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electronica 2018 – ROHM presents advanced power and energy management technologies for higher power density, efficiency and reliability
VENTURI Formula E Team with new driver Felipe MASSA uses ROHM's Full SiC power module and Gate driver IC

ROHM Semiconductor will again be exhibiting at the upcoming electronica 2018, the world's leading trade fair for components, systems and applications in electronics, November 13 to 16, 2018 in Munich. At its exhibition booth in hall C3, stand 512, the company presents new solutions for power and energy management in the automotive and industrial sectors as well as its commitment to Formula E.

Highlights include demonstrations from updates of new power devices such as 1700V SiC module and other SiC devices, Power Management ICs and sensor technologies for the automotive and industrial market. In addition, ROHM will highlight local support capabilities by presenting Power-Lab Test benches and sensing solutions by Finland Software Design Center. For automotive applications, the company will show the latest generation of SiC-based inverters, human interface solution, car infotainment, PMIC and high reliability discrete components. New solutions for the industry sector will be presented including 99% efficiency SiC inverters, application example of a solar inverter, on-board charger, power supply and EV charging station. Further applications showcase AC/DC and DC/DC converter ICs, motor drivers and sensors together with new IGBTs and high speed switching MOSFET (Presto MOS Series) devices.

Latest SiC power modules for Formula E

Motor sports Formula E is attracting increasing attention worldwide as a platform for further innovation in the electric car sector. ROHM, official technology partner of the VENTURI racing team since the start of the third racing season in October 2016, contributes top-class SiC power modules for the inverter block, which forms the core of the drive system of electric vehicles. ROHM will showcase the latest generation of inverters and the Formula E racing car of the fifth season as an application example for SiC power modules.

Felipe MASSA will drive for the VENTURI Formula E Team, Autograph session at the ROHM booth

Former Formula 1 racing driver and vice world champion Felipe MASSA will be driving for VENTURI Formula E Team in the 2018/19 Formula E season. The Brazilian has signed a three-year contract with the racing team. MASSA chose the team because of its experience, energy and the durability of the car.

On the first day of electronica Felipe MASSA will visit ROHM exhibition stand, where he will be available for autographs and selfies.

For additional information about ROHM at electronica please visit: https://www.rohm.com/electronica

2018092001 / 20.09.2018 / Trade fairs, Events / ROHM Semiconductor /

ROHM at electronica 2024: Empowering Growth, Inspiring Innovation
ROHM Semiconductor Europe is looking forward to electronica 2024 – the world’s leading trade fair and conference for electronic components, systems, applications, and solutions. The event will take place between November 12th to 15th in Munich.

ROHM Group Company SiCrystal and STMicroelectronics Expand Silicon Carbide Wafer Supply Agreement

ROHM Develops the First Silicon Capacitor BTD1RVFL Series
Achieving the industry’s smallest* size in a mass-produced surface mount package contributes to greater space savings in smartphones and other compact devices

ROHM’s New 4ch/6ch LED Drivers for LCD Backlights: Contribution to Lower Power Consumption in Medium to Large Automotive Displays
Built-in DC and PWM dimming support a wide range of design requirements

ROHM’s New Wireless Charger Modules: Facilitating Wireless Charging in Thin and Compact Devices
ROHM has developed compact wireless charger modules with an integrated antenna board: the BP3621 (transmitter) and the BP3622 (receiver). The new modules allow to add wireless power supply functionality to smaller devices such as smart tags/cards or PC peripherals.

New EMARMOUR™ 2 Channel High-Speed Op Amp
ROHM introduces the availability of a 2 channel high-speed ground sense CMOS op amp, BD77502FVM, optimized for consumer and industrial equipment requiring high-speed sensing – such as industrial measurement and control systems.

New Automotive-Grade Buck-Boost Power Supply Chipset Ensures Stable Performance with Industry-Low* Current Consumption
Novel Quick Buck BoosterⓇ technology improves system stability in start-stop vehicle systems

electronica 2018 – ROHM presents advanced power and energy management technologies for higher power density, efficiency and reliability
VENTURI Formula E Team with new driver Felipe MASSA uses ROHM's Full SiC power module and Gate driver IC

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NeoCortec

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Calendary
intersec Dubai 2025, 14.-16.1.2025
DistribuTECH, 11.2.-13.2.2025, Dallas, TX
asiamold select, Guangzhou, CHN, 25.-27.2.2025
AMPER 2025, Brno, CZ, 18.-20.3.2025
productronica China, Shanghai, 26.-28.3.2025
electronica China 2025, Shanghai, 15.-17.4.2025
electronica India 2025, Dehli, 17.-19.9.2025
SEMICON Europa, München, DE, 18.-21.11.2025
productronica 2025, München, DE, 18.-21.11.2025
electronica 2026, München, DE, 10.-13.11.2026

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