Carrier Board Design Guide
The design guide supplements the COM-HPC specification for high performance compute modules
A quantum leap in core count
congatec launches 10 new COM-HPC and COM Express Computer-on-Modules with 12th Gen Intel Core processors
congatec and SYSGO join forces
Computer-on-Modules meet functional safety and security
Real-Time Over the Air
congatec introduces new platforms and design strategies for 5G connected mobile and stationary devices
ARDUINO – COMMUNICATION USING THE ETHERNET NETWORK
For many years, the creation of extensive computer networks has ceased to serve only for connecting computers.
Brand new Qseven upgrade: NXP i.MX 8
New congatec module with i.MX 8M Plus gives Qseven designs a massive performance boost for the future
Wireless communication in IoT systems using Arduino MKR modules
One of the biggest problems currently facing the Internet of Things (IoT) devices market is its high fragmentation. The multitude of devices and communication protocols makes it very difficult to build a uniform and functional system if you decide to use components from different manufacturers.
Leading edge, in more than just bandwidth
congatec sets a new benchmark with the launch of 20 new Computer-on-Modules with 11th Gen Intel Core processors (formerly codenamed: Tiger Lake-H)
New ultra-rugged 11th Gen Intel® Core® congatec modules with soldered RAM
congatec ntroduces new 11th Gen Intel® Core® processor based Computer-on-Modules with soldered RAM for highest shock and vibration resistance. Designed to withstand even extreme temperature ranges of -40°C to +85°C, the new COM Express Type 6 Computer-on-Modules provide full compliance for shock and vibration resistant operation in challenging transportation and mobility applications.
congatec i.MX 8M Plus starter set for AI accelerated embedded vision applications
Fast track to NPU accelerated smart vision
More power for low power 24/7 systems
congatec doubles performance with AMD Ryzen™ Embedded V2000 processor
congatec SMARC 2.1 modules with NXP i.MX 8M Plus processor
Low power flagship for embedded vision and AI
Getting in the fast lane to Gen4
congatec starter set for COM-HPC™ with 11th Gen Intel® Core™ processors
Advantech Launches PCA-6029 Full-Sized PICMG 1.0 Single-Board Computer to Support Legacy IPCs
Advantech, a leading provider of industrial computing platforms, is pleased to announce PCA-6029, its latest full-sized PICMG 1.0 single-board computer (SBC). Powered by a 6th/7th gen Intel® Core™ i processor, PCA-6029 delivers high-performance computing and flexible I/O expansion to support complex industrial applications.
World’s first TPM 2.0 with open-source software stack cuts down security integration efforts in industrial, automotive and IoT applications
Trusted Platform Modules (TPM) enable secured remote software updates, disc encryption and user authentication. Hence, they are crucial for connected industrial, automotive and other embedded devices.
Flat Mini ITX motherboard for Comet Lake processors
Behind the term PH11CMI hides a new motherboard from ICP Germany in the Thin Mini-ITX form factor, which supports the 10th generation of Intel® CoreTM processors. The mainboard in the classic size of 170 x 170 mm only has a height of 20 mm.
Inkplate 10, Now at Crowd Supply, Uses Recycled E-Paper Displays with Wi-Fi Support and Low Power Performance
Crowd Supply announces the launch of Inkplate 10, a Wi-Fi-enabled, ESP32-based board with a recycled 9.7-inch e-paper display. Inkplate 10 uses recycled e-paper screens from Kindles and other e-readers, delivering benefits such as high contrast, impressive energy efficiency, and daylight readability.
Company of the week

BALLUFF

Interesting video


GAMING, COMPUTER ACCESSORIES AND OTHER RELATED PRODUCTS


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE


Video Report from AMPER 2022


INDUSTRIAL PRESSURE TRANSDUCERS FROM CYNERGY3


Address Book


BALLUFF

Seica


PEI-Genesis

KEYENCE


CML Microcircuits

SAMTEC


ams-OSRAM

INTEL


TDK Corporation

Giada


RS group

NOKIA


ANRITSU

Digi-Key Electronics


AERS

Flex Power Modules


Danisense

BINDER


Parker Hannifin

MOXA


DANFOSS

Alliance Memory


Intelliconnect (Europe) Ltd.

KIOXIA Europe GmbH


Antenova Ltd

Friedrich Lütze GmbH


Analog Devices

ASRock Industrial


NVIDIA

Yamaichi Electronics USA Inc.


Calendary
SENSOR+TEST 2024, 11.-13.6.2024, Nuremberg, DE
electronica 2024, 12.11.-15.11.2024, Munich, DE
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara

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