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World’s first TPM 2.0 with open-source software stack cuts down security integration efforts in industrial, automotive and IoT applications
Trusted Platform Modules (TPM) enable secured remote software updates, disc encryption and user authentication. Hence, they are crucial for connected industrial, automotive and other embedded devices.

Munich, Germany – 19 March 2021 – Trusted Platform Modules (TPM) enable secured remote software updates, disc encryption and user authentication. Hence, they are crucial for connected industrial, automotive and other embedded devices. To further facilitate seamless integration in Linux-based systems, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) now provides its leading OPTIGA™ TPM 2.0 solution with a comprehensive TSS* host software implementing the latest FAPI standard. Infineon has developed the open-source software jointly with Intel Corporation and Fraunhofer Institute for Secure Information Technology SIT.

By using Infineon’s plug-and-play OPTIGA TPM 2.0, IoT system integrators can significantly improve the security of connected products. Software integration with TSS-FAPI does not require specific skills in low-level security specifications and reduces source code development by a factor of up to 16. Therefore, expenses and time to market can be reduced. Additionally, manufacturers can accelerate the process for certifying their industrial devices according to the IEC 62443 standard for industrial applications, which requires hardware-based safety from level 4 upwards.

The FAPI specification has been released recently as an international standard by the Trusted Computing Group (TCG). The specification is implemented in the TSS stack 1 together with the associated tools and plug-ins. The TSS stack is open-source software, which allows seamless integration of the TPM 2.0 in Linux-based systems. This includes the support of typical Linux software for device authentication, data encryption, software updates and remote device management.

In addition, the FAPI enables the native support of the PKCS#11 standard as a generic interface for user authentication, single sign-on and e-mail encryption/signing. The FAPI provides a default configuration for cryptographic functionalities, system integration and automated processing of security mechanisms according to the latest state-of-the-art and industrial best-practices.

The OPTIGA TPM acts as a vault for sensitive data in connected devices and lowers the risk of data and production losses due to cyberattacks. Infineon’s TPMs are certified by independent certification bodies according to Common Criteria, an international set of guidelines and specifications developed for evaluating information security products. The TSS stack including the recent FAPI has been verified with the Infineon TPM portfolio to achieve compliance and interoperability.

Availability

Application developers can use the OPTIGA TPM SLB 9670, OPTIGA TPM SLI 9670 and OPTIGA TPM SLM 9670 Iridium boards and TSS Quickstarter offered by Infineon to get started right away. Board and source code packages for the Infineon AURIX™ as well as for Arduino microcontrollers are available now. More information about Infineon’s OPTIGA TPM is available at www.infineon.com/TPM. More information about the Github Project (including the downloadable code) is available here.

*TSS – TPM Software Stack 3; FAPI – Feature API as specified by the Trusted Computing Group 2

1 https://github.com/tpm2-software/

2 https://trustedcomputinggroup.org/resource/tss-fapi/

3 https://trustedcomputinggroup.org/resource/tss-overview-common-structures-specification/

2021032201 / 22.03.2021 / Embedded / Infineon Technologies AG /

Infineon launches SECORA™ Pay Green – the world’s first contactless payment card technology allowing for up to 100% reduction in plastic waste

Infineon and Swoboda cooperate to develop high-performance current sensors for electromobility

New industrial CoolSiC™ MOSFETs 650 V G2 in TOLT and Thin-TOLL package increase system power density
The electronics industry is witnessing a significant shift towards more compact and powerful systems, driven by technological advancements and a growing focus on decarbonization efforts.

Infineon unveils CoolSiC™ MOSFETs 400 V redefining power density and efficiency in AI server power supplies

Infineon presents XENSIV™ TLE49SR angle sensor family with outstanding stray field robustness
Infineon Technologies AG introduces the new XENSIV™ TLE49SR angle sensor family, which combines excellent stray field immunity with high accuracy. The sensors are ideal for applications of safety-critical automotive chassis systems such as electric power steering and vehicle height leveling.

Infineon introduces PSoC™ 4 HVPA-144K microcontroller for automotive battery management systems

Infineon provides FOXESS with power semiconductors to improve efficiency and power density of energy storage applications

Infineon launches next-generation ZVS flyback converter chipset for advanced USB-C PD adapters and chargers
The growing popularity of USB-C power delivery (PD) charging increases the demand for compatible chargers. Users now seek powerful yet compact adapters.

Infineon Lighting Shoe: Infineon develops worldwide unique shoe prototype with adidas that listens to music and reacts to it with lighting effects

Infineon’s single-chip solution for NFC lock applications enables KISS to take self-storage to the next level with new smart lock solution

Infineon introduces new automotive 60 V and 120 V OptiMOS™ 5 in TOLx packages for 24 V-72 V supplied high power ECUs
The electrification of the transportation system is advancing continuously. In addition to passenger cars, 2- and 3-wheelers as well as light vehicles are increasingly being electrified. Therefore, the automotive market for Electronic Control Units (ECUs) powered by 24 V-72 V is expected to keep growing in the coming years.

Infineon presents highly integrated XENSIV™ 60 GHz radar sensor for consumer electronics, IoT applications, and healthcare devices

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NeoCortec

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