T5808 is a 66 dB SNR/135dB AOP digital microphone in a 3.5 x 2.65 x 0.98 mm package
Supports up to seven individually configurable microphones on a single audio bus
SoundWire 1.1 compliant based on Mobile Industry Processor Interface (MIPI) Alliance open standards

The T5808 SoundWire microphone features 66 dBA SNR and 135dB SPL AOP at 650 µA in high quality mode (HQM), and decreases power consumption to 215µA in low power mode (LPM). The T5808 microphone also features concurrent mode (CCM), enabling simultaneous audio streams from HQM and LPM that can seamlessly transition back and forth without audio glitches.

The SoundWire Standards Committee, who created the MIPI standard for SoundWire, includes technology leaders in application processors, audio DSPs and codecs, and other ICs. SoundWire is a standard audio bus that supports multiple audio devices including microphones, speakers, codecs and class D amplifiers. SoundWire revolutionizes how audio devices and ICs communicate by integrating audio and control data for up to 11 devices (e.g. 7mics, 4 speakers) on a single bus.

“As a member of the SoundWire Standards Committee, Qualcomm Technologies has supported the SoundWire interface on speaker amplifier producs for a number of years. We are excited to see TDK’s microphone technology now incorporating this interface,” says Rahul Shinkre, Director, Product Management at Qualcomm Technologies, Inc.

TDK will be demonstrating the T5808 microphone along with the industry’s most comprehensive portfolio of passive components, sensors, power supplies and batteries in its booth #11448 at CES, Central Hall (LVCC), Las Vegas Convention Center, January 7-10, 2020 in Las Vegas, Nevada. T5808 is currently in mass production and will be available through distribution in Q1 2020. For samples and additional information, please contact sales@invensense.com or visit www.invensense.tdk.com/products/digital/t5808/

Glossary

HQM: High Quality Mode
LPM: Low Power Mode
CCM: Concurrent Mode
AOP: Acoustic Overload Point

Main applications

Smartphones
Microphone Arrays
Tablets
Cameras
Bluetooth Headsets
Notebook PCs
Security and Surveillance

Key features

5 × 2.65 × 0.98 mm surface‐mount package
Low power: 215 µA in Low‐Power Mode
Extended frequency response from 40 Hz to >20 kHz
Sleep Mode: 10 µA
High power supply rejection (PSR): −91 dB FS
Fourth‐order Σ‐Δ modulator
Digital pulse density modulation (PDM) output
Compatible with Sn/Pb and Pb‐free solder processes
RoHS/WEEE compliant

Key data

Product	T5808
Packaging Dimensions (mm)	3.50 × 2.65 × 0.98
SNR dBA	66
Acoutsic Overload Point dB SPL	135
Low Power Mode µA	215
Bandwidth kHz	20
Low Frequency Corner Hz	40
Digital Interface	SoundWire