Address Book
 

A.P.O. - ELMOS v.o.s.
 

MACH SYSTEMS s.r.o.
 

Pico Technology
 

Lynred
 

Advantech
 

EBV
 

SECO S.p.A.
 

Crowd Supply
 

Digi-Key Electronics
 

Durakool
 

KEMET
 

CODICO
 

Future Electronics
 

Foremost Electronics
 

Littelfuse

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DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo
BHI260AB
 
An All-in-One Programmable Smart Sensor
BAHCO
 
BAHCO set of insulated wrenches
s-Sense
 
s-Sense modules from R&D SOFTWARE SOLUTI
TH381
 
TH381 series miniature, high IP rated co
TP-1303
 
Twintex TP-1000 series dual channel powe
T5808
 
TDK announces world’s first MIPI standar
Portable SSD T7 Touch
 
Samsung Releases Portable SSD T7 Touch –
AR236.B & AR232.B
 
APAR AR236.B & AR232.B radio loggers

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WEBINAR: Telematics Innovation: Opportunities & Challenges .. June 30th, 2020, 02:00 p.m. (CET)
As automotive telematics continues to enhance driving performance and experience, it’s creating opportunities for OEMs and the extended supply chain. We’re seeing huge amounts of innovation taking place in this field, helping to improve digital cockpits, in-vehicle connectivity, security and more.

congatec presents Intel® IoT RFP Kit for workload consolidation in vision based situational awareness applications
See and understand

Microchip Introduces 3 kW Transient Voltage Suppressor Diode Array Family for Superior Circuit Protection in Harsh Environments
Highest reliability diode arrays available protect aircraft, space systems and critical infrastructure from surges, spikes and electrostatic events

Philips Lumify handheld ultrasound solution launched in Japan to enable powerful diagnostics at the bedside

Ochrana osobních údajů (GDPR)
Provozovatel internetového portálu prohlašuje, že osobní údaje získané v souvislosti s provozem internetového obchodu zpracovává v souladu s nařízením Evropského parlamentu a Rady EU 2016/679 o ochraně fyzických osob v souvislosti se zpracováním osobních údajů ( známé jako GDPR).

Nexperia announces next generation 650 V Gallium Nitride (GaN) Technology
Next-gen GaN technology targets automotive, 5G and datacenter applications; Devices available packaged in TO-247 and innovative Copper Clip SMD

Microchip Switchtec™ PAX Advanced Fabric Gen 4 PCIe Switches Released to Production
Switchtec PAX PCIe fabric solutions provide greater flexibility and scalability for data center and cloud AI and ML architectures

Arrow Electronics, Panasonic Industry, and STMicroelectronics Join Forces to Deliver IoT Modules for Smart Applications
Low-Power Wireless Multi-Sensor Edge-Intelligence Modules Address Smart Factory, Smart Home and Smart Life Solutions

WEBINAR: NXP Introduces New MIFARE DESFire EV3 IC
JUNE 16, 2020 | 60-MINUTE WEBINAR | 9:00 AM CEST

Lattice Accelerates FPGA-based Processor Design with New IP Ecosystem and Design Environment
Lattice Propel Provides RISC-V Support and a Robust IP Portfolio to Enable Development of Processor-based Systems in Minutes

NXP Introduces MIFARE DESFire EV3 IC, Ushers In New Era of Security and Connectivity for Contactless Smart City Services
NXP Semiconductors today announced its new MIFARE DESFire EV3 IC that ushers in next-generation performance, advanced security and seamless integration of mobile services for a new era of security and connectivity in smart city services.

KEMET Extends KC-LINK™ Range Using KONNEKT™ High-Density Packaging Technology
Designed for use by power electronics engineers where high-power density and high efficiency in a small form factor is critical

Silicon Germanium (SiGe) rectifiers from Nexperia combine cutting-edge high efficiency, thermal stability and space-savings
AEC-Q101 approved devices with 120 V, 150 V, and 200 V combine best attributes of Schottky and fast recovery diodes

CoolSiC™ MOSFET 1700 V SMD enables best efficiency and reduced complexity for high voltage auxiliary power supplies
Infineon Technologies AG complements its CoolSiC™ MOSFET offering with yet another voltage class. Having added 650 V to the portfolio earlier this year, the company is now launching the 1700 V class with its proprietary trench semiconductor technology.

Noise suppression sheets by KEMET – forget about problems with interference
Self-adhesive noise suppression sheets by KEMET are designed to eliminate noise and high frequency interference. They are perfect for reducing electromagnetic interference (EMI) generated by electronic devices or suppressing radio frequency interference (RFI). Thanks to the use of modern materials, the sheets are thin and flexible, and their operating temperature ranges from -40°C to 105°C.

Murata introduces common mode noise filters for high-speed differential interfaces such as USB4
Murata Manufacturing Co., Ltd. has introduced the NFG0QHB_HS2 series of multilayer type common mode noise filters for high-speed differential interfaces (USB4, USB3.2 Gen1/2, HDMI2.1, etc.). Mass production of these products will start in May 2020.

Low-voltage stepper motor controller
TME offer includes a stepper motor controller by POLOLU, based on the STSPIN220 chip. This product is available in two versions – with and without soldered connectors. The module can cooperate with bipolar stepper motors at 1.8V to 10V operating voltage and maximum current of 1.1A per phase (without using a heatsink). The controller offers step resolution from full steps to 1/256. Selection is made by appropriate configuration of signals on M0-M4 inputs.

51M-STA series cylindrical solenoids
51M-STA series cylindrical solenoids provide high force at a low spindle stroke and have a long service life and reliability. The entire STA series is based on a low-friction system between the spindle and the coil housing, ensuring 25 million trouble-free solenoid activations. Furthermore, STA solenoids are shock and vibration resistant, so they can be used in extreme environmental conditions.


Company of the week

A.P.O. - ELMOS v.o.s.

Interesting video


Brand new Qseven upgrade: NXP i.MX 8 | conga-QMX8-Plus


ENERGETAB 2021 Poland, Bielsko Biala, 14.9.-16.9.2021


New COM-HPC Client size B & COM Express Type 6 size Basic with 11th Gen Intel® Core (Tiger Lake-H)


11th Gen Intel® Core™ processors with two new design options - COM Express & COM-HPC | Interview


ORNO - OR-WAT-419 Power Meter [electricity consumption calculator]


Address Book


A.P.O. - ELMOS v.o.s.


MACH SYSTEMS s.r.o.


Pico Technology


Lynred


Advantech


EBV


SECO S.p.A.


Crowd Supply


Digi-Key Electronics


Durakool


KEMET


CODICO


Future Electronics


Foremost Electronics


Littelfuse


Mouser Electronics


RUTRONIK


Infineon Technologies AG


TTI, Inc.


ANRITSU


Power Integrations


AXIOMTEK


TDK Corporation


VISHAY


STMicroelectronics


Texas Instruments


Molex, LLC


ON Semiconductor


NeoPhotonics


Murata Manufacturing Co.,



Calendary
MSV 2021 - Brno, 8.-12.11.2021
SPS 2021 - Nuremberg, 23.–25.11.2021
DistribuTECH, 25.1.-27.1.2022, Dallas, TX
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara



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