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Renesas Electronics Unveils Industry-Leading Fully Encapsulated Dual 30A and Single 33A Digital Power Modules
ISL8274M Dual 30A and ZL9024M 33A Modules Offer Highest Power Density and Efficiency for Advanced FPGAs, DSPs, ASICs, and Memory

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced two new fully encapsulated digital DC/DC PMBus® power modules that deliver the highest power density and efficiency in their class. The dual ISL8274M operates from a 5V or 12V power rail, provides two 30A outputs and up to 95.5% peak efficiency in a compact 18mm x 23mm2 footprint. The new ZL9024M operates from a 3.3V rail and outputs 33A of power in a 17mm x19mm2 footprint. They deliver point-of-load (POL) conversions for advanced FPGAs, DSPs, ASICs and memory used in servers, telecom, datacom, optical networking and storage equipment. Both devices are easy-to-use, PMBus-configurable power supplies that include a controller, MOSFETs, inductor and passives encapsulated inside a module that increases available board space and reduces bill of materials (BOM).

The ISL8274M and ZL9024M digital power modules leverage Renesas’ patented ChargeMode™ control architecture, which provides the highest efficiencies with better than 90% on most conversions. The power modules also provide a single clock cycle fast transient response to output current load steps common in FPGAs and DSPs that process power bursts. Their compensation-free design keeps the modules stable regardless of output capacitor changes due to temperature, variation or aging. Eliminating the need for an external discrete compensation network also saves board space and additional BOM cost. The ISL8274M supports input voltages from 4.5V to 14V, while the ZL9024M accepts input voltages from 2.75V to 4V. Both modules offer adjustable output voltages as low as 0.6V.

The encapsulated modules use Renesas’ proprietary High Density Array (HDA) package, which offers unmatched electrical and thermal performance through a single-layer conductive substrate that reduces lead inductance and dissipates heat primarily through the system board. The HDA’s copper lead-frame structure allows the modules to operate at full load over a wide temperature range with no airflow or heatsinks. The ISL8274M and ZL9024M also provide several protection features that ensure safe operations under abnormal operating conditions, further enhancing their robustness and reliability.

“The ISL8274M and ZL9024M expand Renesas’ portfolio of encapsulated digital power modules and provides customers the first digital dual 30A power supply and first digital 33A power supply,” said Philip Chesley, Vice President of Industrial Analog and Power Business Division, Renesas Electronics Corporation. “Their power density, high efficiency and fast transient response address our customers demanding single and multi-rail power requirements.”

Key Features of the ISL8274M Digital Power Module
  • 30A dual digital switch mode power supply with input voltage range from 4.5V to 14V and programmable Vout from 0.6V to 5V
  • PMBus-enabled solution for full system configuration, telemetry and monitoring of all conversions and operating parameters
  • Programmable Vout, soft-start, soft-stop, sequencing, margining and under-voltage, over-voltage, under-current, over-current, under temperature and over-temperature
  • Monitors Vin, Vout, Iout, temperature, duty cycle, switching frequency, and faults
  • Power good indicator, and ±1.2% Vout accuracy over line, load, and temperature
  • Pin-strap mode using external resistors for standard settings
  • Internal nonvolatile memory saves module configuration parameters and fault logging
Key Features of the ZL9024M Digital Power Module
  • 33A digital switch mode power supply with input voltage range from 2.75V to 4V and programmable Vout from 0.6V to 1.5V
  • PMBus-enabled solution for full system configuration, telemetry and monitoring of all conversions and operating parameters
  • Programmable Vout, soft-start, soft-stop, sequencing, margining and under-voltage, over-voltage, under-current, over-current, under temperature and over-temperature
  • Monitors Vin, Vout, Iout, temperature, duty cycle, switching frequency, and faults
  • Power good indicator, and ±1.2% Vout accuracy over line, load, and temperature
  • Pin-strap mode using external resistors for standard settings
  • Internal nonvolatile memory saves module configuration parameters and fault logging
PowerCompass Selects the Right Products

Designers can use Renesas’ PowerCompass™ tool to identify the right power modules and other parts that match their specific requirements, set up multiple rails to support FPGAs or processors, perform high-level system analysis, and generate custom reference design files.

PowerNavigator Simplifies Digital Power Designs

The Renesas PowerNavigatorTM GUI simplifies digital power module configuration, validation and monitoring of all device parameters and telemetry. The tool makes it easy to change features and functions of a digital power supply without writing a single line of code.

Pricing and Availability

The ISL8274M is available now in a thermally enhanced 18mm x 23mm x 7.5mm HDA package, and is priced at $39 USD in 1k quantities. An ISL8274MEVAL1Z evaluation board is available for $150 USD. For more information, please visit: www.intersil.com/products/isl8274m.

The ZL9024M is available now in a thermally enhanced 17mm x 19mm x 3.5mm HDA package, and is priced at $29 USD in 1k quantities. The ZL9024MEVAL1Z evaluation board is available for $95 USD. For more information, please visit: www.intersil.com/products/zl9024m.

See ISL8274M product information

See ZL9024M product information

2018013102 / 31.01.2018 / Electronic-components / RENESAS /

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Renesas Cellular-to-Cloud Development Kits Now Connect Seamlessly to Microsoft Azure Cloud Services
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Renesas Electronics Unveils Industry-Leading Fully Encapsulated Dual 30A and Single 33A Digital Power Modules
ISL8274M Dual 30A and ZL9024M 33A Modules Offer Highest Power Density and Efficiency for Advanced FPGAs, DSPs, ASICs, and Memory

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