Address Book 06.05.2025 0:07:12 bloky maketa
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ChipConnect™ Cable Assemblies TE Connectivity AMP's ChipConnect internal faceplate-to-processor cable assemblies are required for Intel® Omni-Path Architecture (OPA). In the CPU processor, these cable assemblies mate directly with LGA 3647 sockets at the processor and Intel internal faceplate transition (IFT) connectors at the faceplate for 25 Gbps speeds. |
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Interesting video
Address Book
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Calendary SENSOR+TEST 2025, Nuremberg, 06.–08.5.2025 | Laser World of Photonics, München, DE, 24.-27.6.2025 | electronica India 2025, Dehli, 17.-19.9.2025 | SEMICON Europa, München, DE, 18.-21.11.2025 | productronica 2025, München, DE, 18.-21.11.2025 | electronica 2026, München, DE, 10.-13.11.2026 |
Interesting video |
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The ISS Design Challenge ... |
Interesting video |
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Mouser Electronics Warehouse Tour with Grant Imahara |
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