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Nexperia launches 40 V low RDS(on) automotive MOSFETs in a 3x3 mm footprint for demanding powertrain applications
Nexperia introduced a portfolio of low RDS(on) 40 V AEC-Q101 MOSFETs targeting space-constricted, increased-power modules in demanding powertrain applications. Housed in the miniature, LFPAK33 package which has a footprint of only 10.9 mm² and a pitch of just 0.65 mm, devices use Nexperia’s Trench 9 technology.

This results in a reduction in RDS(on) of 48% when compared to previous technology devices, covering a range of applications from 30 W up to 300 W. BUK7M3R3-40H and BUK9M3R3-40H (Standard Level and Logic Level) devices feature an RDS(on) of just 3.3 mΩ.

Improved RDS(on) and current capability allows the LFPAK33 package to replace larger power styles at a lower cost with comparable product performance, where traditionally DPAK-packaged devices which are 80% larger than LFPAK33 devices have been used. Rugged, Trench 9 Superjunction technology also delivers a higher Avalanche capability and greater Safe Operating Area (SOA) for improved performance under fault conditions.

Comments Richard Ogden, Nexperia’s product manager: “Automotive design engineers continue to innovate - especially in applications such as water, fuel and oil pumps, and engine filters - focusing on reducing module size but with increasing power requirements. Our Trench 9 automotive LFPAK33 MOSFETs are a good fit for these thermally-demanding powertrain systems, since the unique LFPAK technology absorbs thermal stresses. Other automotive applications include parking brakes, airbag systems, LED Lighting, seat control & heating, window lift and driver infotainment systems.”

Nexperia’s LFPAK33 40 V MOSFET family represents the industry’s largest portfolio of devices in a 3x3 mm footprint, with an additional 16 Standard Level and Logic Level devices. Devices are qualified to AEC-Q101 exceeding the requirements of this standard by more than two times. More information on the new low RDS(on) 40 V MOSFETs, including product specs and datasheet is available at https://efficiencywins.nexperia.com/efficient-products/lfpak33-drives-300-watt-powertrain-systems.htm

2019021306 / 13.02.2019 / Electronic-components / NEXPERIA /

USB4 ESD devices from Nexperia provide optimum balance of protection and performance
TrEOS based protection offers industry-leading insertion and return loss to help meet tight system budgets

Nexperia launches new portfolio of application specific MOSFETs (ASFETs) for automotive airbags
Provides excellent transient linear mode performance using new SOA trench technology in LFPAK packaging providing designers with a smaller and more reliable choice.

Nexperia widens its offering of discrete components in miniature DFN packaging with side-wettable flanks
Rugged and reliable devices are AEC-Q101 compliant and save board space

Nexperia’s 50 µA Zener diodes portfolio extends battery-time and saves PCB space
The comprehensive product range covers every application from 1.8 V to 75 V

Nexperia introduces a range of A-selection Zener diodes for precise voltage reference with the industry’s lowest tolerance of ±1%
The comprehensive product range covers every application from 2.4 V to 75 V

Nexperia expands its wide bandgap semiconductor offering with new family of high-performance Silicon Carbide (SiC) Diodes
Samples of industrial-grade 650 V, 10 A SiC Schottky diode now available. Parts with 1200 V / 6-20 A current range and automotive-grade parts also planned

Nexperia delivers extremely low clamping bidirectional ESD protection devices for USB4 standard interfaces
TrEOS diodes offer industry-leading insertion loss and return loss characteristics for more robust USB4TM data transmission

Nexperia surface-mount device passes Board Level Reliability requirements for automotive application
Reliable and rugged CFP15B clip-bond FlatPower package selected by leading Tier 1 automotive supplier for use on an engine control unit

Nexperia launches ‘Power Live’ September 21-23 2021
Participate in live discussions on GaN, MOSFETs, power diodes and bipolar transistors for automotive and industrial applications; View on-demand video demos direct from Nexperia’s labs

Nexperia receives Bosch Global Supplier Award for the second time in a row
The prestigious award for ‘Purchasing of direct materials – Mobility Solutions’ recognizes Nexperia’s collaborative partnership with Bosch

Nexperia’s new Application-Specific MOSFETs (ASFETs) for hot-swap increase SOA by 166% and slash PCB footprint by 80%
New 80V & 100V devices minimize derating and improve current sharing for optimum performance, high reliability and reduced system cost

World’s smallest and thinnest standard logic DHXQFN packages from Nexperia in 14, 16, 20 and 24 pins
New packages enable large logic functions to be included in small form factor systems

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