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Access Point WBE750
 
NETGEAR Unveils the Ultimate Tri-band Wi
Intel Core 14th Gen i9
 
Intel Core 14th Gen i9-14900KS Powers De
DDRH-15/30/45/60
 
Mean Well’s DDRH Series Isolated Ultra-W
TimeProvider® 4500 Series
 
TimeProvider® 4500 Series Is the Industr
IAM-20381HT
 
TDK announces new 3-axis accelerometer,
Microchip’s 5071B
 
New Cesium Atomic Clock Provides Autonom
POLOLU-4980
 
MINIATURE STEP-UP/STEP-DOWN CONVERTERS F
MANSON SDP-2210
 
MANSON SDP-2210 PROGRAMMABLE LABORATORY
DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo
Various


New modular 10GbE micro server carrier board from congatec in the Mini-STX form factor
congatec introduces a deployment ready design study of a micro server carrier board with 10GbE support. The modular server board in the 5x5 inch Mini-STX form factor (140mm x 147mm) offers high scalability across all suitable embedded server processor sockets thanks to its COM Express Type 7 slot. This enables 10GbE edge node performance upgrades at lowest cost, as nearly all investments in the real-time system design of 10GbE edge nodes can be re-used. To upgrade the performance, OEMs and network operators only need to exchange the Server-on-Module.
Premier Farnell announces the launch of the new Raspberry Pi 3 Model B+
Premier Farnell, the Development Distributor, is pleased to announce the launch of the Raspberry Pi 3 Model B+, the fastest and most powerful version yet, perfecting the already outstandingly successful Raspberry Pi 3 Model B.
MACOM to Drive Cloud Data Centers and 5G Optical Connectivity with L-PIC Enabled Solutions for CWDM4
MACOM Technology Solutions Inc. announced the MAOT-025402 CWDM4 transmitter optical sub-assembly as a part of MACOM’s L-PIC™ (Laser-integrated Silicon Photonic Integrated Circuit) solution for 100Gbps CWDM4. Leveraging our patented L-PIC the MAOT-025402 is designed to mate with the MASC-37053A CDR to form the complete high speed transmit path for QSFP28 CWDM4 solutions.
Nexperia opens significant expansion at Guangdong Assembly and Test facility
Nexperia today formerly opened a significant expansion to its ATGD discrete semiconductor assembly and test plant in Guangdong, China. The total production and warehouse site now covers an area of around 72,000 square meters, adding an extra 16,000 square meters of production space.
Cypress' Latest Bluetooth WICED Evaluation Boards, Now at Mouser, Deliver Industry-Leading Performance for IoT
Mouser Electronics, Inc. is now stocking the EZ-BT™ WICED dual-mode module evaluation board and the EZ-BLE™ WICED module evaluation board from Cypress Semiconductor. Designed to evaluate Cypress' Bluetooth® Wireless Internet Connectivity for Embedded Devices (WICED) modules, the evaluation boards allow engineers to develop fully certified, fully programmable Bluetooth Smart and Bluetooth Smart Ready devices for use in a variety of Internet of Things (IoT) applications, including those in the medical, industrial, and consumer markets.
Lattice Releases Next-Generation FPGA Software for Development of Broad Market Low Power Embedded Applications
New Lattice Radiant Software Enables Predictable Design Convergence with Unparalleled Ease of Use
InvenSense ICP-10100 Low-Power, Waterproof MEMS Sensor Now at Mouser, Delivers Accurate Pressure and Temp Reads
Mouser Electronics, Inc. is now stocking the ICP-10100 MEMS capacitive barometric pressure sensor from InvenSense, a TDK Group company. The ICP-10100 achieves the industry's lowest pressure noise and power consumption and ensures excellent temperature stability for applications such as drones, mobile devices, Internet of Things (IoT), and wearables.
Mouser Electronics Signs Global Distribution Agreement with IIoT Solutions Provider Sierra Monitor
Mouser Electronics, Inc. announces a global distribution agreement with Sierra Monitor Corporation, a provider of Industrial Internet of Things (IIoT) solutions that connect and protect high-value infrastructure assets.
Mouser Electronics Launches Volume Two of Methods E-zine, Looks Ahead to Top Developments of 2018
Mouser Electronics, Inc. announces the first issue in volume two of its popular Methods e-zine. This latest issue, titled "2018 Look Ahead: Design & Technology," explores key developments to come this year as well as their social ramifications.
Mouser Signs Global Agreement to Distribute Espressif's Wireless SoCs and Modules for IoT
Mouser Electronics, Inc. announces a global distribution agreement with Espressif Systems. Through the agreement, Mouser is now an authorized distributor of Espressif's popular and affordable line of ESP8266 and ESP32-based low-power wireless systems-on-chip (SoCs), modules, and development boards for Internet of Things (IoT) applications.
Premier Farnell announces availability of the LulzBot TAZ 6 and LulzBot Mini 3D printers
3D printers provide production grade prints, reliability and ease-of-use for beginners and 3D professionals
Mouser Electronics Signs Global Deal to Distribute Insight SiP Turnkey BLE Modules
Mouser Electronics, Inc. announces a global distribution agreement with Insight SiP, providers of ready-to-use radio frequency (RF) modules for Bluetooth® low energy applications. Through the agreement, Mouser will stock Insight SiP’s Bluetooth low energy modules, designed for low-power wireless connectivity applications, such as telecom and mobile computing, portable consumer devices, health care, connected automobiles, industrial, and Internet of Things (IoT).
Mouser- and Molex-Sponsored Formula E Team Preps for Marrakesh E-Prix
TTI Joins Molex and Mouser in Supporting Electric Car Tech for Fourth Consecutive Year
Fujitsu Chooses Lattice’s SiBEAM Snap Wireless Connector Technology to Simplify USB Connections in Next-Generation Tablet PC
Lattice’s SB6212 and SB6213 USB3 Devices Improve Ease of Use and Reliability of Connecting the Tablet to the Docking Cradle
Company of the week

NeoCortec

Interesting video


electronica—Leading the way to the All Electric Society


GAMING, COMPUTER ACCESSORIES AND OTHER RELATED PRODUCTS


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE


Video Report from AMPER 2022


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NeoCortec

PULSIV


MikroElektronika d.o.o.

Panasonic Industry


Cambridge GaN Devices

Traco Power


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Seica


PEI-Genesis

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CML Microcircuits

SAMTEC


ams-OSRAM

INTEL


TDK Corporation

Giada


RS group

NOKIA


ANRITSU

Digi-Key Electronics


AERS

Flex Power Modules


Danisense

BINDER


Parker Hannifin

MOXA


DANFOSS

Alliance Memory


Intelliconnect (Europe) Ltd.

KIOXIA Europe GmbH


Calendary
intersec Dubai 2025, 14.-16.1.2025
DistribuTECH, 11.2.-13.2.2025, Dallas, TX
AMPER 2025, Brno, CZ, 18.-20.3.2025

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara

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