Address Book
 

NeoCortec
 

PULSIV
 

MikroElektronika d.o.o.
 

Panasonic Industry
 

Cambridge GaN Devices
 

Traco Power
 

BALLUFF
 

Seica
 

PEI-Genesis
 

KEYENCE
 

CML Microcircuits
 

SAMTEC
 

ams-OSRAM
 

INTEL
 

TDK Corporation

21.11.2024 9:08:15
bloky
maketa
HomePage
Electronic-components
Embedded
Industry automation
Pneumatic
Test & measurement
Tools
Electromobility
Solar energy
Lighting
Jobs
Trade fairs, Events
Virtual events
Interesting video
Various

Access Point WBE750
 
NETGEAR Unveils the Ultimate Tri-band Wi
Intel Core 14th Gen i9
 
Intel Core 14th Gen i9-14900KS Powers De
DDRH-15/30/45/60
 
Mean Well’s DDRH Series Isolated Ultra-W
TimeProvider® 4500 Series
 
TimeProvider® 4500 Series Is the Industr
IAM-20381HT
 
TDK announces new 3-axis accelerometer,
Microchip’s 5071B
 
New Cesium Atomic Clock Provides Autonom
POLOLU-4980
 
MINIATURE STEP-UP/STEP-DOWN CONVERTERS F
MANSON SDP-2210
 
MANSON SDP-2210 PROGRAMMABLE LABORATORY
DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo

NXP Introduces Automotive Secure Element for Smart Key Fobs
NXP’s first automotive-qualified Secure Element with NFC and wired interfaces for smart fobs for keyless entry and various security-critical applications helps increase the security of smart connected cars.
What’s New

NXP® Semiconductors has announced the NCJ37x Secure Element (SE), an automotive-qualified secure microcontroller with advanced cryptographic accelerators and physical built in electrical attack resistance for various security-critical automotive applications such as smart access key fobs, Qi 1.3 authentication or car-to-cloud communication. The device supports the protocols from the Car Connectivity Consortium  (CCC) and its passive NFC ISO 14443-4 interface and highly-secure design approach addresses the needs of next-generation smart fobs combining Ultra-Wideband (UWB), Bluetooth® Low Energy (BLE), and passive near field communication (NFC) technologies.

Why It Matters

Carmakers are rapidly adopting smartphone access systems and evolving their smart fobs towards the higher security levels and wireless interfaces familiar from the smartphone world. This enables new use cases for smart fobs like having digital keys for several cars stored on the fob, and adding other payment means such as bank cards. To meet these needs, OEMs are looking for an open, multi-solution platform with higher security and flexibility that can accelerate time to market. The new NXP NCJ37x Secure Element works with NXP’s NCJ38x car-side Secure Element and corresponding secure applets. The passive ISO 14443-4 NFC, SPI, and I²C interfaces help enable robust protection against latest attack scenarios and an extended feature set for a broad range of secure in-car applications entering the market requiring the secure processing of sensitive data.

“The NCJ37x supports the digitalization trends of next-generation access systems with a very high level of security in the industry. A dedicated smart fob applet compatible with the CCC digital key protocol is the smart choice for designing the next-generation smart fobs. NXP’s NCJ37x is another step towards advancing security in smart connected cars.”

Rainer Lutz, Director Digital Key & NFC at NXP Semiconductors
More Details

The NCJ37x features the highly flexible Java Card Operating System (JCOP), Trust Provisioning service and secure over-the-air updatability. The SE enables enhanced Common Criteria EAL 6+ certified security for a broad range of automotive applications, including car access, driver authorization, CCC digital key, car-to-cloud (C2C) communication, and Qi 1.3 authentication. The passive, or powered-by-the-field, NFC interface is convenient as a backup if the fob battery is drained. With 600kb of secure flash it provides sufficient memory to allow a multi-service approach considering several active security domains and apps on the device.

For more information, visit: NCJ37x Automotive Secure Element | NXP Semiconductors.

Continue Reading: How Secure Elements Enhance Digital Keys

2022100802 / 08.10.2022 / Various / NXP Semiconductors /

NXP and ZF Collaborate on SiC-Based Traction Inverters to Boost Electric Vehicle Powertrains

NXP Introduces Automotive Secure Element for Smart Key Fobs
NXP’s first automotive-qualified Secure Element with NFC and wired interfaces for smart fobs for keyless entry and various security-critical applications helps increase the security of smart connected cars.

WEBINAR: Telematics Innovation: Opportunities & Challenges .. June 30th, 2020, 02:00 p.m. (CET)
As automotive telematics continues to enhance driving performance and experience, it’s creating opportunities for OEMs and the extended supply chain. We’re seeing huge amounts of innovation taking place in this field, helping to improve digital cockpits, in-vehicle connectivity, security and more.

WEBINAR: NXP Introduces New MIFARE DESFire EV3 IC
JUNE 16, 2020 | 60-MINUTE WEBINAR | 9:00 AM CEST

NXP Introduces MIFARE DESFire EV3 IC, Ushers In New Era of Security and Connectivity for Contactless Smart City Services
NXP Semiconductors today announced its new MIFARE DESFire EV3 IC that ushers in next-generation performance, advanced security and seamless integration of mobile services for a new era of security and connectivity in smart city services.

WEBINAR - Thu, May 14, 2020 6:00 PM - 7:00 PM CEST : Push Forward with the i.MX 8X Applications Processor for Automotive and Industrial Applications
NXP introduces the i.MX 8X applications processor to the mass market, the latest quad-core applications processor for secure, affordable and intelligent edge computing.

Company of the week

NeoCortec

Interesting video


electronica—Leading the way to the All Electric Society


GAMING, COMPUTER ACCESSORIES AND OTHER RELATED PRODUCTS


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE


Video Report from AMPER 2022


Address Book


NeoCortec


PULSIV


MikroElektronika d.o.o.


Panasonic Industry


Cambridge GaN Devices


Traco Power


BALLUFF


Seica


PEI-Genesis


KEYENCE


CML Microcircuits


SAMTEC


ams-OSRAM


INTEL


TDK Corporation


Giada


RS group


NOKIA


ANRITSU


Digi-Key Electronics


AERS


Flex Power Modules


Danisense


BINDER


Parker Hannifin


MOXA


DANFOSS


Alliance Memory


Intelliconnect (Europe) Ltd.


KIOXIA Europe GmbH



Calendary
intersec Dubai 2025, 14.-16.1.2025
DistribuTECH, 11.2.-13.2.2025, Dallas, TX
AMPER 2025, Brno, CZ, 18.-20.3.2025

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


naše portály dle jazyka:

česko/slovenská jazyková verze:
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIK-INFO.CZ

anglická jazyková verze:
WWW.ELECTRONICA.ONLINE
WWW.ELECTRONIC-INFO.EU
WWW.COMPONENTS.ONLINE

polská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIK-INFO.PL

ruská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/ru
WWW.ELEKTRONIK-INFO.RU
naše portály dle zaměření:

ELEKTRONIKA.ONLINE :
WWW.ELECTRONICA.ONLINE
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIKA.ONLINE/ru

ELEKTRONIK-INFO:
WWW.ELECTRONIC-INFO.EU
WWW.ELEKTRONIK-INFO.CZ
WWW.ELEKTRONIK-INFO.PL
WWW.ELEKTRONIK-INFO.RU

COMPONENTS:
WWW.COMPONENTS.ONLINE
  kontakt:

MALUTKI media s.r.o.
Těrlická 475/22
735 35 Horní Suchá
tel. 00420-603531605
e-mail: info@malutki-media.com



All trademarks are the property of their respective owners.
ISSN 1801-3813