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Access Point WBE750
 
NETGEAR Unveils the Ultimate Tri-band Wi
Intel Core 14th Gen i9
 
Intel Core 14th Gen i9-14900KS Powers De
DDRH-15/30/45/60
 
Mean Well’s DDRH Series Isolated Ultra-W
TimeProvider® 4500 Series
 
TimeProvider® 4500 Series Is the Industr
IAM-20381HT
 
TDK announces new 3-axis accelerometer,
Microchip’s 5071B
 
New Cesium Atomic Clock Provides Autonom
POLOLU-4980
 
MINIATURE STEP-UP/STEP-DOWN CONVERTERS F
MANSON SDP-2210
 
MANSON SDP-2210 PROGRAMMABLE LABORATORY
DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo
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RSL10 Mesh Platform from ON Semiconductor Enables Smart Building and Industrial IoT Bluetooth® Low Energy Mesh Applications
Strata-enabled solution supports node-to-node communication with smart sensing and cloud connectivity
Nexperia delivers widest range of AEC-Q101 discretes in miniature, leadless rugged DFN packages
Nexperia today announced the industry’s widest portfolio of automotive-qualified discretes in space-saving, thermally-efficient, AOI-compatible DFN (Discrete Flat No leads) packages. The AEC-Q101 range of devices available cuts across all Nexperia’s product groups and includes switching, Schottky, Zener and protection diodes, bipolar junction transistors (BJTs), N- and P-channel MOSFETs, resistor-equipped transistors and LED drivers.
QPL-qualified SupIR-SMD package for rad hard MOSFETs enables higher performing space power systems
Reliably attaching surface mount hermetic power packages to PCBs is a common challenge faced by space system designers.
WEBINAR: Telematics Innovation: Opportunities & Challenges .. June 30th, 2020, 02:00 p.m. (CET)
As automotive telematics continues to enhance driving performance and experience, it’s creating opportunities for OEMs and the extended supply chain. We’re seeing huge amounts of innovation taking place in this field, helping to improve digital cockpits, in-vehicle connectivity, security and more.
congatec presents Intel® IoT RFP Kit for workload consolidation in vision based situational awareness applications
See and understand
Microchip Introduces 3 kW Transient Voltage Suppressor Diode Array Family for Superior Circuit Protection in Harsh Environments
Highest reliability diode arrays available protect aircraft, space systems and critical infrastructure from surges, spikes and electrostatic events
Philips Lumify handheld ultrasound solution launched in Japan to enable powerful diagnostics at the bedside
Ochrana osobních údajů (GDPR)
Provozovatel internetového portálu prohlašuje, že osobní údaje získané v souvislosti s provozem internetového obchodu zpracovává v souladu s nařízením Evropského parlamentu a Rady EU 2016/679 o ochraně fyzických osob v souvislosti se zpracováním osobních údajů ( známé jako GDPR).
Nexperia announces next generation 650 V Gallium Nitride (GaN) Technology
Next-gen GaN technology targets automotive, 5G and datacenter applications; Devices available packaged in TO-247 and innovative Copper Clip SMD
Microchip Switchtec™ PAX Advanced Fabric Gen 4 PCIe Switches Released to Production
Switchtec PAX PCIe fabric solutions provide greater flexibility and scalability for data center and cloud AI and ML architectures
Arrow Electronics, Panasonic Industry, and STMicroelectronics Join Forces to Deliver IoT Modules for Smart Applications
Low-Power Wireless Multi-Sensor Edge-Intelligence Modules Address Smart Factory, Smart Home and Smart Life Solutions
WEBINAR: NXP Introduces New MIFARE DESFire EV3 IC
JUNE 16, 2020 | 60-MINUTE WEBINAR | 9:00 AM CEST
Lattice Accelerates FPGA-based Processor Design with New IP Ecosystem and Design Environment
Lattice Propel Provides RISC-V Support and a Robust IP Portfolio to Enable Development of Processor-based Systems in Minutes
NXP Introduces MIFARE DESFire EV3 IC, Ushers In New Era of Security and Connectivity for Contactless Smart City Services
NXP Semiconductors today announced its new MIFARE DESFire EV3 IC that ushers in next-generation performance, advanced security and seamless integration of mobile services for a new era of security and connectivity in smart city services.
KEMET Extends KC-LINK™ Range Using KONNEKT™ High-Density Packaging Technology
Designed for use by power electronics engineers where high-power density and high efficiency in a small form factor is critical
Silicon Germanium (SiGe) rectifiers from Nexperia combine cutting-edge high efficiency, thermal stability and space-savings
AEC-Q101 approved devices with 120 V, 150 V, and 200 V combine best attributes of Schottky and fast recovery diodes
CoolSiC™ MOSFET 1700 V SMD enables best efficiency and reduced complexity for high voltage auxiliary power supplies
Infineon Technologies AG complements its CoolSiC™ MOSFET offering with yet another voltage class. Having added 650 V to the portfolio earlier this year, the company is now launching the 1700 V class with its proprietary trench semiconductor technology.
Noise suppression sheets by KEMET – forget about problems with interference
Self-adhesive noise suppression sheets by KEMET are designed to eliminate noise and high frequency interference. They are perfect for reducing electromagnetic interference (EMI) generated by electronic devices or suppressing radio frequency interference (RFI). Thanks to the use of modern materials, the sheets are thin and flexible, and their operating temperature ranges from -40°C to 105°C.
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PULSIV

Interesting video


GAMING, COMPUTER ACCESSORIES AND OTHER RELATED PRODUCTS


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE


Video Report from AMPER 2022


INDUSTRIAL PRESSURE TRANSDUCERS FROM CYNERGY3


Address Book


PULSIV

MikroElektronika d.o.o.


Panasonic Industry

Cambridge GaN Devices


Traco Power

BALLUFF


Seica

PEI-Genesis


KEYENCE

CML Microcircuits


SAMTEC

ams-OSRAM


INTEL

TDK Corporation


Giada

RS group


NOKIA

ANRITSU


Digi-Key Electronics

AERS


Flex Power Modules

Danisense


BINDER

Parker Hannifin


MOXA

DANFOSS


Alliance Memory

Intelliconnect (Europe) Ltd.


KIOXIA Europe GmbH

Antenova Ltd


Calendary
electronica 2024, 12.11.-15.11.2024, Munich, DE
DistribuTECH, 11.2.-13.2.2025, Dallas, TX
AMPER 2025, Brno, CZ, 18.-20.3.2025

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara

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