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AMD Ryzen™ based congatec COM Express mo

congatec presents new SMARC modules on the basis of the NXP i.MX 95 processor series
congatec modules set new benchmarks for secure edge AI applications

congatec – a leading provider of embedded and edge computing technology – presents new high-performance computer-on-modules (COMs) with i.MX 95 processors from NXP, thereby expanding its extensive module portfolio with low-power NXP i.MX Arm processors. In doing so, congatec underlines its strong partnership with NXP. Customers benefit from straightforward scalability and reliable upgrade paths for existing and new energy-efficient edge AI applications with high security requirements. 

In these applications the new modules offer the advantages of up to three times the GFLOPS computing performance compared to the previous generation with i.MX8 M Plus processors. The new neural processing unit from NXP called 'eIQ Neutron' doubles the inference performance for AI accelerated machine vision. In addition, the hardware-integrated EdgeLock® secure enclave simplifies the implementation of in-house cyber security measures. 

The new conga-SMX95 SMARC modules are designed for an industrial temperature range of -40°C to +85°C, are robust in mechanical terms and optimised for cost- and energy-efficient applications. The integrated high-performance eIQ Neutron NPU makes it possible for AI accelerated workloads to be performed even closer to the local device level. Specific applications for the new SMARC modules can be found in AI accelerated low-power applications in sectors such as industrial production, machine vision and visual inspection, rugged HMIs, 3D printers, robotics controllers in AMR and AGV, as well as medical imaging and patient monitoring systems. Other target applications include passenger seat back entertainment in buses and aircraft, along with fleet management in transportation, and construction and farming applications. 


The feature set in detail

The new conga-SMX95 SMARC 2.1 modules are based on the next generation of the NXP i.MX 95 application processors with 4-6 Arm Cortex-A55 cores. NXP is now using the new Arm Mali 3D graphics unit for the first time, which delivers up to three times the GPU performance compared to predecessors based on i. MX8 M Plus. Also new is the image signal processor (ISP) for hardware accelerated image processing. Particularly noteworthy is the NXP eIQ Neutron NPU for hardware accelerated AI inference and machine learning (ML) on-the-edge in the new SMARC modules. The corresponding eIQ® software development environment from NXP offers OEMs a high-performance development environment which simplifies the implementation of in-house ML applications.

In addition, the new SMARC modules integrate a real-time domain for real-time controllers. The conga-SMX95 SMARC modules offer 2x Gbit Ethernet with TSN for synchronised and deterministic network data transmission, LPDDR5 (with inline ECC) for data security. For display connectivity the new modules offer DisplayPort as the standard interface and the still widely used LVDS display interface. For direct camera connectivity the modules have 2x MIPI-CSI. 

congatec also offers an extensive hardware and software ecosystem as well as comprehensive design-in-services for simplified and accelerated application development. These include, among other things, evaluation- and production-ready application carrier boards and custom-tailored cooling solutions. In terms of services, congatec offers comprehensive documentation, training and signal integrity measurements for application development.

Further information about the new conga-SMX95 SMARC modules is available here: conga-SMX95

Further information about the SMARC module standard is available here: SMARC Technology

2024070901 / 09.07.2024 / Embedded / congatec AG /

congatec presents new SMARC modules on the basis of the NXP i.MX 95 processor series
congatec modules set new benchmarks for secure edge AI applications

congatec COM-HPC Client modules with latest socketed Intel Core processors set performance record
Bringing a refreshing performance boost to the edge

congatec launches COM Express Compact module with brand new Intel® Core™ Ultra processors
Next-generation AI computing for the edge

congatec launches new ultra-rugged 13th Gen Intel Core Computer-on-Modules with soldered RAM
Shock and vibration resistant for harsh environments

congatec takes over sales of Real-Time Systems’ products
The target: holistic consolidation and digitization offerings

congatec welcomes ratification of COM-HPC 1.2 specification, introducing COM-HPC Mini
Maximum performance for mini footprints

congatec introduces new SMARC modules with TI Jacinto™ 7 TDA4x or DRA8x processors
High-end edge AI and vision processing in ultra-low power envelop

congatec COM Express modules receive IEC-60068 railway certification
Proven shock and vibration resistant for harsh environments

congatec adds TI processors to its strategic solutions portfolio
Building a high-performance ecosystem for Arm based SMARC modules

congatec and Kontron conclude joint COM-HPC evaluation carrier board standardization agreement
The goals: Reduce NRE costs, accelerate time-to-market, and improve product & supply security

Solution platforms for high-performance engineering
congatec will be presenting its enhanced high-performance landscape for edge computing at Automation World Korea (hall C, booth 534).

congatec introduces a new carrier board design training program
Accelerating knowledge transfer

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electronica 2024, 12.11.-15.11.2024, Munich, DE


Video Report from AMPER 2022


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Calendary
HKTDC Hong Kong Electronics Fair, 13.10.-16.10.2024
electronica 2024, 12.11.-15.11.2024, Munich, DE
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

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The ISS Design Challenge ...

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Mouser Electronics Warehouse Tour with Grant Imahara


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