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Six New 4Gb “A” Die DDR4 SDRAMs and a 16Gb Option From Micron Technology
Alliance Memory announces that it has expanded its portfolio of CMOS DDR4 SDRAMs with new “A” die versions of the 4Gb AS4C256M16D4 and AS4C512M8D4 in the 96-ball and 78-ball FBGA packages, respectively.

Built on a finer process that results in a smaller chip than the original, the AS4C256M16D4A-62BCN, AS4C256M16D4A-62BIN, AS4C256M16D4A-75BCN, AS4C256M16D4A-75BIN, AS4C512M8D4A-75BCN, and AS4C512M8D4A-75BIN deliver improved performance — with lower power consumption and higher speeds and transfer rates — at a lower cost. In addition, Alliance Memory is continuing its partnership with Micron Technology and offering the company’s MT40A1G16KH-062E DDR4 SDRAM to provide customers with a 16Gb option.

Parts Table:

Part # Density Organization Package Speed Temp. range (°C)
AS4C256M16D4-83BCN 4Gb 256M x 16 96-ball FBGA 1200MHz 0 to +95
AS4C256M16D4-83BIN 4Gb 256M x 16 96-ball FBGA 1200MHz -40 to +95
AS4C256M16D4-75BCN 4Gb 256M x 16 96-ball FBGA 1333MHz 0 to +95
AS4C256M16D4-75BIN 4Gb 256M x 16 96-ball FBGA 1333MHz -40 to +95
AS4C256M16D4A-62BCN 4Gb 256M x 16 96-ball FBGA 1600MHz 0 to +95
AS4C256M16D4A-62BIN 4Gb 256M x 16 96-ball FBGA 1600MHz -40 to +95
AS4C256M16D4A-75BCN 4Gb 256M x 16 96-ball FBGA 1333MHz 0 to +95
AS4C256M16D4A-75BIN 4Gb 256M x 16 96-ball FBGA 1333MHz -40 to +95
AS4C512M8D4-83BCN 4Gb 512M x 8 78-ball FBGA 1200MHz 0 to +95
AS4C512M8D4-83BIN 4Gb 512M x 8 78-ball FBGA 1200MHz -40 to +95
AS4C512M8D4-75BCN 4Gb 512M x 8 78-ball FBGA 1333MHz 0 to +95
AS4C512M8D4-75 4Gb 512M x 8 78-ball FBGA 1333MHz -40 to +95
AS4C512M8D4A-75BCN 4Gb 512M x 8 78-ball FBGA 1333MHz 0 to +95
AS4C512M8D4A-75BIN 4Gb 512M x 8 78-ball FBGA 1333MHz -40 to +95
AS4C512M16D4-75BCN 8Gb 512M x 16 96-ball FBGA 1333MHz 0 to +95
AS4C512M16D4-75BIN 8Gb 512M x 16 96-ball FBGA 1333MHz -40 to +95
AS4C1G8D4-75BCN 8Gb 1Gb x 8 78-ball FBGA 1333MHz 0 to +95
AS4C1G8D4-75BIN 8Gb 1Gb x 8 78-ball FBGA 1333MHz -40 to +95
MT40A1G16KH-062E 16Gb 1Gb x 16 96-ball FBGA 1600MHz 0 to +95

Key Specifications and Benefits:

  • 4Gb Alliance Memory DDR4 SDRAMs
  • Low operating voltages of +1.2V (±0.06V)
  • Built on a new process technology for fast clock speeds up to 1600MHz and transfer rates up to 3200Mbps
  • Support sequential and interleave burst types with read or write burst lengths of BL8/BC4/BC4 or 8 on the fly
  • An auto pre-charge function provides a self-timed row pre-charge initiated at the end of the burst sequence
  • Easy-to-use refresh functions include auto- or self-refresh
  • Offered in commercial (0°C to +95°C) and industrial (-40°C to +95°C) temperature ranges
  • 16Gb Micron Technology DDR4 SDRAM
  • Operates from a +1.2V power supply over a commercial temperature range
  • Built on an 8n-prefetch architecture for high data rates of 3200 MT/s
  • Supports read or write burst lengths of BC4 or BL8 on the fly

Target Applications:

  • Portable electronics, such as smartphones and tablets
  • 5G designs, computing applications, surveillance systems, smart meters, human-machine interfaces (HMI), digital signal controllers, and PNDs

