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25.03.2023 0:07:25
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Interesting video
Various
DPI 750E
RS Components adds range of enhanced pre
conga-TR4
AMD Ryzen™ based congatec COM Express mo
BHI260AB
An All-in-One Programmable Smart Sensor
BAHCO
BAHCO set of insulated wrenches
s-Sense
s-Sense modules from R&D SOFTWARE SOLUTI
TH381
TH381 series miniature, high IP rated co
TP-1303
Twintex TP-1000 series dual channel powe
T5808
TDK announces world’s first MIPI standar
Portable SSD T7 Touch
Samsung Releases Portable SSD T7 Touch –
AR236.B & AR232.B
APAR AR236.B & AR232.B radio loggers
Intel Alder Lake Product Video
Check out the new congatec Alder Lake video showing you performance gains and improvements to accelerate the world of embedded and real-time edge computing systems.
2022010502 / 10.01.2022 /
Interesting video
/
congatec AG
/
electronic-info.eu/2022010502/intel-alder-lake-product-video
elektronik-info.cz/2022010502/intel-alder-lake-product-video
elektronik-info.pl/2022010502/intel-alder-lake-product-video
elektronik-info.ru/2022010502/intel-alder-lake-product-video
components.online/2022010502/intel-alder-lake-product-video
congatec and Kontron conclude joint COM-HPC evaluation carrier board standardization agreement
The goals: Reduce NRE costs, accelerate time-to-market, and improve product & supply security
Solution platforms for high-performance engineering
congatec will be presenting its enhanced high-performance landscape for edge computing at Automation World Korea (hall C, booth 534).
congatec introduces a new carrier board design training program
Accelerating knowledge transfer
congatec introduces first COM-HPC Mini modules at embedded world 2023
Small form factor to complete high-performance ecosystem
congatec expands its portfolio of COM-HPC Computer-on-Modules with 13th Gen Intel Core processor to include high-end variants with LGA socket
The ultimate performance boost consolidated edge applications have been waiting for
congatec introduces new Computer-on-Modules with 13th Gen Intel Core processors
Happy new year for high-end embedded computers: The world’s fastest Client Computer-on-Modules generation is here
PICMG COM-HPC committee approves COM-HPC Mini pinout
Mini form factor for maximum performance
congatec welcomes COM Express 3.1 specification with compliant Computer-on-Modules
Performance boost now standard-compliant
Accelerating the real-time digitization
congatec introduces its ecosystem for TSN networked real-time factories and critical infrastructures
congatec introduces high-performance COM-HPC carrier board in Micro-ATX form factor
Modular high-end Micro-ATX carrier for more sustainable and ultra-scalable COM-HPC based system designs
congatec receives VDC Research’s Platinum Vendor Satisfaction Award for IoT & Embedded Hardware technology
Award-winning: congatec’s support of customers through dramatic business challenges and technological change
congatec modules drive Intel Labs China’s Robot 4.0 platform for research and education
Making the robotic edge modular
Company of the week
AERS
Interesting video
Video Report from AMPER 2022
INDUSTRIAL PRESSURE TRANSDUCERS FROM CYNERGY3
"Electronics is Magic" Adam Kuczyński Talks About Innovations - TME on Electronica 2022 [INTERVIEW]
Introducing NVIDIA DGX A100
Webinar | Realtime and AI integration with COM-HPC
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Analog Devices
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Yamaichi Electronics USA Inc.
PICMG
Laird Thermal Systems
HARTING
Jenoptik
MACH SYSTEMS s.r.o.
A.P.O. - ELMOS v.o.s.
Pico Technology
Lynred
Advantech
EBV
SECO S.p.A.
Crowd Supply
Digi-Key Electronics
Durakool
Calendary
SMTconnect, 9.-11.5.2023, Nuremberg, DE
PCIM Europe, 9.-11.5.2023, Nuremberg, DE
sps Italia, 13.-15.5.2023, Fiere di Parma, IT
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX
Interesting video
The ISS Design Challenge ...
Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara
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