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Microchip Expands Silicon Carbide (SiC) Family of Power Electronics to Provide System Level Improvements in Efficiency, Size and Reliability
700, 1200 and 1700V SBD-based power modules maximize switching efficiency, reduce thermal rise and allow smaller system footprint

Demand continues to rapidly grow for Silicon Carbide (SiC)-based systems to maximize efficiency and reduce size and weight, allowing engineers to create innovative power solutions. Applications leveraging SiC technology range from electric vehicles and charging stations to smart power grids and industrial and aircraft power systems. Microchip Technology Inc. (Nasdaq: MCHP) today announced its expanded portfolio of smaller, lighter and more efficient SiC power modules. Together with its broad portfolio of microcontrollers (MCUs) and analog products, Microchip serves the needs of high power system control, gate drive and power stage – supporting customers with total system solutions. 

Microchip’s SiC family includes commercially-qualified Schottky Barrier Diode (SBD)-based power modules in 700, 1200 and 1700V variants. The new power module family includes various topologies including Dual Diode, Full Bridge, Phase Leg, Dual Common Cathode and 3-Phase bridge, in addition to offering different current and package options. The addition of SiC SBD modules simplifies designs by integrating multiple SiC diode die with the option to mix and match substrate and baseplate material into a single module – which maximizes switching efficiency, reduces thermal rise and allows for a smaller system footprint.

“SiC technology adoption and expansion is a driving force in today’s system innovation and Microchip is at the forefront, collaborating with customers across all segments and global regions,” said Leon Gross, vice president of Microchip’s Discrete Product Group business unit. “Our focus continues to be delivering reliable and innovative solutions. From definition to product release, our SiC technology provides superior reliability and ruggedness, helping power system designers to ensure a long application life with no degradation in performance.”  

The flexible portfolio of 700, 1200 and 1700V SiC SBD modules utilize Microchip’s newest generation of SiC die, which maximizes system reliability and ruggedness and enables stable and lasting application life. The devices’ high avalanche performance allows system designers to reduce the need for snubber circuits, and the body diode stability allows designs to use the internal body diode without long-term degradation. Through Microchip internal and third-party testing, critical reliability metrics have proven Microchip devices’ superior performance when compared to other SiC manufactured devices. 

Development Tools

The company’s 30 kW 3-Phase Vienna Power Factor Correction (PFC), SiC discrete and SP3/SP6LI module drive reference designs/boards provide system developers tools to help reduce development cycle times. The recently added AgileSwitch® family of digital programmable gate drivers further supports accelerating the process of moving from the design stage to production.

Availability

Microchip’s 700, 1200 and 1700V SiC SBDs power modules are released and available for order. The complete SiC portfolio is supported by a range of SiC SPICE models, SiC driver board reference designs and a PFC Vienna reference design. Microchip SiC products are available in production volumes along with their associated support offerings. A variety of die and package options are available for the SiC MOSFETs and SiC diodes.

For additional information including pricing contact a Microchip sales representative, authorized worldwide distributor or visit Microchip’s SiC product portfolio website. To purchase products mentioned here contact a Microchip authorized distributor.

2020031901 / 19.03.2020 / Electronic-components / Microchip Technology Inc. /

Microchip Launches New dsPIC® DSC-Based Integrated Motor Drivers that Bring Controllers, Gate Drivers and Communications to a Single Device
A corresponding ecosystem of support tools will help simplify motor control system development and accelerate time to market

Microchip Expands its mSiC™ Solutions with the 3.3 kV XIFM Plug-and-Play mSiC Gate Driver to Accelerate the Adoption of High-Voltage SiC Power Modules
The highly integrated 3.3 kV XIFM plug-and-play digital gate driver is designed to work out-of-the-box with high-voltage SiC-based power modules to simplify and speed system integration

Microchip’s Low-Cost PolarFire® SoC Discovery Kit Makes RISC-V and FPGA Design More Accessible for a Wider Range of Embedded Engineers
Cost-sensitive development platform helps student, beginner and seasoned designers work with emerging technologies

TimeProvider® 4500 Series Is the Industry’s First Grandmaster to Provide High-Speed Network Interfaces up to 25 Gbps
Extends Microchip’s IEEE®-1588 grandmaster portfolio and enables precise time accuracy to less than one nanosecond

Microchip Earns Certification in ISO/SAE 21434 Road Vehicle—Cybersecurity Engineering Standard from UL Solutions
Designing with certified security products can help Tier 1s and OEMs prove cybersecurity risk management compliance

The Next Evolutionary Step in Customizable Logic, Microchip Releases PIC16F13145 Family of MCUs
New Configurable Logic Block (CLB) module offers tailored hardware solutions and helps eliminate the need for external logic components

Microchip Launches 10 Multi-Channel Remote Temperature Sensors
MCP998x family represents one of the largest automotive-grade remote temperature sensor portfolios available from a single vendor

Next-Generation Family of Ethernet Switches Features Time Sensitive Networking and Scalable Port Bandwidths from 46 Gbps to 102 Gbps
Microchip’s LAN9694, LAN9696 and LAN9698 devices are integrated with High-availability Seamless Redundancy (HSR) and Parallel Redundancy Protocol (PRP) for ease of design

Microchip Launches AVR® EB Family of Microcontrollers to Reduce Noise, Vibration and System Harshness in BLDC Applications
Offers a smaller, more cost-effective solution for sophisticated waveform control with increased efficiency

Automate Installation Process with Press-Fit Terminal Power Modules for a Solder-Free Solution in High-Volume Manufacturing
Microchip’s SP1F and SP3F power modules are highly configurable in Silicon Carbide (SiC) or Silicon (Si) technology and now available with Press-Fit terminals

Microchip Unveils New Standard of Enhanced Code Security With the PIC18-Q24 Family of MCUs
Added voltage level shifting capabilities help increase flexibility and reduce system costs

To Meet And Exceed Heightened Automotive Secure Authentication Requirements, Microchip Releases Its Latest TrustAnchor Security IC
Available as a CryptoAuthentication™ or CryptoAutomotive™ Secure IC, the new TA101 device focuses on larger key sizes and enhanced cybersecurity requirements

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