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Seica
 

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Access Point WBE750
 
NETGEAR Unveils the Ultimate Tri-band Wi
Intel Core 14th Gen i9
 
Intel Core 14th Gen i9-14900KS Powers De
DDRH-15/30/45/60
 
Mean Well’s DDRH Series Isolated Ultra-W
TimeProvider® 4500 Series
 
TimeProvider® 4500 Series Is the Industr
IAM-20381HT
 
TDK announces new 3-axis accelerometer,
Microchip’s 5071B
 
New Cesium Atomic Clock Provides Autonom
POLOLU-4980
 
MINIATURE STEP-UP/STEP-DOWN CONVERTERS F
MANSON SDP-2210
 
MANSON SDP-2210 PROGRAMMABLE LABORATORY
DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo
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Nexperia’s new bipolar junction transistors in DPAK-package deliver high reliability performance for automotive and industrial applications
MJD series now available covering 2 – 8 A and 45 – 100 V and strengthening Nexperia’s power portfolio
Replace Silicon IGBTs with Industry’s Most Rugged Silicon Carbide Power Solutions Now Available at 1700V
Silicon carbide portfolio with 1700V MOSFET die, discrete and power module devices extend designers’ options for efficiency, power density
Microchip Announces Production Shipments of Industry’s First NVMe and 24G SAS Tri-mode RAID and HBA Storage Adapters
Adaptec® Smart Storage Adapters Provide Increased Performance, Security and Scalability While Simplifying Storage Management
INFRARED LEDS IN SMD PACKAGES
The TME catalogue includes a wide range of infrared LEDs. The noticeable market trend in favour of the miniaturisation of devices forces manufacturers to search for solutions combining high power (ca. 1W) with a small size of SMD components. For this reason, today we present one of such solutions: PK2S-series IR LEDs, which are the smallest SMD power diodes offered by ProLight.
New Ethernet PHYs Enable Multidrop Bus Architecture, Enhancing Industrial Networks’ Scalability and Functionality
Microchip’s LAN867x family of Ethernet PHYs is the first to implement the IEEE® 10BASE-T1S single-pair Ethernet technology standard for connecting devices in industrial networks
Farnell now stocking 3D printers from BCN3D Technologies
Customers can now achieve high quality production-grade 3D printing with BCN3D’s unique dual extrusion architecture and independent two-head design.
New Qi 1.3 Wireless Charging Reference Design Unveiled to Accelerate Development of Automotive and Consumer Qi Transmitter
Microchip’s Qi 1.3 reference design is compliant with the recently released Qi 1.3 specification and includes everything needed to quickly develop a Qi 1.3 certified transmitter
Nexperia obtains 100% ownership of Newport Wafer Fab, to be renamed Nexperia Newport.
Welsh semiconductor plant to focus on MOSFETs, IGBT, Analog and Compound Semiconductor Automotive-grade products
element14 Presents celebrates its 500th Episode and announces Winners of the Build Inside the Box Challenge
‘Build Inside the Box’ contestants participated in a competition that looked similar to Food Network’s ‘Chopped,’ a cooking challenge in which chef contestants must create a palatable dish using the ingredients they are given.
ITEC emerges as independent semiconductor equipment manufacturer in time to address semiconductor shortage with highest productivity chip-assembly systems
Fastest assembly and electrical test equipment; integrated smart manufacturing solutions using Big Data and machine learning for optimised Industry 4.0
Microchip is First to Achieve JEDEC Qualification for a Radiation-Tolerant (RT) FPGA in a Plastic Package
Low-power RTG4 FPGA offers new space system designers the industry’s highest reliability at lowest cost with shortest lead times
New ultra-rugged 11th Gen Intel® Core® congatec modules with soldered RAM
congatec ntroduces new 11th Gen Intel® Core® processor based Computer-on-Modules with soldered RAM for highest shock and vibration resistance. Designed to withstand even extreme temperature ranges of -40°C to +85°C, the new COM Express Type 6 Computer-on-Modules provide full compliance for shock and vibration resistant operation in challenging transportation and mobility applications.
New Lattice Radiant 3.0 Design Software Further Enhances Ease of Use to Accelerate FPGA Designs
LiPol rechargeable batteries for industrial applications
EEMB's 3.7V lithium-polymer batteries in an ultra-thin design, with high capacity, long life and low weight, are ideal for various mobile devices even in harsh industrial environments.
First products from Nexperia’s new Manchester 8-inch wafer line are industry-leading Qrr Figure of Merit 80 V / 100 V MOSFETs
Nexperia announced that the first products to be made in the company’s new 8-inch wafer line in Manchester, UK, will be low RDS(on), low Qrr 80 V and 100 V MOSFETs using its latest NextPower silicon technology.
New Lattice CertusPro-NX General Purpose FPGAs Deliver Advanced System Bandwidth and Memory Capabilities to Edge Applications
Highest Logic Density Lattice Nexus-Based Product Family Features Best-in-Class Power Efficiency, Performance, and Small Form Factor
Innovative Ultra High Density Offline Power Solutions from ON Semiconductor
ON Semiconductor® announces industry’s first dedicated critical conduction mode (CrM) totem pole PFC controller as a new addition to their solution set for ultra-high density offline power supplies.
Pico Technology celebrates 30th anniversary with 30 years of continuous growth!
Today, Pico Technology celebrates 30 years of business. Pico’s oscilloscopes, data loggers and RF equipment are used by engineers, scientists and technicians around the globe to bring their products to market. Pico automotive diagnostics products help save time and money for vehicle manufacturers and service organisations on every continent.
Company of the week

NeoCortec

Interesting video


electronica—Leading the way to the All Electric Society


GAMING, COMPUTER ACCESSORIES AND OTHER RELATED PRODUCTS


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE


Video Report from AMPER 2022


Address Book


NeoCortec

PULSIV


MikroElektronika d.o.o.

Panasonic Industry


Cambridge GaN Devices

Traco Power


BALLUFF

Seica


PEI-Genesis

KEYENCE


CML Microcircuits

SAMTEC


ams-OSRAM

INTEL


TDK Corporation

Giada


RS group

NOKIA


ANRITSU

Digi-Key Electronics


AERS

Flex Power Modules


Danisense

BINDER


Parker Hannifin

MOXA


DANFOSS

Alliance Memory


Intelliconnect (Europe) Ltd.

KIOXIA Europe GmbH


Calendary
intersec Dubai 2025, 14.-16.1.2025
DistribuTECH, 11.2.-13.2.2025, Dallas, TX
asiamold select, Guangzhou, CHN, 25.-27.2.2025
AMPER 2025, Brno, CZ, 18.-20.3.2025
productronica China, Shanghai, 26.-28.3.2025
electronica China 2025, Shanghai, 15.-17.4.2025
electronica India 2025, Dehli, 17.-19.9.2025
SEMICON Europa, München, DE, 18.-21.11.2025
productronica 2025, München, DE, 18.-21.11.2025
electronica 2026, München, DE, 10.-13.11.2026

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


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