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Access Point WBE750
 
NETGEAR Unveils the Ultimate Tri-band Wi
Intel Core 14th Gen i9
 
Intel Core 14th Gen i9-14900KS Powers De
DDRH-15/30/45/60
 
Mean Well’s DDRH Series Isolated Ultra-W
TimeProvider® 4500 Series
 
TimeProvider® 4500 Series Is the Industr
IAM-20381HT
 
TDK announces new 3-axis accelerometer,
Microchip’s 5071B
 
New Cesium Atomic Clock Provides Autonom
POLOLU-4980
 
MINIATURE STEP-UP/STEP-DOWN CONVERTERS F
MANSON SDP-2210
 
MANSON SDP-2210 PROGRAMMABLE LABORATORY
DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo
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AMD Ryzen™ based congatec COM Express module for the industrial temperature range
congatec introduces its new conga-TR4 COM Express Type 6 module with AMD Ryzen™ Embedded V1000 Series processors for the industrial temperature range from 40°C to +85°C. It is available with optional burn-in & cold-soak stress screening service for highest reliability.
KEMET Introduces Metal Composite Power Inductors for Automotive Applications
METCOM™ for automotive offers high reliability and performance with best in class EMI shielding for low magnetic flux leakage
RS Components adds features, improves user interface in free-to-use DesignSpark PCB version 9
Now includes dangling connection report, net selection within pour area
SFP28 High-Speed Connector for Data Networking Optical Transceiver Applications
Yamaichi Electronics offers the SFP28 host connector for a data transmission rate of 56 Gbps PAM-4 modulation per one channel.
New Functional Safety Ready AVR® DA Microcontroller Family Enables Real-Time Control, Connectivity and HMI Applications
Next-generation AVR MCU family features core independent peripherals, advanced analog and on-chip communications
Murata Begins Mass Production of World's Smallest PTC Thermistor Contributing to Improving the Safety of Multifunctional Smartphones and Small Wearables
Microsoft Introduces New Surface Devices with Intel Core Processors
Today, Microsoft announced new Surface products powered by Intel® Core™ processors and designed to help you do what you need, from anywhere.
Microchip Announces the 53100A Phase Noise Analyzer for Precision Oscillator Characterization
Next-generation phase noise instrument combines timing technologies in a smaller, higher-performance measurement instrument
Murata and Google team to develop world’s smallest AI module with Coral intelligence
Murata announces that it has created the world’s smallest artificial intelligence (AI) module in partnership with Google – the Coral Accelerator Module. The custom designed module packages Google’s Edge TPU ASIC within a miniaturized footprint.
WEBINAR - Thu, May 14, 2020 6:00 PM - 7:00 PM CEST : Push Forward with the i.MX 8X Applications Processor for Automotive and Industrial Applications
NXP introduces the i.MX 8X applications processor to the mass market, the latest quad-core applications processor for secure, affordable and intelligent edge computing.
Inductors: Compact dual inductors with high saturation current
TDK Corporation has extended its range of dual inductors to include the new EPCOS series B82477D6*. The seven series types cover an inductance range from 2 x 3.9 µH to 2 x 47 µH and are designed for maximum rated currents from 2.83 A to 7.05 A. A special feature of the inductors, which are certified according to AEC-Q200 and compatible with RoHS, are the high saturation currents of up to 16.1 A.
10th Gen Intel Core H-series Introduces the World’s Fastest Mobile Processor at 5.3 GHz
What’s New: Today, Intel breaks beyond the 5 GHz barrier for laptops with the launch of the 10th Gen Intel® Core™ H-series mobile processors. Headlined by the 10th Gen Intel Core i9-10980HK1 processor, the H-series delivers desktop-caliber performance that gamers and creators can take anywhere.
DINKLE BUS Housingsystem
In addition to the extremely compact housing widths of 12mm and 20mm DINKLE is now offering 40mm and 60mm versions for additional electronics installation space. The new standard widths offer sufficient space to accommodate capacitors, relays or other high electronic components on the PCB.
Ultra-tiny MOSFETs from Nexperia are 36% smaller with lowest RDS(on)
Nexperia has launched a range of MOSFETs in the ultra-small DFN0606 package for mobile and portable applications including wearables. The devices also offer the lowest RDS(on) for their size and employ the commonly used pitch of 0.35 mm to simplify PCB assembly processes.
Microchip Releases Version 2.1 of TimeProvider 4100 Timing Grandmaster
Precise timing grandmaster with gateway clock and fastest high-performance boundary clock enhances 5G mobile network phase protection
An All-in-One Programmable Smart Sensor for Always-On Applications
For all those high-tech applications such as fitness tracking, step counting, indoor navigation and gesture recognition on your smart watch, smartphone or other mobile devices, all require ultra-low power, high performance smart sensors.
AMD Expands 3rd Gen AMD Ryzen™ Desktop Processor Family, Unleashing Powerful “Zen 2” Core For The Mainstream
AMD announced the newest additions to the 3rd Gen AMD Ryzen desktop processor family, the AMD Ryzen™ 3 3100 and AMD Ryzen™ 3 3300X processors and AMD B550 Chipset for Socket AM4 designed for 3rd Gen AMD Ryzen desktop processors with over 60 designs in development.
Power Integrations’ GaN Technology Increases Output Power of High-Efficiency Display PSUs to 75 W
Power Integrations announced that its InnoSwitch™3-MX isolated switcher IC family has been expanded with the addition of three new PowiGaN™ devices. As part of a chipset with Power Integrations’ InnoMux™ controller IC, the new switcher ICs now support display and appliance power supply applications with a continuous output power of up to 75 W without a heatsink.


Company of the week

Texas Instruments

Interesting video


electronica—Leading the way to the All Electric Society


GAMING, COMPUTER ACCESSORIES AND OTHER RELATED PRODUCTS


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE


Video Report from AMPER 2022


Address Book


Texas Instruments

NeoCortec


PULSIV

MikroElektronika d.o.o.


Panasonic Industry

Cambridge GaN Devices


Traco Power

BALLUFF


Seica

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KEYENCE

CML Microcircuits


SAMTEC

ams-OSRAM


INTEL

TDK Corporation


Giada

RS group


NOKIA

ANRITSU


Digi-Key Electronics

AERS


Flex Power Modules

Danisense


BINDER

Parker Hannifin


MOXA

DANFOSS


Alliance Memory

Intelliconnect (Europe) Ltd.


Calendary
Laser World of Photonics, München, DE, 24.-27.6.2025
electronica India 2025, Dehli, 17.-19.9.2025
SEMICON Europa, München, DE, 18.-21.11.2025
productronica 2025, München, DE, 18.-21.11.2025
sps 2025, Nuremberg, DE, 25.-27.11.2025
electronica 2026, München, DE, 10.-13.11.2026

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara

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