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A.P.O. - ELMOS v.o.s.
 

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Lynred
 

Advantech
 

EBV
 

SECO S.p.A.
 

Crowd Supply
 

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Durakool
 

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DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo
BHI260AB
 
An All-in-One Programmable Smart Sensor
BAHCO
 
BAHCO set of insulated wrenches
s-Sense
 
s-Sense modules from R&D SOFTWARE SOLUTI
TH381
 
TH381 series miniature, high IP rated co
TP-1303
 
Twintex TP-1000 series dual channel powe
T5808
 
TDK announces world’s first MIPI standar
Portable SSD T7 Touch
 
Samsung Releases Portable SSD T7 Touch –
AR236.B & AR232.B
 
APAR AR236.B & AR232.B radio loggers

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Outdoor LoRaWAN Gateway for the Internet of Things
The new UG87 from ICP Deutschland features IP67 all-round protection and up to 16 simultaneous channels. This enables the gateway to be used outdoors and to receive data from Class A and Class C devices within a range of max. 10 km and to pass it on to data centres.

OKYSTAR 2x25W power amplifier module with Bluetooth
OKYSTAR power amplifier operates in class D and is characterized by low power losses and very high efficiency. An unquestionable advantage of the module is the built-in Bluetooth wireless communication interface for audio signal. OKYSTAR module is not fitted with a standard audio input. In the age of omnipresent smartphones, the module can be used to build your own “Bluetooth speaker”.

M12 – Y-Circ M with Internal Push-Pull Locking
With the M12 push-pull with inner locking, Yamaichi is taking the next innovation step in the field of M12 connectors. The cable-side connector engages into the device socket from the inside with locking hooks. As a result, the push-pull system requires only the same installation space as a common M12 connection with screw locking.

Semtech’s LoRa® Devices Reduce Energy Waste with Smarter Metering Applications
Solutions from Elmeasure and ClodPi track and report usage data in real time for precise billing and efficient utilities

Microchip Announces Industry’s First Space-Qualified COTS-Based Radiation-Tolerant Ethernet Transceiver and Embedded Microcontroller
Radiation-qualified devices enable expanded Ethernet connectivity for space applications

Short-cycle transfers up to ten times faster: Rexroth presents the TS 2 Booster workpiece pallet
The new modular assembly for the TS 2plus transfer system reduces cycle times and positions workpieces with great precision.

Digi-Key Electronics Helps Companies Innovate Faster at Embedded World 2020
Visit Booth 4A-633 for Interactive Technical Demos, Giveaways and More

Infrared cameras seeing 4x more details than their predecessors
The new TG267 and TG297 infrared cameras significantly accelerate the thermal diagnostics process. The features like 160x120px resolution, MSX combined image, new laser, larger display or easy data transfer to mobile devices are now available for the better price than you would ever expect.

Power Integrations’ Highly Robust SCALE-iDriver Gate Drivers Achieve AEC-Q100 Automotive Qualification
Power Integrations announced the launch of its automotive-qualified SID1181KQ SCALE-iDriver™ gate driver for 750 V-rated IGBTs. The new part expands the company’s range of auto-qualified driver ICs, following the introduction of the 1200 V SID1182KQ driver IC.

Microchip Simplifies Functional Safety Requirements with MPLAB TÜV SÜD-certified Tools
Further help with documentation requirements aided by new MPLAB Code Coverage testing and diagnostic tool

TDK announces world’s first MIPI standard SoundWire® microphone
TDK Corporation (TSE: 6762) introduces the world’s first MIPI Standard SoundWire® microphone for mobile, IoT and other consumer devices. This multimode microphone pushes the boundaries of digital microphone acoustic performance while providing advanced feature sets with very low power.

New series of power supplies from CELLEVIA POWER
Check the new series of specialised power supplies from CELLEVIA POWER that are now available at TME:

More than meets the eye: Bosch enables the next generation of smartglasses
At CES® in Las Vegas, Nevada, Bosch Sensortec launches an innovative optical Light Drive system for smartglasses. The Bosch Smartglasses Light Drive module is a sole source, all-in-one technology stack consisting of MEMS mirrors, optical elements, sensors, and onboard processing. This integrated solution delivers a clean visual experience with bright images that are always in focus – even in direct sunlight.

APEX EXPO 2020, San Diego, 4.2.-6.2.2020
IPC APEX EXPO is the largest event for electronics manufacturing in North America attracting more than 9,000 professionals from 45 countries. From the industry’s leading technical conference and application-focused professional development courses, to the innovation-driven exhibit floor, year after year IPC APEX EXPO is packed with far-reaching ideas and insights.

FIS5084 Easily Detects HFC Leakage
A brief guide on how the FIS module for refrigerant leads detection works, a summary of its features, and technical details you cannot find in a publicly available datasheet.

Samsung Releases Portable SSD T7 Touch – the New Standard in Speed and Security for External Storage Devices
Samsung’s newest pocket-sized external solid state drive delivers lightning-fast speeds and convenient fingerprint security in a sleek, durable package

OMRON OCB BLDC power tools switches
TME offer now includes C3AW-1A-8F switches by OMRON OCB. They are equipped with a main power supply contact, a rotation direction selection contact and a speed control potentiometer. The trigger shape ensures ergonomics during the work. The switches also have electrical connections in the form of an 8-core flat cable, and their operating voltage is 42V DC.

CES 2020: Infineon presents the world’s smallest 3D image sensor for face authentication and photo effects on smartphones and the like
Munich/Las Vegas, Germany/USA, 6 January 2020 – Reliable face authentication, improved photo functions and authentic augmented reality experiences: 3D depth sensors assume a key role in smartphones and for applications that rely on accurate 3D image data.


Company of the week

Laird Thermal Systems

Interesting video


Intel Alder Lake Product Video


Brand new Qseven upgrade: NXP i.MX 8 | conga-QMX8-Plus


ENERGETAB 2021 Poland, Bielsko Biala, 14.9.-16.9.2021


New COM-HPC Client size B & COM Express Type 6 size Basic with 11th Gen Intel® Core (Tiger Lake-H)


11th Gen Intel® Core™ processors with two new design options - COM Express & COM-HPC | Interview


Address Book


Laird Thermal Systems


HARTING


Jenoptik


MACH SYSTEMS s.r.o.


A.P.O. - ELMOS v.o.s.


Pico Technology


Lynred


Advantech


EBV


SECO S.p.A.


Crowd Supply


Digi-Key Electronics


Durakool


KEMET


CODICO


Future Electronics


Foremost Electronics


Littelfuse


Mouser Electronics


RUTRONIK


Infineon Technologies AG


TTI, Inc.


ANRITSU


Power Integrations


AXIOMTEK


TDK Corporation


VISHAY


STMicroelectronics


Texas Instruments


Molex, LLC



Calendary
DistribuTECH, 25.1.-27.1.2022, Dallas, TX
HANNOVER MESSE 2022, 25.4.-29.4. 2022 - “The biggest transfo
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara



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