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Mean Well’s DDRH Series Isolated Ultra-W
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IAM-20381HT
 
TDK announces new 3-axis accelerometer,
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BAHCO set of insulated wrenches


TDK announces world’s first MIPI standard SoundWire® microphone
TDK Corporation (TSE: 6762) introduces the world’s first MIPI Standard SoundWire® microphone for mobile, IoT and other consumer devices. This multimode microphone pushes the boundaries of digital microphone acoustic performance while providing advanced feature sets with very low power.
  • T5808 is a 66 dB SNR/135dB AOP digital microphone in a 3.5 x 2.65 x 0.98 mm package
  • Supports up to seven individually configurable microphones on a single audio bus
  • SoundWire 1.1 compliant based on Mobile Industry Processor Interface (MIPI) Alliance open standards

The T5808 SoundWire microphone features 66 dBA SNR and 135dB SPL AOP at 650 µA in high quality mode (HQM), and decreases power consumption to 215µA in low power mode (LPM).  The T5808 microphone also features concurrent mode (CCM), enabling simultaneous audio streams from HQM and LPM that can seamlessly transition back and forth without audio glitches.

The SoundWire Standards Committee, who created the MIPI standard for SoundWire, includes technology leaders in application processors, audio DSPs and codecs, and other ICs. SoundWire is a standard audio bus that supports multiple audio devices including microphones, speakers, codecs and class D amplifiers. SoundWire revolutionizes how audio devices and ICs communicate by integrating audio and control data for up to 11 devices (e.g. 7mics, 4 speakers) on a single bus.

“As a member of the SoundWire Standards Committee, Qualcomm Technologies has supported the SoundWire interface on speaker amplifier producs for a number of years. We are excited to see TDK’s microphone technology now incorporating this interface,” says Rahul Shinkre, Director, Product Management at Qualcomm Technologies, Inc.

TDK will be demonstrating the T5808 microphone along with the industry’s most comprehensive portfolio of passive components, sensors, power supplies and batteries in its booth #11448 at CES, Central Hall (LVCC), Las Vegas Convention Center, January 7-10, 2020 in Las Vegas, Nevada. T5808 is currently in mass production and will be available through distribution in Q1 2020.  For samples and additional information, please contact sales@invensense.com or visit www.invensense.tdk.com/products/digital/t5808/


Glossary

  • HQM: High Quality Mode
  • LPM: Low Power Mode
  • CCM: Concurrent Mode
  • AOP: Acoustic Overload Point

Main applications

  • Smartphones
  • Microphone Arrays
  • Tablets
  • Cameras
  • Bluetooth Headsets
  • Notebook PCs
  • Security and Surveillance

Key features

  • 5 × 2.65 × 0.98 mm surface‐mount package
  • Low power: 215 µA in Low‐Power Mode
  • Extended frequency response from 40 Hz to >20 kHz
  • Sleep Mode: 10 µA
  • High power supply rejection (PSR): −91 dB FS
  • Fourth‐order Σ‐Δ modulator
  • Digital pulse density modulation (PDM) output
  • Compatible with Sn/Pb and Pb‐free solder processes
  • RoHS/WEEE compliant

 

Key data

Product T5808
Packaging Dimensions (mm) 3.50 × 2.65 × 0.98
SNR dBA 66
Acoutsic Overload Point dB SPL 135
Low Power Mode µA 215
Bandwidth kHz 20
Low Frequency Corner Hz 40
Digital Interface SoundWire
2020011204 / 15.01.2020 / Electronic-components / TDK Corporation /

TDK announces new 3-axis accelerometer, finalizing transition of SmartAutomotive™ non-safety product family to 105°C

TDK introduces 3D HAL® technology-based position sensor with analog output and SENT interface

TDK offers mechanically decoupled ultrasonic modules for collision avoidance
TDK Corporation presents the ultrasonic sensor module USSM1.0 PLUS-FS, in which the sensor element is mechanically decoupled from the housing. This makes the IP65/67 protected sensor with the order number B59110W2111W032 immune to external mechanical vibrations that can falsify the measurement result. The module, which is supplied with a nominal voltage of 12 V, can be mounted in a front chassis via a M19 thread with a locking nut or via snap hooks.

TDK offers compact high-current chokes for automotive and industrial applications
TDK Corporation presents the B82559A*A033 series of new shielded EPCOS ERU33 high-current chokes for through-hole mounting. Designed for very high saturation currents from 32 A to 83 A at 100 °C, the six new types cover a range of inductance values from 3.2 µH to 10 µH.

EMC Components: TDK develops industry’s first high-reliability chip beads for automotive
TDK Corporation announced the development and mass production of the MMZ1608-HE series of high-reliability chip beads for automotive use, compatible with high-durability solder in 150 ℃ environments.

Surge protection: Failsafe chip varistors for automotive battery lines
TDK Corporation presents a new range of Open Mode chip varistors for electronic automotive assemblies that are directly connected to the battery. The new chip varistors offer reliable protection against transient surge voltages according to ISO 7637-2, and meet the failsafe requirements according to the VW standard VW 80808. Even when subject to excessive bending stress, short-circuits are avoided, which is particularly important for unswitched battery terminals (e.g. terminal 30).

Inductors: Compact dual inductors with high saturation current
TDK Corporation has extended its range of dual inductors to include the new EPCOS series B82477D6*. The seven series types cover an inductance range from 2 x 3.9 µH to 2 x 47 µH and are designed for maximum rated currents from 2.83 A to 7.05 A. A special feature of the inductors, which are certified according to AEC-Q200 and compatible with RoHS, are the high saturation currents of up to 16.1 A.

Aluminum electrolytic capacitors: Compact design with high ripple current capability
TDK Corporation (TSE:6762) presents the new B43707* and B43727* series of EPCOS aluminum electrolytic capacitors with screw terminals. They are designed for rated voltages of between 400 V DC and 450 V DC and cover a capacitance range from 1800 µF to 18,000 µF.

TDK announces world’s first MIPI standard SoundWire® microphone
TDK Corporation (TSE: 6762) introduces the world’s first MIPI Standard SoundWire® microphone for mobile, IoT and other consumer devices. This multimode microphone pushes the boundaries of digital microphone acoustic performance while providing advanced feature sets with very low power.

Company of the week

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electronica 2024, 12.11.-15.11.2024, Munich, DE


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Calendary
SENSOR+TEST 2024, 11.-13.6.2024, Nuremberg, DE
electronica 2024, 12.11.-15.11.2024, Munich, DE
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

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The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


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