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New Lattice Modules Make Replacing USB Connectors with 12 Gbps Wireless Technology a Snap
Lattice Snap Modules Drive Continued Adoption of 60 GHz Wireless Technology in Consumer and Embedded Applications
  • Lattice Snap modules incorporate key benefits of SiBEAM Snap technology for a robust, environment-proof and connector-less link at 12 Gbps speeds
  • International regulatory compliance speeds time-to-market
  • Lattice Snap evaluation kit enables easy integration of short-range 60 GHz wireless technology ideal for mobile accessories, tablets, notebooks, action and surveillance cameras
Click-to-Tweet

PORTLAND, OR – Feb. 20, 2018 – Lattice Semiconductor Corporation (NASDAQ: LSCC), the leading provider of customizable smart connectivity solutions, today announced the expansion of its Lattice Snap® wireless connector product family to support broader adoption of 60 GHz wireless technology in consumer and embedded applications. The new Lattice Snap modules, based on Lattice’s production-proven SiBEAM® 60 GHz technology, enable manufacturers to easily integrate short-range, high-speed 60 GHz wireless links into their products. To simplify the design process further, Lattice included the Snap modules, which are compliant with regulatory requirements in several jurisdictions, into their Snap evaluation kit for fast prototyping and time-to-market.

“We were seeking a wireless solution that was robust, easy to integrate and wouldn’t require a lot of design support,” said Ehren Achee, CTO at SecuraShot. “Lattice’s Snap modules met all of our expectations, allowing us to develop a more rugged product that can seamlessly support the transfer of data wirelessly without delay.”

The Snap modules offer 12 Gbps full-duplex bandwidth at sub-frame latencies, making this technology ideal for the replacement of physical connectors, such as USB. By eliminating the connector, the industrial designs of new products can be optimized by making them thinner, lighter, and environment-proof, all while maintaining a robust and high-speed connection. To enable faster prototyping for both existing and new customers, Lattice created the Snap Evaluation Kit, which includes the modules, system design guidelines and improved de-bug tools.

“As a leader in wireless connectivity solutions, the Lattice Snap products demonstrate our commitment to innovate products at the edge,” said Abdullah Raouf, senior manager at Lattice. “SiBEAM Snap wireless connector technology offers a unique advantage in data transfer for a variety of high volume mobile applications, such as smartphones, tablets and notebooks. The new Snap modules not only accelerate time to market, but will enable 60 GHz technology to be easily integrated into broader consumer and industrial products.”

Key features of the Snap modules include:

  • Fully integrated power regulation, timing, 60 GHz antenna design & regulatory compliance
  • A plug and play approach to enabling a short range, high speed, wireless link

For more information on Lattice’s Snap products visit: http://www.latticesemi.com/Products/mmWave/SiBEAMSnap.aspx.

Lattice at the Embedded World Conference 2018 – Nuremberg, Germany

Lattice will be exhibiting at Embedded World 2018, where the company will be showcasing Snap modules along with other products and technology solutions targeted for the industrial, automotive and consumer markets. To meet with Lattice, please visit booth #4-278 at the Nuremberg Messe from Tuesday, February 27, 2018 - Thursday, March 1, 2018.

To schedule a press meeting, please contact: lattice@racepointglobal.com. To schedule a customer meeting, please visit: http://www.latticesemi.com/en/About/ContactUs.aspx.

2018022003 / 20.02.2018 / Electronic-components / Lattice Semiconductor /

Lattice Expands Automate Solution Stack and Propel Design Tool Capabilities to Accelerate Industrial Application Development
Improved user experience and more performance for applications in robotics, smart factory, and motion control

Lattice to Host Virtual Seminar on Industrial Cybersecurity Trends and Standards in FPGAs
Lattice Semiconductor Corporation announced the company will host a virtual seminar about the challenges, opportunities, and latest programmable logic solutions for Industrial applications.

Lattice Acquires Mirametrix
Expands Software Portfolio with Complementary AI and Computer Vision Capabilities

New Lattice sensAI Solution Stack Accelerates Next-Generation Client Devices
Latest Version of Solution Stack Offers New Features For Power-Efficient AI/ML Inferencing

Lattice to Highlight Low Power ML Development with sensAI Solution Stack at ValleyML AI Expo 2021

Lattice mVision Solution Stack Enables 4K Video Processing at Low Power for Embedded Vision Applications
Updated Stack Delivers Higher ISP Performance, Support for LPDDR4 DRAM, and Expanded Hardware Support for Popular Vision and High Speed Data Interfaces

Lattice Certus-NX FPGAs Optimized for Automotive Applications
Best-in-class High I/O Density, Small Form Factor General Purpose FPGAs Based on Lattice Nexus Platform Now AEC-Q100 Qualified

New Lattice Radiant 3.0 Design Software Further Enhances Ease of Use to Accelerate FPGA Designs

New Lattice CertusPro-NX General Purpose FPGAs Deliver Advanced System Bandwidth and Memory Capabilities to Edge Applications
Highest Logic Density Lattice Nexus-Based Product Family Features Best-in-Class Power Efficiency, Performance, and Small Form Factor

Lattice sensAI Solution Stack Simplifies Deployment of AI/ML Models on Smart Edge Devices
Supports TensorFlow Lite and Lattice Propel for Embedded Processor-based Designs; Includes New Lattice sensAI Studio Tool for Easy ML Model Training

Lattice Brings Best-in-Class Embedded Vision Optimized FPGA to Automotive Applications
CrossLink-NX FPGAs Deliver Fast MIPI Performance to ADAS and In-Vehicle Infotainment Applications

Lattice Expands mVision Solutions Stack Capabilities
Latest Release Supports State-of-the-Art Image Sensors for Industrial, Automotive, and Medical Applications

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