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congatec presents Intel® IoT RFP Kit for workload consolidation in vision based situational awareness applications
See and understand

congatec – a leading vendor of embedded computing technology – presents its brand new workload consolidation kit for vision based situational awareness that is qualified by Intel as Intel® IoT RFP (Ready For Production) Kit. Based on a COM Express Type 6 module equipped with Intel® Xeon® E2 processor, the RFP kit has three virtual machines (VMs) built on Real-Time Systems’ hypervisor technology for workload consolidation in vision applications. One VM runs a vision based AI application on the basis of Intel® OpenVino® software for situational awareness, the second VM is real-time capable and runs deterministic control software, and the third VM operates a IIoT/Industry 4.0 gateway. The congatec kit designed in cooperation with Intel® and Real-Time Systems targets the next generation of vision based collaborative robotics, automation controls and autonomous vehicles that have to tackle multiple tasks in parallel, including situational awareness utilizing deep learning based AI algorithms.
 

The Real-Time Systems based virtual machines make it possible to consolidate the different tasks on a single edge computing platform, which ultimately saves costs. The Intel® OpenVino® software delivers the appropriate artificial intelligence for situational awareness. OEMs just need to load their control to the real-time VM and they are ready to enrich their real-time control with data from the situational awareness VM and to communicate in real-time with IIoT/Industry 4.0 counterparts to enable tactile internet controls.
 

“Workload consolidation demand is rapidly increasing in vision based situational awareness applications: Machine controls, collaborative robotics and autonomous vehicles need virtualization, as OEMs don’t want to assign the different control, vision and networking tasks to multiple dedicated systems,” explains Martin Danzer, Director Product Management at congatec.

 

The workload consolidation RFP kit unpacked

congatec’s ‘Intel® IoT RFP Kit’ for workload consolidation in vision based situational awareness applications includes a COM Express Type 6 module based platform with Intel® Xeon® E2 processor, a Basler vision camera, a pendulum controlled by a demo controller, and an Intel® Arria® 10 FPGA card from REFLEX CES. The platform has three pre-installed application ready VMs on the basis of Real-Time Systems’ hypervisor technology. One VM analyses videos on the basis of Intel® OpenVino® software, the second VM runs real-time Linux to control the balance of an inverted pendulum in real-time. The third partition hosts a gateway for IIoT/Industry 4.0 connectivity. More information about the new Intel® IoT RFP Kit for workload consolidation is available at:

https://marketplace.intel.com/s/offering/a5b3b000000ThjQAAS/realtime-workload-consolidation-starter-set

and https://www.congatec.com/workload-consolidation

Related Files
2020061701 / 17.06.2020 / Tools / congatec AG /

congatec presents new SMARC modules on the basis of the NXP i.MX 95 processor series
congatec modules set new benchmarks for secure edge AI applications

congatec COM-HPC Client modules with latest socketed Intel Core processors set performance record
Bringing a refreshing performance boost to the edge

congatec launches COM Express Compact module with brand new Intel® Core™ Ultra processors
Next-generation AI computing for the edge

congatec launches new ultra-rugged 13th Gen Intel Core Computer-on-Modules with soldered RAM
Shock and vibration resistant for harsh environments

congatec takes over sales of Real-Time Systems’ products
The target: holistic consolidation and digitization offerings

congatec welcomes ratification of COM-HPC 1.2 specification, introducing COM-HPC Mini
Maximum performance for mini footprints

congatec introduces new SMARC modules with TI Jacinto™ 7 TDA4x or DRA8x processors
High-end edge AI and vision processing in ultra-low power envelop

congatec COM Express modules receive IEC-60068 railway certification
Proven shock and vibration resistant for harsh environments

congatec adds TI processors to its strategic solutions portfolio
Building a high-performance ecosystem for Arm based SMARC modules

congatec and Kontron conclude joint COM-HPC evaluation carrier board standardization agreement
The goals: Reduce NRE costs, accelerate time-to-market, and improve product & supply security

Solution platforms for high-performance engineering
congatec will be presenting its enhanced high-performance landscape for edge computing at Automation World Korea (hall C, booth 534).

congatec introduces a new carrier board design training program
Accelerating knowledge transfer

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