Silicon Photonics platform enables CWDM4, DR1 and FR4 L-PICs with optimal performance and cost-effectiveness to scale Cloud Data Center and 5G Telecom deployment
Automated self-aligning laser to PIC technology to enable breakthrough manufacturing throughput, capacity and cost structure
Self-calibration and firmware control optimizes manufacturability scalability

As the explosive growth of data traffic and insatiable demand forces Cloud Data Centers to rapidly scale their capabilities, MACOM is equipped to be a leader in the transition from 100Gbps to 400Gbps and from 4G to 5G with a cost-effective, high-performance and highly integrated interconnect chipset solution for CWDM4, scalable to FR4 and FR1/DR1 applications.

Core to the MAOT-025402 is the MAOP-L284CN L-PIC device, which integrates four high-performance 25Gbps CWDM wavelengths in a single silicon photonic integrated circuit (PIC) to communicate 100Gbps over duplex single mode fiber. MACOM’s L-PIC platform provides a highly integrated silicon photonic solution targeting specific data center applications that includes four CW lasers, monitor photodiodes, high bandwidth waveguides, modulators and multiplexers. Utilizing MACOM’s patented self-aligning etched facet technology (SAEFT^TM) for precision attachment of the lasers to the silicon chip, the L-PIC platform removes the need for active laser alignment and offers a significant cost reduction to the customer, enabling mainstream deployment.

“MACOM is leveraging our L-PIC platforms to enable leading scalability that meets the rapidly increasing CWDM4 module demand,” said Vivek Rajgarhia, Senior Vice President and General Manager, Lightwave, at MACOM. “The platform’s automated self-aligning calibration and firmware control is anticipated to deliver the requisite combination of scale and cost for mainstream Cloud Data Center deployment.”

MACOM’s L-PIC platform delivers leading bandwidth critical to enabling CWDM4, and is now available in TOSA and at die level. Each L-PIC product includes a companion matched driver and PIC controller. Leveraging this three device chipset, customers are able to significantly reduce engineering risk and achieve faster time-to-market. The accompanying software provides automatic calibration and self-test capabilities, and significantly reduces customers’ capital investment required for production lines. Fully integrated and pre-assembled, MACOM’s sub-assembly platform is expected to provide the high performance required for achieving 100Gbps and 400Gbps data center links while reducing the transceiver manufacturers’ engineering and capital equipment costs, enabling an overall faster time-to-market with lower investment.

MACOM will showcase its optoelectronics portfolio at OFC 2018, Booth #2613, March 13^th-15^th in San Diego, California. To make an appointment or to view the demonstrations, contact your local sales representative. For more information on MACOM’s optical networking solutions visit: www.macom.com.