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Infineon and SCHWEIZER extend cooperation in chip embedding to develop more efficient silicon carbide automotive solutions

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Schweizer Electronic AG (ETR: SCE) are collaborating on an innovative way to further increase the efficiency of chips based on silicon carbide (SiC). Both partners are developing a solution to embed Infineon’s 1200 V CoolSiC™ chips directly onto printed circuit boards (PCB). This will increase the range of electric vehicles and reduce the total system costs.

The two companies have already demonstrated the potential of this new approach: They were able to embed a 48 V MOSFET in the PCB. This resulted in a 35 percent increase in performance. SCHWEIZER contributes to this success with its innovative p²Pack® solution which enables power semiconductors to be embedded in PCBs.

“Our joint goal is to take automotive power electronics to the next level,” said Robert Hermann, Product Line Head Automotive High-Voltage Discretes and Chips, of Infineon. “The low-inductive environment of a PCB allows clean and fast switching. Combined with the leading performance of 1200 V CoolSiC™ devices, chip embedding enables highly integrated and efficient inverters that reduce overall system costs.”

“With Infineon’s 100 percent electrically tested standard cells (S-Cell), we can achieve high overall yields in the p² Pack manufacturing process,” said Thomas Gottwald, Vice President Technology at Schweizer Electronic AG. “The fast-switching characteristics of the CoolSiC chips are optimally supported by the low-inductance interconnection that can be achieved with the p² Pack. This leads to increased efficiency and improved reliability of power conversion units such as traction inverters, DC-DC converters, or on-board chargers.”

Infineon and SCHWEIZER will showcase the 1200 V CoolSiC chip embedding technology at PCIM Europe 2023 in Nuremberg, at the Infineon booth 412 in Hall 7. SCHWEIZER will also be at the trade fair (booth 410 in Hall 6).

Infineon at the PCIM 2023

At the PCIM Europe 2023 tradeshow, Infineon is showcasing innovative product-to-system solutions for applications that will power the world and shape the future. Company representatives will also be giving several presentations at the accompanying PCIM Conference and Industry & E-Mobility Forum with live and on-demand video presentations, followed by discussions with the speakers. “Driving decarbonization and digitalization. Together.” at the Infineon booth #412 in hall 7, 9-11 May, 2023 in Nuremberg, Germany. Information about the PCIM Europe 2023 show highlights is available at www.infineon.com/pcim.

About Schweizer Electronic AG

Schweizer Electronic AG offers the latest, cutting-edge technology and consultancy expertise in the PCB industry. Thanks to its state-of-the-art production facilities in Schramberg, Germany and Jintan, China as well as close partnerships with other technology leaders, SCHWEIZER provides individual PCB & Embedding solutions. SCHWEIZER's innovative PCB technologies are used in the most demanding applications, for example, in the Automotive, Aviation, Industry & Medical and Communications & Computing sectors, and are characterised by their extremely high quality and energy-saving and environmentally-friendly features. The company was founded by Christoph Schweizer in 1849 and is listed at the Stuttgart and Frankfurt Stock Exchanges (ticker symbol „SCE“, „ISIN DE 000515623“). More information is available at www.schweizer.ag

2023042901 / 27.04.2023 / Electronic-components / Infineon Technologies AG /

Infineon launches SECORA™ Pay Green – the world’s first contactless payment card technology allowing for up to 100% reduction in plastic waste

Infineon and Swoboda cooperate to develop high-performance current sensors for electromobility

New industrial CoolSiC™ MOSFETs 650 V G2 in TOLT and Thin-TOLL package increase system power density
The electronics industry is witnessing a significant shift towards more compact and powerful systems, driven by technological advancements and a growing focus on decarbonization efforts.

Infineon unveils CoolSiC™ MOSFETs 400 V redefining power density and efficiency in AI server power supplies

Infineon presents XENSIV™ TLE49SR angle sensor family with outstanding stray field robustness
Infineon Technologies AG introduces the new XENSIV™ TLE49SR angle sensor family, which combines excellent stray field immunity with high accuracy. The sensors are ideal for applications of safety-critical automotive chassis systems such as electric power steering and vehicle height leveling.

Infineon introduces PSoC™ 4 HVPA-144K microcontroller for automotive battery management systems

Infineon provides FOXESS with power semiconductors to improve efficiency and power density of energy storage applications

Infineon launches next-generation ZVS flyback converter chipset for advanced USB-C PD adapters and chargers
The growing popularity of USB-C power delivery (PD) charging increases the demand for compatible chargers. Users now seek powerful yet compact adapters.

Infineon Lighting Shoe: Infineon develops worldwide unique shoe prototype with adidas that listens to music and reacts to it with lighting effects

Infineon’s single-chip solution for NFC lock applications enables KISS to take self-storage to the next level with new smart lock solution

Infineon introduces new automotive 60 V and 120 V OptiMOS™ 5 in TOLx packages for 24 V-72 V supplied high power ECUs
The electrification of the transportation system is advancing continuously. In addition to passenger cars, 2- and 3-wheelers as well as light vehicles are increasingly being electrified. Therefore, the automotive market for Electronic Control Units (ECUs) powered by 24 V-72 V is expected to keep growing in the coming years.

Infineon presents highly integrated XENSIV™ 60 GHz radar sensor for consumer electronics, IoT applications, and healthcare devices

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NeoCortec

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intersec Dubai 2025, 14.-16.1.2025
DistribuTECH, 11.2.-13.2.2025, Dallas, TX
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productronica 2025, München, DE, 18.-21.11.2025
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