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QPL-qualified SupIR-SMD package for rad hard MOSFETs enables higher performing space power systems
Reliably attaching surface mount hermetic power packages to PCBs is a common challenge faced by space system designers.

Too often, different thermal coefficients lead to an expansion mismatch of different materials. IR HiRel, an Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) company, solves this issue with fourteen newly QPL-qualified radiation-hardened (rad hard) MOSFETs housed in an innovative direct-to-PCB mounting package. SupIR-SMD is key to higher performing space power systems such as satellite bus power distribution systems, payload power supplies, space-grade DC-DC converters, and other high-switching designs.

Capable of attaching directly to the PCB, the SupIR-SMD design is optimized for surface mount attach and proven to meet the most stringent reliability testing in this configuration, as detailed in IR HiRel’s application note #1222. Compared to the typical packaging solution used in space applications, the SupIR-SMD delivers a 37 percent smaller footprint, 34 percent lighter mass and 33 percent higher current density, while offering a more direct thermal path for heat transfer. “With this, the SupIR-SMD package is testament to IR HiRel’s commitment to deliver innovation that exceeds the specific requirements of the space market,” said Eric Toulouse, Vice-President and General Manager of IR HiRel.

Traditionally, designers resort to a ‘dead bug’ and lead configuration, where the packages are flipped upside down and soldered to the PCB via leads. Dead bug soldering dissipates heat sub-optimally and decreases MOSFET power capacity. Looking forward, system designers can optimize power system efficiency through direct mount of the SupIR-SMD package to the PCB, enabling the shortest thermal conduction path without any compromise in system reliability.

The SupIR-SMD package is JANS-qualified to MIL-PRF-19500. JANS is the most rigorous level of screening and acceptance requirements available to assure the performance, quality and reliability of discrete semiconductors intended for space flight. The new rad hard MOSFETs are also QPL-qualified in accordance with the Qualified Products List (QPL) for space applications.

Availability

The new SupIR-SMD QPL-qualified rad hard MOSFETs can be ordered now with the MIL-PRF-19500 package identifier ‘U2A.’ More information is available at www.infineon.com/supir-smd.

2020062302 / 23.06.2020 / Electronic-components / Infineon Technologies AG /

Infineon launches SECORA™ Pay Green – the world’s first contactless payment card technology allowing for up to 100% reduction in plastic waste

Infineon and Swoboda cooperate to develop high-performance current sensors for electromobility

New industrial CoolSiC™ MOSFETs 650 V G2 in TOLT and Thin-TOLL package increase system power density
The electronics industry is witnessing a significant shift towards more compact and powerful systems, driven by technological advancements and a growing focus on decarbonization efforts.

Infineon unveils CoolSiC™ MOSFETs 400 V redefining power density and efficiency in AI server power supplies

Infineon presents XENSIV™ TLE49SR angle sensor family with outstanding stray field robustness
Infineon Technologies AG introduces the new XENSIV™ TLE49SR angle sensor family, which combines excellent stray field immunity with high accuracy. The sensors are ideal for applications of safety-critical automotive chassis systems such as electric power steering and vehicle height leveling.

Infineon introduces PSoC™ 4 HVPA-144K microcontroller for automotive battery management systems

Infineon provides FOXESS with power semiconductors to improve efficiency and power density of energy storage applications

Infineon launches next-generation ZVS flyback converter chipset for advanced USB-C PD adapters and chargers
The growing popularity of USB-C power delivery (PD) charging increases the demand for compatible chargers. Users now seek powerful yet compact adapters.

Infineon Lighting Shoe: Infineon develops worldwide unique shoe prototype with adidas that listens to music and reacts to it with lighting effects

Infineon’s single-chip solution for NFC lock applications enables KISS to take self-storage to the next level with new smart lock solution

Infineon introduces new automotive 60 V and 120 V OptiMOS™ 5 in TOLx packages for 24 V-72 V supplied high power ECUs
The electrification of the transportation system is advancing continuously. In addition to passenger cars, 2- and 3-wheelers as well as light vehicles are increasingly being electrified. Therefore, the automotive market for Electronic Control Units (ECUs) powered by 24 V-72 V is expected to keep growing in the coming years.

Infineon presents highly integrated XENSIV™ 60 GHz radar sensor for consumer electronics, IoT applications, and healthcare devices

Company of the week

NeoCortec

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electronica—Leading the way to the All Electric Society


GAMING, COMPUTER ACCESSORIES AND OTHER RELATED PRODUCTS


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE


Video Report from AMPER 2022


Address Book


NeoCortec


PULSIV


MikroElektronika d.o.o.


Panasonic Industry


Cambridge GaN Devices


Traco Power


BALLUFF


Seica


PEI-Genesis


KEYENCE


CML Microcircuits


SAMTEC


ams-OSRAM


INTEL


TDK Corporation


Giada


RS group


NOKIA


ANRITSU


Digi-Key Electronics


AERS


Flex Power Modules


Danisense


BINDER


Parker Hannifin


MOXA


DANFOSS


Alliance Memory


Intelliconnect (Europe) Ltd.


KIOXIA Europe GmbH



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