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CoolSiC™ MOSFET 1700 V SMD enables best efficiency and reduced complexity for high voltage auxiliary power supplies
Infineon Technologies AG complements its CoolSiC™ MOSFET offering with yet another voltage class. Having added 650 V to the portfolio earlier this year, the company is now launching the 1700 V class with its proprietary trench semiconductor technology.

Maximizing the strong physical characteristics of silicon carbide (SiC), this ensures that the new 1700 V surface-mounted devices (SMD) offer superior reliability, as well as low switching and conduction losses. The CoolSiC MOSFETs 1700 V are targeting auxiliary power supplies in three-phase conversion systems such as motor drives, renewables, charging infrastructure and HVDC systems.

Such low-power applications usually operate below 100 W. In these cases, designers very often prefer a single-ended flyback topology. With the new CoolSiC MOSFETs 1700 V in SMD package, this topology is now even enabled for DC-link connected auxiliary circuits up to 1000 V DC input voltage. High efficiency and high reliability auxiliary converters using a single-ended flyback converter can now be implemented in three-phase power conversion systems. This leads to smallest footprints and a reduced bill-of-materials.

“Trench technology of a CoolSiC MOSFET balancing performance and reliability in operation is now available for 1700 V”, said Dr. Peter Friedrichs, Senior Director SiC at the Industrial Power Control Division of Infineon. “It combines the best of SiC properties: low losses with small footprint, in a high voltage SMD package. This helps our customers to significantly reduce the complexity in their auxiliary power supplies”.

The 1700 V blocking voltage eliminates design concerns regarding overvoltage margin and reliability of power supplies. CoolSiC trench technology features lowest device capacitances and gate charges for transistors of this voltage class. The result is a power loss reduction by more than 50 percent and 2.5 percent higher efficiency compared to state-of-the art 1500 V silicon MOSFETs. The efficiency is 0.6 percent higher, compared to other 1700 SiC MOSFETs. The low losses enable compact SMD assembly with natural convection cooling without the need for a heatsink.

The new 1700 V CoolSiC trench MOSFETs are optimized for flyback topologies with +12 V / 0 V gate-source voltage compatible with common PWM controllers. Thus, they do not need a gate driver IC and can be operated directly by the flyback controller. On-resistance ratings are 450 mΩ, 650 mΩ or 1000 mΩ. The new 7 lead D²PAK SMD package offers extended creepage and clearance distances over 7 mm. With that, it fulfills the usual 1700 V application requirements and PCB specifications, minimizing isolation efforts for the design.

Availability

CoolSiC MOSFETs 1700 V in D²PAK-7L package are available and in series production. More information is available at www.infineon.com/coolsic-mosfet.

2020053001 / 30.05.2020 / Electronic-components / Infineon Technologies AG /

Infineon launches next-generation ZVS flyback converter chipset for advanced USB-C PD adapters and chargers
The growing popularity of USB-C power delivery (PD) charging increases the demand for compatible chargers. Users now seek powerful yet compact adapters.

Infineon Lighting Shoe: Infineon develops worldwide unique shoe prototype with adidas that listens to music and reacts to it with lighting effects

Infineon’s single-chip solution for NFC lock applications enables KISS to take self-storage to the next level with new smart lock solution

Infineon introduces new automotive 60 V and 120 V OptiMOS™ 5 in TOLx packages for 24 V-72 V supplied high power ECUs
The electrification of the transportation system is advancing continuously. In addition to passenger cars, 2- and 3-wheelers as well as light vehicles are increasingly being electrified. Therefore, the automotive market for Electronic Control Units (ECUs) powered by 24 V-72 V is expected to keep growing in the coming years.

Infineon presents highly integrated XENSIV™ 60 GHz radar sensor for consumer electronics, IoT applications, and healthcare devices

Engine management and pneumatic seat systems: Infineon launches two XENSIV™ barometric air pressure sensors

Infineon and SCHWEIZER extend cooperation in chip embedding to develop more efficient silicon carbide automotive solutions

Infineon introduces a new single-stage flyback controller for battery charging applications, enabling hassle-free and scalable designs
Battery-powered appliances, one of the industry’s fastest-growing segments, require energy-efficient, robust, and cost-effective battery charging. For this reason Infineon Technologies AG extends its offering of AC-DC controller ICs by introducing the ICC80QSG single-stage PWM controller for flyback topologies.

Infineon’s CoolSiC™ devices support bi-directional inverter from Delta to let electric vehicles become emergency backup power

Infineon and Oxford Ionics join forces to develop leading Trapped Ion Quantum Processors
Infineon Technologies AG and Oxford Ionics announce a collaboration to build high-performance and fully integrated quantum processing units (QPUs).

Optimized CoolSiC™ MOSFETs 650 V in D²PAK for lowest losses in the application and highest reliability in operation

World’s first TPM 2.0 with open-source software stack cuts down security integration efforts in industrial, automotive and IoT applications
Trusted Platform Modules (TPM) enable secured remote software updates, disc encryption and user authentication. Hence, they are crucial for connected industrial, automotive and other embedded devices.

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