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Access Point WBE750
 
NETGEAR Unveils the Ultimate Tri-band Wi
Intel Core 14th Gen i9
 
Intel Core 14th Gen i9-14900KS Powers De
DDRH-15/30/45/60
 
Mean Well’s DDRH Series Isolated Ultra-W
TimeProvider® 4500 Series
 
TimeProvider® 4500 Series Is the Industr
IAM-20381HT
 
TDK announces new 3-axis accelerometer,
Microchip’s 5071B
 
New Cesium Atomic Clock Provides Autonom
POLOLU-4980
 
MINIATURE STEP-UP/STEP-DOWN CONVERTERS F
MANSON SDP-2210
 
MANSON SDP-2210 PROGRAMMABLE LABORATORY
DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo
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Brand new Qseven upgrade: NXP i.MX 8
New congatec module with i.MX 8M Plus gives Qseven designs a massive performance boost for the future
Nexperia surface-mount device passes Board Level Reliability requirements for automotive application
Reliable and rugged CFP15B clip-bond FlatPower package selected by leading Tier 1 automotive supplier for use on an engine control unit
Power Integrations Introduces SCALE-iFlex Single Plug-and-Play Gate Drivers for “New Dual” Modules
SCALE-2 technology optimizes footprint, improves efficiency, performance and reliability of power inverters and converters to 3300 V
Wireless communication in IoT systems using Arduino MKR modules
One of the biggest problems currently facing the Internet of Things (IoT) devices market is its high fragmentation. The multitude of devices and communication protocols makes it very difficult to build a uniform and functional system if you decide to use components from different manufacturers.
Digi-Key Electronics Announces 2021 Back2School Prize Draw
Sweepstakes Fosters Innovation and Learning for Students
Microchip Unveils Industry’s Most Compact 1.6T Ethernet PHY with Up to 800 GbE Connectivity for Cloud Data Centers, 5G and AI
META-DX2L enables routers, switches and line cards to double their bandwidth by transitioning to 112G PAM4 interface rates
ENERGETAB 2021 Poland, Bielsko Biala, 14.9.-16.9.2021
The 34th Bielsko–Biała International Power Industry Fair ENERGETAB®2021 will take place from 14 to 16 September on the premises of ZIAD Bielsko-Biała SA. The ENERGETAB is the largest international fair of modern equipment, apparatus and technologies for energy industry in Poland. It is the venue of the most important meetings with the leading representatives of the power sector as well as designers and service providers, both from Poland and abroad.
DLR at IAA Mo­bil­i­ty 2021
At the IAA Mobility 2021 in Munich, the German Aerospace Center (Deutsches Zentrum für Luft- und Raumfahrt DLR) is showing how climate protection and mobility in road transport can be reconciled. The spotlight will be on two futuristic prototypes: the Safe Light Regional Vehicle (SLRV) and U-Shift. The SLRV is an extremely light yet very safe 'hydrogen-powered runabout'.
Smart High Level Synthesis (HLS) Tool Suite Enables C++ Based Algorithm Development Using Microchip’s PolarFire® FPGA Platform
Enhances Accessibility to PolarFire FPGAs for Hardware Acceleration in Edge Compute Systems
Advantech AIW-355 5G Module Accelerates the Next Wireless Transformation
Advantech release the newest member of the AIW-300 series — the AIW-355. This innovative 5G module marks a milestone for Advantech Industrial Wireless (AIW) and is designed for AIoT solutions that require ubiquitous connectivity, dynamic mobility, and extreme security. AIW-355 is an excellent choice for use in edge computing devices, mobile gateways, and diverse globally deployed mobile devices.
Nexperia launches ‘Power Live’ September 21-23 2021
Participate in live discussions on GaN, MOSFETs, power diodes and bipolar transistors for automotive and industrial applications; View on-demand video demos direct from Nexperia’s labs
New Chip Scale Atomic Clock (CSAC) Provides Wider Operating Temperatures, Faster Warm-up and Improved Frequency Stability in Extreme Environments
Microchip’s SA65 CSAC for military and industrial systems features ultra-high precision and low power consumption
Lattice Certus-NX FPGAs Optimized for Automotive Applications
Best-in-class High I/O Density, Small Form Factor General Purpose FPGAs Based on Lattice Nexus Platform Now AEC-Q100 Qualified
New I2C Serial EEPROM Introduces 3.4MHz High-Speed Mode Operation, Software Write-Protection and Factory Programmed Serial Numbers
Industry First 3.4 MHz I2C Serial EEPROM Closes the Gap in Trade-Offs Between SPI and I2C Protocols
Panasonic Industry adds high-current or high-voltage output models to its lineup of APV
Modern industrial automation solutions, energy systems and professional equipment are often extremely specialized devices that require high safety and design flexibility for switching elements like semiconductor relays. A photovoltaic driver for galvanic separation in combination with a distinct MOSFET power switch leaves nothing to be desired.
New COM-HPC Client size B & COM Express Type 6 size Basic with 11th Gen Intel® Core (Tiger Lake-H)
congatec introduces 20 new Computer-on-Modules following the launch of Intel’s 11th generation Core processor (condenamed Tiger Lake-H) for IoT. Featuring 11th Gen Intel Core vPro, Intel Xeon W-11000E, and Intel Celeron processors, the new modules target the most demanding IoT gateway and edge computing applications.
Mid-Range FPGAs Reach the Next Power and Performance Milestone for Edge Compute Systems
Microchip’s new low-density PolarFire® devices consume half the static power of alternatives while providing world’s smallest thermal footprint
Nexperia receives Bosch Global Supplier Award for the second time in a row
The prestigious award for ‘Purchasing of direct materials – Mobility Solutions’ recognizes Nexperia’s collaborative partnership with Bosch
Company of the week

Texas Instruments

Interesting video


electronica—Leading the way to the All Electric Society


GAMING, COMPUTER ACCESSORIES AND OTHER RELATED PRODUCTS


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE


Video Report from AMPER 2022


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Texas Instruments

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MikroElektronika d.o.o.


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SAMTEC

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INTEL

TDK Corporation


Giada

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NOKIA

ANRITSU


Digi-Key Electronics

AERS


Flex Power Modules

Danisense


BINDER

Parker Hannifin


MOXA

DANFOSS


Alliance Memory

Intelliconnect (Europe) Ltd.


Calendary
Laser World of Photonics, München, DE, 24.-27.6.2025
electronica India 2025, Dehli, 17.-19.9.2025
SEMICON Europa, München, DE, 18.-21.11.2025
productronica 2025, München, DE, 18.-21.11.2025
electronica 2026, München, DE, 10.-13.11.2026

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara

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