The Context: Built on a finer process that results in a smaller chip than the original 4Gb AS4C256M16D4A and AS4C512M8D4 DDR4 SDRAMs, Alliance Memory’s new “A” die versions deliver improved performance — with lower power consumption down to +1.2V (±0.06V), faster clock speeds to 1600MHz, and higher transfer rates to 3200Mbps — at a lower cost. With minimal die shrinks, the AS4C256M16D4A-62BCN, AS4C256M16D4A-62BIN, AS4C256M16D4A-75BCN, AS4C256M16D4A-75BIN, AS4C512M8D4A-75BCN, and AS4C512M8D4A-75BIN provide reliable drop-in, pin-for-pin-compatible replacements for numerous similar solutions — eliminating the need for costly redesigns and part requalification. The new “A” die devices are ideal for the industrial, networking, telecommunications, gaming, and consumer markets, for which Alliance Memory is utilizing a dual sourcing strategy to ensure supply longevity. The addition of Micron Technology’s MT40A1G16KH-062E to Alliance Memory’s offering of DDR4 SDRAMs provides the company’s customers with access to a 16Gb device for a wide range of applications.

Availability: Samples and production quantities of the AS4C256M16D4A-62BCN, AS4C256M16D4A-62BIN, AS4C256M16D4A-75BCN, AS4C256M16D4A-75BIN, AS4C512M8D4A-75BCN, and AS4C512M8D4A-75BIN are available now, with lead times of eight to 12 weeks. Micron’s MT40A1G16KH-062E is available now from stock.

Product Datasheet:

https://www.alliancememory.com/datasheets/AS4C256M16D4A/ (AS4C256M16D4A-62BCN, AS4C256M16D4A-62BIN, AS4C256M16D4A-75BCN, and AS4C256M16D4A-75BIN)

https://www.alliancememory.com/datasheets/MT40A1G16KH-062E/ (MT40A1G16KH-062E)

https://www.alliancememory.com/datasheets/as4c512m8d4a/ (AS4C512M8D4A-75BCN, and AS4C512M8D4A-75BIN)

2022092702 / 27.09.2022 / Electronic-components / Alliance Memory /

New 16Gb LPDDR4X SDRAM
We’ve expanded our offering of high-speed CMOS mobile low-power SDRAMs with a new single-channel 16Gb LPDDR4X device that combines low power ratings with increased clock speeds and data rates in the 200-ball FBGA package.

New 2Gb, 4Gb, 8Gb, and 16Gb LPDDR4X SDRAMs
Alliance Memory has expanded its offering of high-speed CMOS mobile low-power SDRAMs with four new LPDDR4X devices in a variety of densities. Offering an extension to the company’s fourth-generation LPDDR4 SDRAMs, the 2Gb AS4C128M16MD4V-062BAN, 4Gb AS4C256M16MD4V-062BAN, 8Gb AS4C512M16MD4V-053BIN, and 16Gb AS4C512M32MD4V-053BIN deliver ~50% lower power ratings in the 200-ball FBGA package for higher power efficiency.

Six New 4Gb “A” Die DDR4 SDRAMs and a 16Gb Option From Micron Technology
Alliance Memory announces that it has expanded its portfolio of CMOS DDR4 SDRAMs with new “A” die versions of the 4Gb AS4C256M16D4 and AS4C512M8D4 in the 96-ball and 78-ball FBGA packages, respectively.

Alliance Memory at Embedded World 2020
Following on its successful inaugural appearance at Embedded World in 2019, Alliance Memory returns in 2020 to highlight its SRAM, pseudo SRAM, NOR Flash, and DRAM memory ICs for embedded platforms.

Alliance Memory Cuts Lead Times for Automotive Temperature DRAM Portfolio
Alliance Memory announced that it has greatly reduced lead times for its DRAMs with -40°C to +105°C automotive temperature ratings. Responding to customer demand, Alliance Memory now holds many parts in finished goods stock and in addition can promise lead times of just six weeks for its most popular automotive temperature range products.

Alliance Memory at electronica 2018, Hall B5, Booth 526
Alliance Memory provides hard-to-find SRAMs, pseudo SRAMs, and DRAMs, including DDR, DDR1, DDR2 and DDR3 SDRAMs and mobile LPDDRs for legacy and new designs.

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